M2S050-1FG896 Equivalent & Substitute Parts

Part Overview

The M2S050-1FG896 is an ARM Cortex-M3 System On Chip (SOC) from Microchip Technology's SmartFusion2 product line. This embedded IC integrates a 166MHz processor with 50K logic modules FPGA fabric, 256KB flash memory, and 64KB RAM in a 896-FBGA package. The device is currently active in production and widely used in applications requiring mixed-signal processing with programmable logic capabilities. Substitute parts are identified to address packaging constraints, inventory availability, or specific application requirements where pin count or form factor differences are acceptable.

Substiute Parts

M2S050-1FG896
Microchip TechnologyIn Stock: 1037M2S050-1FG896 Datasheet
M2S050-1FG896
Current Part
M2S050-FGG484
Microchip TechnologyIn Stock: 1140M2S050-FGG484 Datasheet
M2S050-FGG484
Parametric Equivalent

Key Parameters

Parameter Value
Manufacturer Microchip Technology
Base Product Number M2S050
Core Processor ARM Cortex-M3
Speed 166MHz
FPGA Logic Modules 50K
Flash Memory 256KB
RAM Memory 64KB
Operating Temperature 0°C ~ 85°C (TJ)
Architecture MCU, FPGA
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals DDR, PCIe, SERDES

Substitute Part Grouping Explanation

The M2S050-1FG896 and M2S050-FGG484 are parametric equivalents within the SmartFusion2 family. Both devices share the same base product number (M2S050), identical processor architecture, clock speed, memory configuration, and peripheral set. The primary difference is packaging: the main part uses a 896-FBGA (31x31) package with 377 I/O pins, while the substitute uses a 484-FPBGA (23x23) package with 267 I/O pins.

Substitution is valid when:

  • Application circuit design accommodates the reduced I/O pin count (267 vs 377 pins)
  • PCB layout can accommodate the smaller package footprint (23x23 vs 31x31)
  • All required functional peripherals are accessible within the available I/O allocation
  • Thermal and power distribution requirements are met with the smaller package

Parameter Comparison

Parameter M2S050-1FG896 M2S050-FGG484
Manufacturer Microchip Technology Microchip Technology
Series SmartFusion2 SmartFusion2
Core Processor ARM Cortex-M3 ARM Cortex-M3
Speed 166MHz 166MHz
FPGA Logic Modules 50K 50K
Flash Memory 256KB 256KB
RAM Memory 64KB 64KB
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Architecture MCU, FPGA MCU, FPGA
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals DDR, PCIe, SERDES DDR, PCIe, SERDES
Package / Case 896-BGA (31x31) 484-BGA (23x23)
Number of I/O 377 267
Product Status Active Active
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
ECCN 3A991D 3A991D
HTSUS 8542.39.0001 8542.39.0001

Engineering Selection Recommendations

Both parts are active products from Microchip Technology with identical functional specifications. The M2S050-FGG484 offers RoHS3 compliance, while the M2S050-1FG896 is RoHS non-compliant. Selection between these parts depends on regulatory requirements and application constraints:

  • Select M2S050-1FG896 when maximum I/O availability (377 pins) is required and RoHS compliance is not a constraint.
  • Select M2S050-FGG484 when RoHS3 compliance is mandatory, PCB space is limited, or the application requires fewer than 267 I/O connections.

Both devices maintain identical electrical performance, memory configuration, and peripheral functionality. The choice is driven by packaging requirements and compliance certifications rather than functional capability.

Frequently Asked Questions (FAQ)

Q: Can M2S050-FGG484 replace M2S050-1FG896 in existing designs?

A: Substitution is possible only if the application design uses 267 or fewer I/O pins and the PCB layout accommodates the smaller 23x23mm package footprint. Pin mapping must be verified against the specific application schematic.

Q: What is the primary difference between these two parts?

A: The main difference is packaging. M2S050-1FG896 uses a 896-pin BGA package (31x31mm) with 377 I/O pins, while M2S050-FGG484 uses a 484-pin BGA package (23x23mm) with 267 I/O pins. All processor, memory, and peripheral specifications are identical.

Q: Are there compliance differences between these parts?

A: Yes. M2S050-FGG484 is RoHS3 compliant, while M2S050-1FG896 is RoHS non-compliant. Both are REACH unaffected and share the same ECCN and HTSUS classifications.

Q: Do both parts support the same connectivity options?

A: Yes. Both parts support CANbus, Ethernet, I2C, SPI, UART/USART, and USB connectivity, plus DDR, PCIe, and SERDES peripherals.

Q: What is the moisture sensitivity level for both parts?

A: Both parts have MSL 3 rating with a 168-hour floor life requirement.

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