M82108G13 Equivalent & Substitute Parts

Part Overview

The M82108G13 is a telecom interface IC manufactured by NXP Semiconductors, designed for telecommunications applications in a 672-TEPBGA (27x27) package. This component is classified as obsolete, making identification of functionally equivalent alternatives essential for system redesign, legacy support, or inventory replacement scenarios. The part operates under ROHS3 compliance with MSL 3 moisture sensitivity rating.

Substiute Parts

M82108G13

NXP SemiconductorsIn Stock: 915M82108G13 Datasheet

Current PartRFQ

LS1024ASN7ELA

NXP USA Inc.In Stock: 834LS1024ASN7ELA Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

The LS1024ASN7ELA is identified as a manufacturer-recommended substitute for the M82108G13. Substitution eligibility is determined by the following criteria:

• Manufacturer alignment: Both parts are NXP products, ensuring design continuity and support consistency
• Surface mount compatibility: Both utilize surface mount technology for PCB integration
• Regulatory compliance: Both maintain ROHS3 compliance and REACH unaffected status
• Moisture sensitivity: Both rated at MSL 3 (168 Hours), allowing equivalent handling and storage protocols
• Obsolescence context: Both parts share obsolete product status, indicating they are end-of-life components requiring planned replacement strategies

Parameter Comparison

Engineering Selection Recommendations

Selection between M82108G13 and LS1024ASN7ELA must account for the following factors based on provided specifications:

• Package footprint difference: The M82108G13 uses a larger 672-TEPBGA (27x27) package compared to the LS1024ASN7ELA 625-FCPBGA (21x21) package. PCB layout redesign may be required to accommodate the smaller footprint of the substitute part.

• Functional category distinction: The M82108G13 is classified as an interface component, while LS1024ASN7ELA is an embedded microprocessor. Functional equivalence must be validated against specific application requirements before substitution.

• Regulatory continuity: Both parts maintain identical RoHS3 compliance, MSL 3 rating, and REACH unaffected status, ensuring equivalent environmental and regulatory handling requirements.

• Obsolescence management: Both components are obsolete. Substitution decisions should be integrated into long-term component lifecycle management and supply chain planning.

Frequently Asked Questions (FAQ)

Q: Can LS1024ASN7ELA directly replace M82108G13 without PCB modifications?

A: No. The package footprints differ significantly (672-TEPBGA 27x27 versus 625-FCPBGA 21x21). PCB layout redesign is required. Additionally, functional category differences (interface versus embedded microprocessor) require application-level validation.

Q: Are storage and handling requirements identical between these parts?

A: Yes. Both parts carry MSL 3 (168 Hours) moisture sensitivity ratings, requiring identical storage conditions, handling protocols, and reflow procedures.

Q: Do both parts meet the same regulatory standards?

A: Yes. Both M82108G13 and LS1024ASN7ELA are ROHS3 compliant, REACH unaffected, and carry equivalent environmental certifications.

Q: Why is the M82108G13 marked as obsolete?

A: Obsolete status indicates the part is no longer manufactured or supported by NXP Semiconductors. Existing inventory may be available through authorized distributors, but long-term availability cannot be guaranteed.

Q: What should be considered before implementing this substitution?

A: Validate functional compatibility with application requirements, confirm PCB layout can accommodate the smaller 625-FCPBGA package, verify signal integrity with the new package geometry, and test thermal performance in the target application environment.