M25P40-VMP6TG TR Equivalent & Substitute Parts

Part Overview

The M25P40-VMP6TG TR is a 4Mbit NOR Flash memory IC manufactured by Micron Technology Inc., featuring SPI interface operation at 50 MHz. This component is classified as obsolete, making equivalent substitute parts necessary for ongoing design support and production continuity. The part is packaged in 8-VDFPN (6x5) format with Tape & Reel packaging and operates across the industrial temperature range of -40°C to 85°C.

Substiute Parts

M25P40-VMP6TG TR
Micron Technology Inc.In Stock: 968M25P40-VMP6TG TR Datasheet
M25P40-VMP6TG TR
Current Part
MX25L4006EZNI-12G
MacronixIn Stock: 115513MX25L4006EZNI-12G Datasheet
MX25L4006EZNI-12G
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SST25VF040B-50-4I-QAE
Microchip TechnologyIn Stock: 1036SST25VF040B-50-4I-QAE Datasheet
SST25VF040B-50-4I-QAE
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SST25VF040B-50-4I-QAE-T
Microchip TechnologyIn Stock: 1201SST25VF040B-50-4I-QAE-T Datasheet
SST25VF040B-50-4I-QAE-T
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W25X40CLZPIG
Winbond ElectronicsIn Stock: 32130W25X40CLZPIG Datasheet
W25X40CLZPIG
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Key Parameters

Parameter Value
Memory Size 4Mbit
Memory Organization 512K x 8
Memory Interface SPI
Clock Frequency 50 MHz
Voltage Supply Range 2.3V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Package Type 8-VDFN Exposed Pad
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitute parts for the M25P40-VMP6TG TR are selected based on the following critical parameters that determine functional compatibility:

Core Compatibility Criteria:

  • Memory Size: 4Mbit (fixed requirement)
  • Memory Organization: 512K x 8 (fixed requirement)
  • Memory Interface: SPI (fixed requirement)
  • Operating Temperature Range: -40°C ~ 85°C (fixed requirement)
  • Voltage Supply Range: Minimum 2.3V support required
  • Package Type: 8-pin WDFN/VDFN with exposed pad (mechanical compatibility)
  • Surface Mount configuration (assembly compatibility)

All substitute parts listed meet these core criteria. Variations in clock frequency, write cycle time, and specific packaging designations (WSON vs. VDFPN) represent performance enhancements or equivalent mechanical footprints that do not compromise functional substitution.

Parameter Comparison

Parameter M25P40-VMP6TG TR (Main) MX25L4006EZNI-12G SST25VF040B-50-4I-QAE SST25VF040B-50-4I-QAE-T W25X40CLZPIG
Manufacturer Micron Technology Macronix Microchip Technology Microchip Technology Winbond Electronics
Memory Size 4Mbit 4Mbit 4Mbit 4Mbit 4Mbit
Memory Organization 512K x 8 512K x 8 512K x 8 512K x 8 512K x 8
Memory Interface SPI SPI SPI SPI SPI
Clock Frequency 50 MHz 86 MHz 50 MHz 50 MHz 104 MHz
Voltage Supply Range 2.3V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.3V ~ 3.6V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C
Package Type 8-VDFN Exposed Pad 8-WDFN Exposed Pad 8-WDFN Exposed Pad 8-WDFN Exposed Pad 8-WDFN Exposed Pad
Packaging Format Tape & Reel (TR) Tray Tube Tape & Reel (TR) Tube
Product Status Obsolete Active Active Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

Primary Substitutes (Highest Compatibility):

SST25VF040B-50-4I-QAE and SST25VF040B-50-4I-QAE-T (Microchip Technology) provide direct functional equivalence with identical clock frequency (50 MHz) and matching voltage supply range (2.7V ~ 3.6V). Both parts maintain active product status and ROHS3 compliance. The tape & reel variant (SST25VF040B-50-4I-QAE-T) aligns with the original packaging format of the M25P40-VMP6TG TR.

Performance-Enhanced Substitutes:

MX25L4006EZNI-12G (Macronix) and W25X40CLZPIG (Winbond Electronics) offer higher clock frequencies (86 MHz and 104 MHz respectively) while maintaining all core functional parameters. Both are active products with ROHS3 compliance. W25X40CLZPIG supports the lower voltage threshold (2.3V) matching the original part specification.

Compliance Considerations:

All substitute parts maintain ROHS3 compliance and REACH unaffected status, consistent with the original M25P40-VMP6TG TR. Moisture sensitivity levels vary (MSL 1 for Microchip variants, MSL 3 for Macronix and Winbond), which may affect storage and handling requirements.

Frequently Asked Questions (FAQ)

Q: Can I use a substitute part with higher clock frequency than the original 50 MHz specification?

A: Yes. MX25L4006EZNI-12G (86 MHz) and W25X40CLZPIG (104 MHz) are functionally compatible substitutes. Higher clock frequency capability does not prevent operation at lower frequencies. System design must accommodate the substitute part's electrical characteristics, but backward compatibility is maintained.

Q: What is the difference between 8-VDFN and 8-WDFN packaging?

A: Both designations refer to 8-pin Wafer-level Dual Flat No-lead packages with exposed pad in 6x5mm form factor. The mechanical footprint and pin configuration are equivalent for PCB assembly purposes. VDFN and WDFN are manufacturer-specific nomenclature for the same package class.

Q: Does the voltage supply range difference (2.3V vs. 2.7V minimum) affect substitution?

A: The M25P40-VMP6TG TR operates at 2.3V ~ 3.6V. Substitutes with 2.7V ~ 3.6V range (MX25L4006EZNI-12G and SST25VF040B variants) are compatible if system supply voltage remains above 2.7V. W25X40CLZPIG maintains the 2.3V minimum threshold, providing full voltage range compatibility.

Q: What is the impact of different write cycle times on system design?

A: Write cycle time variations (5ms page write for M25P40 vs. 3ms for MX25L4006 or 10µs for SST25VF040) affect data programming duration but do not prevent functional substitution. System firmware must accommodate the substitute part's write timing specifications.

Q: Are all substitute parts available in Tape & Reel packaging?

A: SST25VF040B-50-4I-QAE-T is available in Tape & Reel format matching the original packaging. MX25L4006EZNI-12G, SST25VF040B-50-4I-QAE, and W25X40CLZPIG are supplied in Tray or Tube formats. Packaging format selection depends on production volume and assembly line requirements.

Q: What is the significance of MSL (Moisture Sensitivity Level) differences?

A: Microchip variants carry MSL 1 (unlimited shelf life), while Macronix and Winbond parts carry MSL 3 (168-hour limit after moisture exposure). MSL 3 components require controlled storage conditions and baking procedures before reflow soldering if moisture absorption occurs.

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