M2S050-FGG896 Equivalent & Substitute Parts

Part Overview

The M2S050-FGG896 is an ARM Cortex-M3 System On Chip (SOC) from Microchip Technology's SmartFusion®2 product line. This embedded IC integrates a 166MHz processor with 50K logic modules FPGA, 256KB flash memory, and 64KB RAM in a 896-FBGA package. The device is currently in active production status and supports multiple connectivity standards including Ethernet, CANbus, USB, and SPI interfaces. Alternative package configurations exist to accommodate different board layout requirements and I/O pin count constraints.

Substiute Parts

M2S050-FGG896

Microchip TechnologyIn Stock: 1087M2S050-FGG896 Datasheet

Current PartRFQ

M2S050-FGG484

Microchip TechnologyIn Stock: 1140M2S050-FGG484 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

The M2S050-FGG896 has one parametric equivalent substitute: M2S050-FGG484. Both parts share identical core specifications including the same base product number (M2S050), processor architecture, clock speed, memory configuration, and peripheral set. The substitution is valid based on the following matching parameters:

• Identical ARM Cortex-M3 processor at 166MHz
• Identical FPGA configuration with 50K logic modules
• Identical flash memory (256KB) and RAM (64KB)
• Identical peripheral support (DDR, PCIe, SERDES, CANbus, Ethernet, I2C, SPI, UART/USART, USB)
• Identical operating temperature range (0°C ~ 85°C)
• Identical compliance certifications (ROHS3, REACH Unaffected)

The primary difference between these parts is the package configuration and resulting I/O pin count, which affects board layout and application requirements.

Parameter Comparison

Engineering Selection Recommendations

Both M2S050-FGG896 and M2S050-FGG484 are active production parts with identical compliance certifications (ROHS3 Compliant, REACH Unaffected). Selection between these parts depends on application-specific I/O requirements and PCB layout constraints. The M2S050-FGG896 provides 377 I/O pins in a 31x31mm BGA package, while the M2S050-FGG484 provides 267 I/O pins in a smaller 23x23mm BGA package. Applications requiring maximum I/O connectivity should use the 896-FBGA variant. Applications with space constraints or reduced I/O requirements should use the 484-FPBGA variant. Both parts maintain identical functional performance, memory configuration, and thermal specifications.

Frequently Asked Questions (FAQ)

Q: Can M2S050-FGG484 replace M2S050-FGG896 in existing designs?

A: Substitution is possible only if the application does not require more than 267 I/O pins. The M2S050-FGG484 provides 110 fewer I/O pins than the M2S050-FGG896. PCB layout and connector routing must be re-evaluated for the smaller 23x23mm package footprint.

Q: Are the processor performance and memory specifications identical between these parts?

A: Yes. Both parts feature identical ARM Cortex-M3 processors running at 166MHz, 50K FPGA logic modules, 256KB flash memory, and 64KB RAM. Functional performance is equivalent.

Q: What is the primary difference between these substitute parts?

A: The primary difference is the package configuration. The M2S050-FGG896 uses a 896-FBGA (31x31mm) package with 377 I/O pins, while the M2S050-FGG484 uses a 484-FPBGA (23x23mm) package with 267 I/O pins.

Q: Do both parts have the same compliance and certification status?

A: Yes. Both parts are ROHS3 compliant, REACH unaffected, and carry identical moisture sensitivity levels (MSL 3, 168 hours). Both are active production parts from Microchip Technology.

Q: What are the thermal operating ranges for these parts?

A: Both parts operate within the same temperature range of 0°C to 85°C (junction temperature).