M2S090-FG676 Equivalent & Substitute Parts

Part Overview

The M2S090-FG676 is an ARM Cortex-M3 System On Chip (SOC) from Microchip Technology's SmartFusion2 product line. This embedded IC integrates a 166MHz processor with 90K logic modules FPGA fabric, 512KB flash memory, and 64KB RAM in a 676-FBGA package. The device is currently in active production status and supports multiple connectivity standards including Ethernet, CAN, USB, and SPI interfaces. Identifying equivalent substitute parts is necessary when the primary part number becomes unavailable or when alternative compliance certifications are required for specific applications.

Substiute Parts

M2S090-FG676

Microchip TechnologyIn Stock: 743M2S090-FG676 Datasheet

Current PartRFQ

M2S090-FGG676

Microchip TechnologyIn Stock: 2264M2S090-FGG676 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the M2S090-FG676 is determined by strict equivalence across the following parameters: identical ARM Cortex-M3 core processor, matching 166MHz clock speed, equivalent 512KB flash and 64KB RAM configuration, identical 90K FPGA logic module count, and compatibility with the 676-FBGA (27x27) package footprint. The substitute part must maintain the same I/O count (425 pins), support the full connectivity feature set (Ethernet, CAN, USB, SPI, I2C, UART/USART, PCIe, SERDES), and operate within the specified temperature range of 0°C to 85°C. Substitutes are grouped based on these electrical and mechanical equivalencies, with variations permitted only in RoHS compliance status and inventory availability.

Parameter Comparison

Engineering Selection Recommendations

The M2S090-FGG676 is a direct parametric equivalent to the M2S090-FG676, with identical electrical specifications and package configuration. The primary distinction is RoHS compliance status: the M2S090-FGG676 meets ROHS3 requirements, while the M2S090-FG676 is non-compliant. Selection between these parts should be based on regulatory requirements applicable to the end application. Applications subject to RoHS3 directives or customer specifications requiring lead-free components must use the M2S090-FGG676. Applications without RoHS compliance mandates may use either part. Both devices maintain identical product status (Active), moisture sensitivity levels, and REACH compliance status. Inventory availability differs, with the M2S090-FGG676 currently showing higher stock levels (2200 pcs vs. 705 pcs).

Frequently Asked Questions (FAQ)

Q: Are M2S090-FG676 and M2S090-FGG676 pin-compatible? A: Yes. Both parts use the identical 676-FBGA (27x27) package with 425 I/O pins. PCB footprints and pinout assignments are identical.

Q: What is the difference between these two part numbers? A: The primary difference is RoHS compliance. The M2S090-FGG676 is ROHS3 compliant (lead-free), while the M2S090-FG676 is non-compliant. All electrical and functional specifications are identical.

Q: Can I substitute M2S090-FGG676 for M2S090-FG676 in existing designs? A: Yes, the M2S090-FGG676 is a direct substitute. No design changes are required. If your application or customer requires RoHS compliance, the M2S090-FGG676 is the appropriate choice.

Q: Do these parts have the same thermal characteristics? A: Yes. Both parts operate within the same temperature range (0°C to 85°C junction temperature) and have identical MSL ratings of 3 (168 hours).

Q: Are there any connectivity differences between these parts? A: No. Both parts support identical peripheral interfaces: Ethernet, CAN, USB, SPI, I2C, UART/USART, DDR, PCIe, and SERDES.

Q: Which part should I specify for new designs? A: Specify M2S090-FGG676 for new designs unless RoHS non-compliance is explicitly required. The ROHS3 compliant variant provides broader regulatory acceptance and is currently in higher inventory.