M2S060-FCS325I Equivalent & Substitute Parts

Part Overview

The M2S060-FCS325I is an ARM Cortex-M3 System On Chip (SOC) from Microchip Technology's SmartFusion2 product line. This embedded IC integrates a 166MHz processor with 60K logic modules FPGA fabric, 256KB flash memory, and 64KB RAM in a 325-ball FCBGA package. The device is designed for applications requiring combined microcontroller and programmable logic functionality with comprehensive connectivity options including Ethernet, CAN, USB, and serial interfaces.

The M2S060-FCS325I is classified as an active product. Equivalent substitute parts are available to address supply chain requirements, inventory optimization, and compliance specifications while maintaining full functional and electrical compatibility.

Substiute Parts

M2S060-FCS325I
Microchip TechnologyIn Stock: 1097M2S060-FCS325I Datasheet
M2S060-FCS325I
Current Part
M2S060-1FCSG325I
Microchip TechnologyIn Stock: 944M2S060-1FCSG325I Datasheet
M2S060-1FCSG325I
Parametric Equivalent
M2S060-FCSG325I
Microchip TechnologyIn Stock: 2118M2S060-FCSG325I Datasheet
M2S060-FCSG325I
Parametric Equivalent

Key Parameters

Parameter Specification
Core Processor ARM Cortex-M3
Speed 166MHz
FPGA Logic Modules 60K
Flash Memory 256KB
RAM Memory 64KB
Package Type 325-FCBGA (11x11)
Number of I/O 200
Operating Temperature Range -40°C to 100°C (TJ)
Moisture Sensitivity Level 3 (168 Hours)
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals DDR, PCIe, SERDES

Substitute Part Grouping Explanation

Substitute parts for the M2S060-FCS325I are qualified based on matching all critical electrical and mechanical parameters that define functional equivalence:

Substitution Criteria:

  • Identical core processor architecture (ARM Cortex-M3)
  • Matching processor speed (166MHz)
  • Identical FPGA logic module count (60K)
  • Matching memory configuration (256KB flash, 64KB RAM)
  • Identical package type and pin count (325-FCBGA, 11x11)
  • Matching I/O count (200 pins)
  • Identical operating temperature range (-40°C to 100°C)
  • Matching connectivity and peripheral feature sets
  • Equivalent moisture sensitivity level (MSL 3)

The substitute parts M2S060-1FCSG325I and M2S060-FCSG325I meet all these criteria and are direct functional equivalents suitable for board-level replacement without design modification.

Parameter Comparison

Parameter M2S060-FCS325I M2S060-1FCSG325I M2S060-FCSG325I
Manufacturer Microchip Technology Microchip Technology Microchip Technology
Series SmartFusion2 SmartFusion2 SmartFusion2
Core Processor ARM Cortex-M3 ARM Cortex-M3 ARM Cortex-M3
Speed 166MHz 166MHz 166MHz
FPGA Logic Modules 60K 60K 60K
Flash Memory 256KB 256KB 256KB
RAM Memory 64KB 64KB 64KB
Package Type 325-FCBGA (11x11) 325-FCBGA (11x11) 325-FCBGA (11x11)
Number of I/O 200 200 200
Operating Temperature -40°C to 100°C (TJ) -40°C to 100°C (TJ) -40°C to 100°C (TJ)
Moisture Sensitivity Level 3 (168 Hours) 3 (168 Hours) 3 (168 Hours)
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB CANbus, Ethernet, I2C, SPI, UART/USART, USB CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals DDR, PCIe, SERDES DDR, PCIe, SERDES DDR, PCIe, SERDES
Product Status Active Active Active
RoHS Status RoHS non-compliant ROHS3 Compliant ROHS3 Compliant
REACH Status REACH Unaffected REACH Unaffected REACH Unaffected

Engineering Selection Recommendations

All three parts are functionally equivalent and interchangeable at the board level. Selection between them should be based on compliance and regulatory requirements:

M2S060-FCS325I is suitable for applications where RoHS compliance is not a requirement or where legacy component specifications are mandated.

M2S060-1FCSG325I and M2S060-FCSG325I are ROHS3 compliant alternatives and are preferred for new designs, particularly those subject to environmental regulations or customer specifications requiring RoHS compliance. Both substitute parts maintain identical electrical performance and package compatibility.

Inventory availability may also influence selection. M2S060-FCSG325I currently has the highest stock level at 2100 pieces, followed by M2S060-FCS325I at 1023 pieces, and M2S060-1FCSG325I at 919 pieces.

Frequently Asked Questions (FAQ)

Q: Can M2S060-1FCSG325I and M2S060-FCSG325I be used as direct replacements for M2S060-FCS325I on existing PCBs?

A: Yes. All three parts share identical electrical specifications, pin configurations, and package dimensions (325-FCBGA, 11x11). No PCB redesign or layout modification is required for substitution.

Q: What is the difference between the three part numbers?

A: The primary difference is RoHS compliance status. M2S060-FCS325I is RoHS non-compliant, while M2S060-1FCSG325I and M2S060-FCSG325I are ROHS3 compliant. All other electrical and mechanical parameters are identical.

Q: Are there any performance differences between these parts?

A: No. All three parts have identical processor speed (166MHz), memory configuration (256KB flash, 64KB RAM), FPGA logic module count (60K), and peripheral feature sets. Performance is equivalent across all three variants.

Q: Which part should be selected for new product designs?

A: M2S060-1FCSG325I or M2S060-FCSG325I are recommended for new designs due to ROHS3 compliance. Selection between these two can be based on inventory availability and supply chain considerations, as they are electrically and mechanically identical.

Q: Are these parts pin-compatible?

A: Yes. All three parts use the 325-FCBGA (11x11) package with 200 I/O pins in identical positions. Pin compatibility is complete.

Q: What is the moisture sensitivity level, and does it differ between parts?

A: All three parts have MSL 3 rating with a 168-hour floor life. Moisture handling and storage requirements are identical across all variants.

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