M2S050-1FGG484 Equivalent & Substitute Parts

Part Overview

The M2S050-1FGG484 is an ARM Cortex-M3 System On Chip (SOC) from Microchip Technology's SmartFusion2 product line. This embedded IC integrates a 166MHz processor with 50K logic modules FPGA fabric, 256KB flash memory, and 64KB RAM in a 484-FPBGA package. The device is currently in active production status with full RoHS3 compliance and REACH unaffected designation. Substitute parts are identified when electrical specifications, memory configurations, processor architecture, and package formats remain identical across manufacturing batches or part number variants.

Substiute Parts

M2S050-1FGG484

Microchip TechnologyIn Stock: 1150M2S050-1FGG484 Datasheet

Current PartRFQ

M2S050-FGG484

Microchip TechnologyIn Stock: 1140M2S050-FGG484 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the M2S050-1FGG484 is determined by strict equivalence across the following critical parameters:

• Processor Architecture: ARM Cortex-M3 core at 166MHz
• Memory Configuration: 256KB flash and 64KB RAM
• FPGA Capacity: 50K logic modules
• Package Format: 484-FPBGA (23x23) with 267 I/O pins
• Thermal Range: 0°C to 85°C operating temperature
• Compliance Status: RoHS3 and REACH unaffected designation
• Connectivity Peripherals: DDR, PCIe, SERDES, CANbus, Ethernet, I2C, SPI, UART/USART, USB

The M2S050-FGG484 qualifies as a parametric equivalent because all electrical, memory, thermal, and package specifications are identical. The difference in part numbering reflects manufacturing batch or packaging variant designation only, with no functional or performance differentiation.

Parameter Comparison

Engineering Selection Recommendations

Both M2S050-1FGG484 and M2S050-FGG484 are active production devices from Microchip Technology with identical electrical and mechanical specifications. Selection between these parts may be based on:

• Inventory Availability: M2S050-1FGG484 (1051 pcs) and M2S050-FGG484 (1058 pcs) are both in stock
• Compliance Requirements: Both parts meet ROHS3 and REACH unaffected standards for regulated markets
• Supply Chain Continuity: Either part number may be selected without design modification or re-qualification
• Moisture Handling: Both parts carry MSL-3 rating requiring 168-hour dry storage before reflow

No functional differentiation exists between these part numbers. PCB layout, firmware, and system integration remain unchanged when substituting between them.

Frequently Asked Questions (FAQ)

Q: Can M2S050-FGG484 be used as a direct replacement for M2S050-1FGG484?

A: Yes. Both parts are parametrically equivalent with identical processor architecture, memory configuration, FPGA capacity, package format, and I/O count. No design changes are required.

Q: What causes the part number difference between M2S050-1FGG484 and M2S050-FGG484?

A: The difference reflects manufacturing batch or packaging variant designation. The base product number M2S050 remains constant, with suffix variations indicating different production runs or distribution channels. Electrical and functional specifications are identical.

Q: Are there thermal or operating condition differences between these parts?

A: No. Both parts operate across 0°C to 85°C junction temperature range with identical thermal characteristics and power delivery requirements.

Q: Do these parts require different PCB footprints or layout considerations?

A: No. Both use the 484-FPBGA (23x23) package with 267 I/O pins. PCB footprints, via placement, and signal routing remain unchanged.

Q: What is the MSL-3 rating and how does it affect handling?

A: MSL-3 (Moisture Sensitivity Level 3) requires parts to be stored in dry conditions and baked for 168 hours at specified temperature and humidity before reflow soldering. Both parts carry identical MSL-3 ratings.

Q: Are both parts RoHS3 compliant?

A: Yes. Both M2S050-1FGG484 and M2S050-FGG484 are ROHS3 compliant and REACH unaffected, meeting environmental regulations for EU and global markets.

Q: Can firmware or FPGA bitstreams be shared between these parts?

A: Yes. Identical processor architecture, memory configuration, and FPGA fabric specifications ensure complete compatibility of firmware, bootloaders, and FPGA designs.