M2S090T-FGG676 Equivalent & Substitute Parts

Part Overview

The M2S090T-FGG676 is an ARM Cortex-M3 System On Chip (SOC) from Microchip Technology's SmartFusion2 product line. This embedded IC integrates a 166MHz processor with 90K logic modules FPGA fabric, 512KB flash memory, and 64KB RAM in a 676-FBGA package. The device is designed for applications requiring combined microcontroller and programmable logic functionality with comprehensive connectivity options including Ethernet, CAN, USB, and PCIe interfaces.

The part is currently in active production status with 738 units available in inventory. Identifying equivalent substitute parts is essential for supply chain continuity, design flexibility, and procurement optimization when the primary part number becomes unavailable or when alternative sourcing is required.

Substiute Parts

M2S090T-FGG676

Microchip TechnologyIn Stock: 813M2S090T-FGG676 Datasheet

Current PartRFQ

M2S090-FGG676

Microchip TechnologyIn Stock: 2264M2S090-FGG676 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the M2S090T-FGG676 is determined by strict equivalence across the following critical parameters:

Core Architecture Requirements: The substitute must utilize the same ARM Cortex-M3 processor core and SmartFusion2 series platform to ensure firmware and design compatibility.

Performance Specifications: Processor speed (166MHz), FPGA logic module count (90K), flash memory capacity (512KB), and RAM capacity (64KB) must be identical to maintain functional equivalence.

Physical and Electrical Interface: The package type (676-FBGA 27x27), I/O count (425 pins), and operating temperature range (0°C to 85°C) must match to ensure mechanical and thermal compatibility with existing PCB designs.

Compliance and Environmental Standards: RoHS3 compliance and MSL rating (3, 168 hours) must be maintained to satisfy regulatory and manufacturing process requirements.

The M2S090-FGG676 meets all substitution criteria as a parametric equivalent to the M2S090T-FGG676, differing only in the trailing designator character which does not affect electrical or mechanical specifications.

Parameter Comparison

Engineering Selection Recommendations

Both the M2S090T-FGG676 and M2S090-FGG676 are active production parts from Microchip Technology with full ROHS3 compliance and identical electrical and mechanical specifications. Selection between these parts should be based on the following factors:

Inventory Availability: The M2S090-FGG676 substitute offers significantly higher stock availability (2200 units versus 738 units), providing improved supply chain security for high-volume production or extended procurement cycles.

Compliance Status: Both parts maintain identical RoHS3 compliance and REACH unaffected status, ensuring regulatory requirements are satisfied regardless of which part number is selected.

Production Continuity: Both parts are in active product status with no planned obsolescence, supporting long-term design stability and manufacturing continuity.

Thermal and Environmental Ratings: Identical MSL ratings and operating temperature ranges ensure equivalent performance in manufacturing processes and field applications.

Frequently Asked Questions (FAQ)

Q: Can the M2S090-FGG676 be used as a direct replacement for the M2S090T-FGG676 in existing designs?

A: Yes. The M2S090-FGG676 is a parametric equivalent with identical processor core, clock speed, memory configuration, FPGA logic module count, package type, pin count, and operating specifications. No design modifications are required for substitution.

Q: What is the significance of the trailing "T" character in the M2S090T-FGG676 part number?

A: The trailing designator does not affect electrical or mechanical specifications. Both M2S090T-FGG676 and M2S090-FGG676 are functionally equivalent SmartFusion2 devices with identical performance characteristics.

Q: Are there any differences in PCB layout or footprint requirements between these part numbers?

A: No. Both parts use the identical 676-FBGA (27x27) package with 425 I/O pins. PCB footprints, solder pad layouts, and mechanical mounting requirements are identical.

Q: Do both parts support the same firmware and FPGA design files?

A: Yes. Both parts utilize the same ARM Cortex-M3 processor architecture and SmartFusion2 FPGA fabric. Firmware binaries and FPGA bitstreams compiled for one part number are compatible with the other.

Q: What are the moisture sensitivity considerations for these parts?

A: Both parts carry an MSL rating of 3 with a 168-hour floor life. Standard moisture control procedures during storage, handling, and assembly are required. Parts must be baked according to IPC standards if floor life is exceeded.

Q: Are there any thermal management differences between the two part numbers?

A: No. Both parts have identical operating temperature ranges (0°C to 85°C junction temperature) and thermal characteristics. Thermal design considerations and heat dissipation requirements are equivalent.

Q: Which part should be selected for new designs?

A: Either part is suitable for new designs. Selection should be based on current inventory availability and procurement lead times. The M2S090-FGG676 offers higher stock availability for immediate procurement needs.