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M2S050TS-FCS325I Equivalent & Substitute Parts
Part Overview
The M2S050TS-FCS325I is an ARM Cortex-M3 System On Chip (SOC) from Microchip Technology's SmartFusion2 product line. This embedded IC integrates a 166MHz processor with 50K logic modules FPGA fabric, 256KB flash memory, and 64KB RAM in a 325-ball fine-pitch BGA package. The device is currently active in production and widely used in applications requiring mixed-signal processing with programmable logic capabilities. Identifying equivalent substitute parts becomes necessary when managing supply chain continuity, optimizing inventory costs, or addressing specific compliance requirements for end-use applications.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Technology |
| Core Processor | ARM Cortex-M3 |
| Speed | 166MHz |
| Flash Memory | 256KB |
| RAM Memory | 64KB |
| FPGA Logic Modules | 50K |
| Package Type | 325-FCBGA (11x11) |
| Number of I/O | 200 |
| Operating Temperature Range | -40°C to 100°C (TJ) |
| Moisture Sensitivity Level | 3 (168 Hours) |
| Series | SmartFusion2 |
Substitute Part Grouping Explanation
Substitution eligibility for the M2S050TS-FCS325I is determined by strict equivalence across the following critical parameters:
- Processor Architecture: ARM Cortex-M3 core at 166MHz
- Memory Configuration: 256KB flash and 64KB RAM
- FPGA Capacity: 50K logic modules
- Package Specification: 325-FCBGA (11x11) with 200 I/O pins
- Thermal Range: -40°C to 100°C junction temperature
- Connectivity & Peripherals: DDR, PCIe, SERDES, CANbus, Ethernet, I2C, SPI, UART/USART, USB
The M2S050-FCSG325I qualifies as a parametric equivalent because it maintains identical specifications across all functional and electrical parameters. Differences exist only in packaging designation (FCSG versus FCS) and compliance certifications, which do not affect core functionality or pin compatibility.
Parameter Comparison
| Parameter | M2S050TS-FCS325I | M2S050-FCSG325I | Match |
|---|---|---|---|
| Manufacturer | Microchip Technology | Microchip Technology | Yes |
| Core Processor | ARM Cortex-M3 | ARM Cortex-M3 | Yes |
| Speed (MHz) | 166 | 166 | Yes |
| Flash Memory (KB) | 256 | 256 | Yes |
| RAM Memory (KB) | 64 | 64 | Yes |
| FPGA Logic Modules | 50K | 50K | Yes |
| Package Type | 325-FCBGA (11x11) | 325-FCBGA (11x11) | Yes |
| Number of I/O | 200 | 200 | Yes |
| Operating Temperature (°C) | -40 to 100 | -40 to 100 | Yes |
| Moisture Sensitivity Level | 3 (168 Hours) | 3 (168 Hours) | Yes |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB | CANbus, Ethernet, I2C, SPI, UART/USART, USB | Yes |
| Peripherals | DDR, PCIe, SERDES | DDR, PCIe, SERDES | Yes |
| RoHS Status | RoHS non-compliant | ROHS3 Compliant | No |
| Product Status | Active | Active | Yes |
Engineering Selection Recommendations
Both the M2S050TS-FCS325I and M2S050-FCSG325I are functionally equivalent devices suitable for direct substitution in applications where the specified electrical and thermal parameters are required. Selection between these parts should be based on compliance requirements:
The M2S050TS-FCS325I is RoHS non-compliant and appropriate for applications without RoHS mandates or where legacy compliance status is acceptable.
The M2S050-FCSG325I is ROHS3 compliant and required for applications subject to RoHS Directive 2011/65/EU or equivalent regional regulations. This variant ensures compliance with lead-free and restricted substance requirements.
Both parts carry identical REACH Unaffected status and ECCN classification (3A991D), indicating no additional regulatory constraints for either variant. The choice between packaging designations (FCS versus FCSG) reflects manufacturing process differences that do not impact electrical performance, pin assignment, or thermal characteristics.
Frequently Asked Questions (FAQ)
Q: Can M2S050-FCSG325I be used as a direct replacement for M2S050TS-FCS325I?
A: Yes. Both parts are parametrically equivalent with identical processor architecture, memory configuration, FPGA capacity, package pinout, and thermal specifications. The primary difference is RoHS compliance status. Verify that your application's compliance requirements align with the selected variant before implementation.
Q: What is the difference between the FCS and FCSG package designations?
A: The package designations reflect different manufacturing processes and compliance certifications. FCS indicates the RoHS non-compliant variant, while FCSG indicates the ROHS3 compliant variant. Both use the same 325-FCBGA (11x11) physical package with identical pin assignments and electrical characteristics.
Q: Are there any thermal or electrical performance differences between these parts?
A: No. Both variants operate at 166MHz with identical -40°C to 100°C junction temperature range, memory specifications, and peripheral configurations. Thermal and electrical performance are equivalent.
Q: Which variant should I select for new designs?
A: For new designs, the M2S050-FCSG325I (ROHS3 compliant) is recommended unless your application explicitly requires non-compliant components or operates in a region without RoHS requirements. This ensures future regulatory alignment and supply chain flexibility.
Q: Are both parts currently in production?
A: Yes. Both the M2S050TS-FCS325I and M2S050-FCSG325I maintain Active product status with Microchip Technology and are available through authorized distribution channels.
Q: Do these parts require different PCB layouts or design considerations?
A: No. Identical package specifications (325-FCBGA 11x11), pin counts (200 I/O), and electrical characteristics mean both parts use the same PCB footprint and design approach. No layout modifications are required when substituting between variants.
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