M2S060-1FCS325I Equivalent & Substitute Parts

Part Overview

The M2S060-1FCS325I is an ARM Cortex-M3 System On Chip (SOC) from Microchip Technology's SmartFusion2 product line. This embedded IC integrates a 166MHz processor with 60K logic modules FPGA fabric, 256KB flash memory, and 64KB RAM in a 325-ball fine-pitch ball grid array package. The device is designed for applications requiring combined microcontroller and programmable logic functionality with comprehensive connectivity options including Ethernet, CAN, USB, and serial interfaces.

The M2S060-1FCS325I is classified as an active product. Equivalent substitute parts are available to address supply chain requirements, inventory optimization, and compliance specifications.

Key Parameters

Parameter	Value
Manufacturer	Microchip Technology
Core Processor	ARM Cortex-M3
Speed	166MHz
Flash Memory	256KB
RAM	64KB
FPGA Logic Modules	60K
Package Type	325-FCBGA (11x11)
Number of I/O	200
Operating Temperature	-40°C to 100°C (TJ)
Moisture Sensitivity Level	3 (168 Hours)
Series	SmartFusion2
Architecture	MCU, FPGA
Connectivity	CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals	DDR, PCIe, SERDES

Substitute Part Grouping Explanation

Substitute parts for the M2S060-1FCS325I are qualified based on identical electrical and mechanical parameters. The substitution criteria are strictly limited to the following parameters:

Core processor architecture and speed (ARM Cortex-M3, 166MHz)
Memory configuration (256KB flash, 64KB RAM)
FPGA logic module count (60K)
Package specification (325-FCBGA, 11x11 footprint)
I/O pin count (200)
Operating temperature range (-40°C to 100°C)
Moisture sensitivity level (MSL 3)
Connectivity and peripheral feature set

The identified substitute parts M2S060-1FCSG325I and M2S060-FCSG325I meet all electrical and mechanical requirements for direct substitution. Differences in RoHS compliance status and inventory levels do not affect functional compatibility.

Parameter Comparison

Parameter	M2S060-1FCS325I	M2S060-1FCSG325I	M2S060-FCSG325I
Manufacturer	Microchip Technology	Microchip Technology	Microchip Technology
Core Processor	ARM Cortex-M3	ARM Cortex-M3	ARM Cortex-M3
Speed	166MHz	166MHz	166MHz
Flash Memory	256KB	256KB	256KB
RAM	64KB	64KB	64KB
FPGA Logic Modules	60K	60K	60K
Package Type	325-FCBGA (11x11)	325-FCBGA (11x11)	325-FCBGA (11x11)
Number of I/O	200	200	200
Operating Temperature	-40°C to 100°C	-40°C to 100°C	-40°C to 100°C
Moisture Sensitivity Level	3 (168 Hours)	3 (168 Hours)	3 (168 Hours)
Series	SmartFusion2	SmartFusion2	SmartFusion2
Architecture	MCU, FPGA	MCU, FPGA	MCU, FPGA
Connectivity	CANbus, Ethernet, I2C, SPI, UART/USART, USB	CANbus, Ethernet, I2C, SPI, UART/USART, USB	CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals	DDR, PCIe, SERDES	DDR, PCIe, SERDES	DDR, PCIe, SERDES
RoHS Status	RoHS non-compliant	ROHS3 Compliant	ROHS3 Compliant
Product Status	Active	Active	Active

Engineering Selection Recommendations

All three parts are classified as active products from Microchip Technology and are electrically and mechanically identical. Selection between M2S060-1FCS325I and its substitutes should be based on the following factors:

RoHS Compliance: M2S060-1FCSG325I and M2S060-FCSG325I are ROHS3 compliant, while M2S060-1FCS325I is RoHS non-compliant. Applications subject to RoHS regulatory requirements must use the compliant variants.

Inventory Availability: M2S060-FCSG325I offers the highest inventory level (2100 units), followed by M2S060-1FCSG325I (919 units), and M2S060-1FCS325I (829 units). Supply chain considerations may favor the higher-inventory option.

Regulatory and Certification Status: All parts share identical REACH status (REACH Unaffected), ECCN classification (3A991D), and HTSUS code (8542.39.0001).

Frequently Asked Questions (FAQ)

Q: Can M2S060-1FCSG325I be used as a direct replacement for M2S060-1FCS325I?

A: Yes. Both parts are electrically and mechanically identical, with identical processor speed, memory configuration, FPGA logic module count, package specification, and I/O count. The primary difference is RoHS compliance status.

Q: What is the difference between M2S060-1FCS325I and M2S060-FCSG325I?

A: These parts are electrically and mechanically equivalent. Both feature the same ARM Cortex-M3 processor, 166MHz speed, 256KB flash, 64KB RAM, 60K FPGA logic modules, and 325-FCBGA package. M2S060-FCSG325I is ROHS3 compliant and has higher inventory availability.

Q: Are the package dimensions identical across all three parts?

A: Yes. All three parts use the 325-FCBGA (11x11) package specification with 200 I/O pins. PCB footprint and thermal characteristics are identical.

Q: Which part should be selected for new designs?

A: For new designs subject to RoHS regulations, M2S060-1FCSG325I or M2S060-FCSG325I are the appropriate selections. Both are ROHS3 compliant and functionally equivalent to the original part.

Q: Is there any performance difference between these parts?

A: No. All three parts operate at 166MHz with identical memory, FPGA resources, and peripheral functionality. Performance characteristics are identical.

Q: What is the moisture sensitivity level, and does it differ between parts?

A: All three parts have MSL 3 rating with a 168-hour floor life. Moisture handling and storage requirements are identical across all variants.

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