M25PE40-VMP6G Equivalent & Substitute Parts

Part Overview

The M25PE40-VMP6G is a 4Mbit NOR Flash memory IC manufactured by Micron Technology Inc., featuring SPI interface operation at 75 MHz with 8-VDFN packaging. This component is classified as obsolete, making equivalent substitute parts necessary for new designs and ongoing production requirements. The part operates across industrial temperature ranges (-40°C to 85°C) and is RoHS3 compliant.

Substiute Parts

M25PE40-VMP6G
Micron Technology Inc.In Stock: 1198M25PE40-VMP6G Datasheet
M25PE40-VMP6G
Current Part
MX25L4006EZNI-12G
MacronixIn Stock: 115513MX25L4006EZNI-12G Datasheet
MX25L4006EZNI-12G
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SST25VF040B-50-4I-QAE
Microchip TechnologyIn Stock: 1036SST25VF040B-50-4I-QAE Datasheet
SST25VF040B-50-4I-QAE
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SST25VF040B-50-4I-QAE-T
Microchip TechnologyIn Stock: 1201SST25VF040B-50-4I-QAE-T Datasheet
SST25VF040B-50-4I-QAE-T
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W25X40CLZPIG
Winbond ElectronicsIn Stock: 32130W25X40CLZPIG Datasheet
W25X40CLZPIG
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Key Parameters

Parameter Value
Memory Size 4Mbit
Memory Organization 512K x 8
Memory Interface SPI
Clock Frequency 75 MHz
Voltage Supply Range 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C
Package Type 8-VDFN Exposed Pad (6x5)
Write Cycle Time (Page) 3ms
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility for the M25PE40-VMP6G is determined by the following mandatory parameters:

  • Memory capacity: 4Mbit (512K x 8 organization)
  • Interface protocol: SPI
  • Supply voltage range: 2.7V ~ 3.6V minimum compatibility
  • Operating temperature range: -40°C ~ 85°C minimum coverage
  • Package footprint: 8-pin WSON/WDFN with 6x5mm dimensions
  • RoHS3 compliance requirement

All substitute parts listed meet these core electrical and mechanical requirements. Variations in clock frequency (50 MHz to 104 MHz) and write cycle times remain within acceptable operational parameters for SPI Flash memory applications.

Parameter Comparison

Parameter M25PE40-VMP6G (Micron) MX25L4006EZNI-12G (Macronix) SST25VF040B-50-4I-QAE (Microchip) SST25VF040B-50-4I-QAE-T (Microchip) W25X40CLZPIG (Winbond)
Memory Size 4Mbit 4Mbit 4Mbit 4Mbit 4Mbit
Memory Organization 512K x 8 512K x 8 512K x 8 512K x 8 512K x 8
Memory Interface SPI SPI SPI SPI SPI
Clock Frequency 75 MHz 86 MHz 50 MHz 50 MHz 104 MHz
Voltage Supply Range 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.3V ~ 3.6V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C
Package Type 8-VDFN (6x5) 8-WSON (6x5) 8-WSON (6x5) 8-WSON (6x5) 8-WSON (6x5)
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Product Status Obsolete Active Active Active Active

Engineering Selection Recommendations

All four substitute parts are classified as active products with current manufacturing support, addressing the obsolescence status of the M25PE40-VMP6G. Selection criteria should prioritize:

MX25L4006EZNI-12G (Macronix): Highest clock frequency at 86 MHz with active product status and ROHS3 compliance. Suitable for applications requiring performance matching or exceeding the original specification.

SST25VF040B-50-4I-QAE and SST25VF040B-50-4I-QAE-T (Microchip): Both variants offer the lowest moisture sensitivity level (MSL 1, Unlimited) compared to the original part (MSL 3). The -QAE-T variant provides tape and reel packaging for automated assembly. Clock frequency of 50 MHz remains compatible with legacy designs.

W25X40CLZPIG (Winbond): Highest clock frequency at 104 MHz with extended lower voltage support (2.3V minimum). Suitable for power-constrained applications requiring maximum performance headroom.

All substitutes maintain identical memory capacity, organization, and SPI interface protocol. Package footprints are mechanically compatible (8-pin WSON/WDFN 6x5mm).

Frequently Asked Questions (FAQ)

Q: Are all substitute parts pin-compatible with the M25PE40-VMP6G?

A: All substitute parts use 8-pin WSON or WDFN packages with 6x5mm footprints. Pin assignments for SPI interface (CS, CLK, MOSI, MISO, VCC, GND) are standardized across these parts. Physical PCB layout compatibility is confirmed.

Q: What is the difference between VDFN and WSON packaging?

A: Both package types are mechanically equivalent 8-pin configurations with exposed pads. VDFN (Very Thin Dual Flat No-lead) and WSON (Wafer-level Chip Scale Package) differ in manufacturing process but maintain identical footprint dimensions and thermal characteristics for this application.

Q: Can I use a substitute with lower clock frequency (50 MHz) in place of the 75 MHz original?

A: Yes. The SST25VF040B variants operate at 50 MHz, which is lower than the original 75 MHz specification. This substitution is valid for applications where the lower clock frequency does not impact system timing requirements. Verify that your SPI bus controller supports operation at 50 MHz.

Q: Which substitute offers the best long-term availability?

A: All four substitutes are classified as active products. Macronix (MX25L4006EZNI-12G), Microchip (SST25VF040B series), and Winbond (W25X40CLZPIG) are established manufacturers with ongoing production. Inventory levels vary; consult current distributor stock for procurement planning.

Q: Are there voltage supply differences I should consider?

A: The W25X40CLZPIG supports a lower minimum voltage (2.3V) compared to other substitutes (2.7V minimum). This provides additional operational margin in power-constrained designs. All parts support the standard 3.3V and 3.6V supply levels.

Q: What is the significance of MSL (Moisture Sensitivity Level) differences?

A: The original M25PE40-VMP6G has MSL 3 (168 hours), requiring controlled storage conditions. The SST25VF040B variants offer MSL 1 (unlimited), eliminating moisture sensitivity concerns during storage and handling. This reduces production risk for high-volume manufacturing.

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