M2S025T-FGG484I Equivalent & Substitute Parts

Part Overview

The M2S025T-FGG484I is an ARM Cortex-M3 System On Chip (SOC) from Microchip Technology's SmartFusion2 product line. This embedded IC integrates a 166MHz processor with 25K logic modules FPGA fabric, 256KB flash memory, and 64KB RAM in a 484-FPBGA package. The device is actively produced and widely deployed in applications requiring mixed-signal processing with programmable logic capabilities. Identifying equivalent and substitute parts is essential for supply chain continuity, design flexibility, and procurement optimization.

Substiute Parts

M2S025T-FGG484I

Microchip TechnologyIn Stock: 914M2S025T-FGG484I Datasheet

Current PartRFQ

M2S025-FGG484I

Microchip TechnologyIn Stock: 873M2S025-FGG484I Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the M2S025T-FGG484I is determined by strict equivalence across the following critical parameters:

• Processor Architecture: ARM Cortex-M3 core at 166MHz
• Memory Configuration: 256KB flash and 64KB RAM
• FPGA Capacity: 25K logic modules
• Package Specification: 484-FPBGA (23x23) with 267 I/O pins
• Thermal Range: -40°C to 100°C junction temperature
• Compliance Standards: ROHS3, MSL 3 rating, REACH Unaffected status

Parts meeting all these parameters are classified as parametric equivalents and direct substitutes. Variations in any core parameter disqualify a part from substitution without design re-validation.

Parameter Comparison

Engineering Selection Recommendations

The M2S025-FGG484I is a direct parametric equivalent to the M2S025T-FGG484I. Both parts share identical electrical specifications, memory configuration, FPGA capacity, and package geometry. Selection between these parts is based on availability and procurement status rather than technical differentiation.

Both parts maintain Active product status from Microchip Technology, ensuring continued manufacturing support and supply availability. ROHS3 compliance and REACH Unaffected designation confirm regulatory alignment for industrial and commercial applications. MSL 3 rating requires standard moisture control during storage and handling per IPC-A-610 standards.

Frequently Asked Questions (FAQ)

Q: Can M2S025-FGG484I replace M2S025T-FGG484I in existing designs?

A: Yes. Both parts are parametric equivalents with identical processor speed, memory, FPGA capacity, package type, and I/O configuration. No design modifications are required for direct substitution.

Q: Are there any differences in thermal performance between these parts?

A: No. Both parts operate across the same junction temperature range (-40°C to 100°C) and share identical thermal characteristics.

Q: What is the significance of the package designation 484-FPBGA (23x23)?

A: This specifies a Fine-Pitch Ball Grid Array with 484 solder balls arranged in a 23x23 millimeter footprint. Both equivalent parts use this identical package, ensuring PCB layout and assembly compatibility.

Q: Are moisture sensitivity considerations the same for both parts?

A: Yes. Both parts carry MSL 3 rating with a 168-hour floor life. Identical moisture control and handling procedures apply to both.

Q: Does ROHS3 compliance affect substitution eligibility?

A: ROHS3 compliance is a regulatory requirement met by both parts. It does not restrict substitution but confirms environmental compliance for regulated markets.