M2S025TS-FGG484I Equivalent & Substitute Parts

Part Overview

The M2S025TS-FGG484I is an ARM Cortex-M3 System On Chip (SOC) from Microchip Technology's SmartFusion2 product line. This embedded IC integrates a 166MHz processor with 25K logic modules FPGA fabric, 256KB flash memory, and 64KB RAM in a 484-FPBGA package. The device is currently in active production status with 963 units available in inventory. Substitute parts are identified when electrical specifications, memory configurations, package types, and thermal ratings remain identical across manufacturing batches or minor part number variations.

Substiute Parts

M2S025TS-FGG484I

Microchip TechnologyIn Stock: 1062M2S025TS-FGG484I Datasheet

Current PartRFQ

M2S025-FGG484I

Microchip TechnologyIn Stock: 873M2S025-FGG484I Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the M2S025TS-FGG484I is determined by strict equivalence across the following critical parameters:

• Processor Architecture: ARM Cortex-M3 core at 166MHz
• Memory Configuration: 256KB flash and 64KB RAM
• FPGA Capacity: 25K logic modules
• Package Specification: 484-FPBGA (23x23) with 267 I/O pins
• Thermal Rating: -40°C to 100°C junction temperature
• Compliance: ROHS3 and REACH status
• Moisture Sensitivity: MSL 3 classification

The M2S025-FGG484I qualifies as a parametric equivalent because all electrical specifications, memory sizes, FPGA resources, package dimensions, pin count, and environmental ratings are identical. The difference in part number suffix (TS vs. standard) reflects manufacturing batch or packaging variation within the same product specification.

Parameter Comparison

Engineering Selection Recommendations

Both the M2S025TS-FGG484I and M2S025-FGG484I are active production devices from Microchip Technology with identical electrical and mechanical specifications. Selection between these parts should be based on inventory availability and supply chain requirements. Both devices carry ROHS3 compliance and REACH unaffected status, meeting current environmental and regulatory standards. The 484-FPBGA package requires BGA assembly and rework capabilities. Thermal management design should account for the -40°C to 100°C operating range. No functional differences exist between these part numbers; they are direct substitutes at the component level.

Frequently Asked Questions (FAQ)

Q: Can M2S025-FGG484I replace M2S025TS-FGG484I in existing designs?

A: Yes. Both parts are parametric equivalents with identical processor speed, memory configuration, FPGA capacity, package type, pin count, and thermal ratings. No design changes are required.

Q: What does the "TS" suffix in M2S025TS-FGG484I indicate?

A: The TS suffix represents a manufacturing batch or packaging variation. The electrical and functional specifications remain identical to the base M2S025-FGG484I part number.

Q: Are there any differences in pin assignment or I/O configuration?

A: No. Both parts feature 267 I/O pins in the same 484-FPBGA (23x23) package with identical pinout.

Q: What are the storage and handling requirements for these devices?

A: Both parts carry MSL 3 rating with a 168-hour moisture sensitivity window. Standard ESD precautions and dry storage conditions apply to BGA components.

Q: Can these parts be used interchangeably in PCB assembly?

A: Yes. Identical package specifications, pin assignments, and thermal characteristics allow direct substitution without PCB redesign or assembly process modification.

Q: What compliance certifications apply to both parts?

A: Both M2S025TS-FGG484I and M2S025-FGG484I are ROHS3 compliant and REACH unaffected, meeting current environmental regulations.