M2S010T-FGG484 Equivalent & Substitute Parts

Part Overview

The M2S010T-FGG484 is an ARM Cortex-M3 System On Chip (SOC) from Microchip Technology's SmartFusion®2 product line. This embedded IC integrates a 166MHz processor with 10K logic modules FPGA fabric, 256KB flash memory, and 64KB RAM in a 484-FPBGA package. The device supports multiple connectivity standards including Ethernet, CAN, USB, SPI, I2C, and UART/USART interfaces, making it suitable for industrial and embedded applications requiring both processing and programmable logic capabilities. As an active product with ROHS3 compliance and REACH unaffected status, the M2S010T-FGG484 remains in production. Identifying equivalent parts becomes necessary when managing supply chain continuity, optimizing inventory levels, or addressing component availability constraints.

Substiute Parts

M2S010T-FGG484

Microchip TechnologyIn Stock: 1152M2S010T-FGG484 Datasheet

Current PartRFQ

M2S010-FGG484

Microchip TechnologyIn Stock: 3435M2S010-FGG484 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the M2S010T-FGG484 is determined by strict equivalence across the following critical parameters:

• Processor Architecture: ARM Cortex-M3 core at 166MHz
• Memory Configuration: 256KB flash and 64KB RAM
• FPGA Capacity: 10K logic modules
• Package Specification: 484-FPBGA (23x23) with 233 I/O pins
• Connectivity Suite: DDR, PCIe, SERDES peripherals; CANbus, Ethernet, I2C, SPI, UART/USART, USB interfaces
• Environmental Compliance: ROHS3 compliance and REACH unaffected status
• Thermal Rating: 0°C ~ 85°C operating temperature range

The M2S010-FGG484 meets all substitution criteria as a parametric equivalent within the SmartFusion®2 series.

Parameter Comparison

Engineering Selection Recommendations

Both the M2S010T-FGG484 and M2S010-FGG484 are active products from Microchip Technology with identical electrical and mechanical specifications. Selection between these parts should be based on inventory availability and supply chain requirements. The M2S010-FGG484 currently maintains higher inventory levels (3400 pcs) compared to the M2S010T-FGG484 (1121 pcs), making it suitable for applications requiring immediate component procurement. Both parts carry ROHS3 compliance and REACH unaffected status, ensuring regulatory alignment for industrial and commercial deployments. MSL rating of 3 applies to both variants, requiring standard moisture control during storage and handling per IPC-A-610 guidelines.

Frequently Asked Questions (FAQ)

Q: Are M2S010T-FGG484 and M2S010-FGG484 pin-compatible?

A: Yes. Both parts use the 484-FPBGA (23x23) package with 233 I/O pins. PCB layout and footprint requirements are identical.

Q: Can M2S010-FGG484 replace M2S010T-FGG484 in existing designs?

A: Yes. The parts are parametric equivalents with matching processor speed, memory configuration, FPGA capacity, and peripheral interfaces. No design modifications are required.

Q: What is the difference between the two part numbers?

A: The parts are functionally identical. The difference in part number designation does not reflect electrical or mechanical variations. Both are SmartFusion®2 devices with identical specifications.

Q: Are there any thermal or environmental differences?

A: No. Both parts operate across the same temperature range (0°C ~ 85°C) and carry identical MSL rating of 3 (168 Hours).

Q: Which part should be selected for new designs?

A: Either part is suitable for new designs. Selection should be based on current inventory availability and supplier lead times. Both maintain active product status with ongoing manufacturer support.

Q: Do both parts require the same PCB assembly handling procedures?

A: Yes. Both parts carry MSL 3 rating and require identical moisture control, storage, and reflow soldering procedures per IPC standards.