M2S050-1FGG896 Equivalent & Substitute Parts

Part Overview

The M2S050-1FGG896 is an ARM Cortex-M3 System On Chip (SOC) from Microchip Technology's SmartFusion2 product line. This embedded IC integrates a 166MHz processor with 50K logic modules FPGA fabric, 256KB flash memory, and 64KB RAM in a 896-FBGA package. The device is actively produced and widely used in applications requiring integrated microcontroller and FPGA functionality with comprehensive connectivity options including Ethernet, CAN, USB, and PCIe interfaces.

Alternative models become necessary when design constraints require different package footprints, I/O pin counts, or board space optimization while maintaining identical core functionality and performance specifications.

Substiute Parts

M2S050-1FGG896

Microchip TechnologyIn Stock: 892M2S050-1FGG896 Datasheet

Current PartRFQ

M2S050-FGG484

Microchip TechnologyIn Stock: 1140M2S050-FGG484 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

The M2S050-1FGG896 has one parametric equivalent substitute: M2S050-FGG484. Both parts share identical core specifications including the ARM Cortex-M3 processor, 166MHz clock speed, 50K FPGA logic modules, 256KB flash, and 64KB RAM. The substitution is valid based on matching architecture, processor type, memory configuration, and performance characteristics.

The primary difference between these parts is the package format and resulting I/O pin count. The M2S050-1FGG896 uses a 896-FBGA (31x31mm) package with 377 I/O pins, while the M2S050-FGG484 uses a 484-FPBGA (23x23mm) package with 267 I/O pins. This distinction determines applicability based on board layout requirements and signal routing needs.

Parameter Comparison

Engineering Selection Recommendations

Both M2S050-1FGG896 and M2S050-FGG484 are active production parts with identical RoHS3 compliance and REACH unaffected status. Selection between these parts depends solely on PCB layout constraints and I/O requirements.

Choose M2S050-1FGG896 when maximum I/O pin availability (377 pins) is required for complex signal routing, high-speed interface implementation, or applications demanding extensive peripheral connectivity.

Choose M2S050-FGG484 when board space is constrained and the reduced I/O count (267 pins) is sufficient for the application. The smaller 23x23mm footprint enables more compact board designs while maintaining identical processor performance and FPGA capability.

Both parts carry identical electrical specifications, memory configuration, and thermal characteristics. Substitution is valid from a functional and compliance perspective; the decision is driven by physical layout and pin count requirements.

Frequently Asked Questions (FAQ)

Q: Are M2S050-1FGG896 and M2S050-FGG484 pin-compatible?

A: No. The M2S050-1FGG896 provides 377 I/O pins in a 896-FBGA package, while the M2S050-FGG484 provides 267 I/O pins in a 484-FPBGA package. PCB redesign is required for substitution due to different pin counts and package dimensions.

Q: Do both parts have identical processor performance?

A: Yes. Both parts use the same ARM Cortex-M3 core running at 166MHz with identical 50K FPGA logic modules, 256KB flash, and 64KB RAM. Processing capability and FPGA fabric are functionally equivalent.

Q: What are the package dimension differences?

A: The M2S050-1FGG896 uses a 31x31mm BGA package, while the M2S050-FGG484 uses a 23x23mm BGA package. The smaller package reduces board footprint by approximately 45% in area.

Q: Are there compliance or certification differences?

A: No. Both parts are ROHS3 compliant, REACH unaffected, and carry identical MSL ratings of 3 (168 hours). Regulatory and environmental compliance is identical.

Q: Which part should be selected for new designs?

A: Selection depends on application requirements. If I/O pin count of 267 is sufficient, the M2S050-FGG484 offers space savings. If more than 267 I/O pins are needed, the M2S050-1FGG896 is required.