M25P10-AVMN6PYA Equivalent & Substitute Parts

Part Overview

The M25P10-AVMN6PYA is a 1Mbit NOR Flash memory IC manufactured by Micron Technology Inc., designed for SPI serial interface applications operating at 50 MHz. This component features 128K x 8 memory organization in an 8-SOIC surface mount package and operates across a supply voltage range of 2.3V to 3.6V with an operating temperature range of -40°C to 85°C.

The M25P10-AVMN6PYA is classified as obsolete. Equivalent substitute parts are necessary to maintain system functionality and ensure continued availability for new designs and production requirements.

Key Parameters

Parameter	Value
Memory Size	1Mbit
Memory Organization	128K x 8
Memory Interface	SPI
Clock Frequency	50 MHz
Voltage Supply Range	2.3V ~ 3.6V
Operating Temperature	-40°C ~ 85°C
Package Type	8-SOIC (0.154", 3.90mm Width)
Write Cycle Time (Page)	5ms
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level	3 (168 Hours)

Substitute Part Grouping Explanation

Substitute parts for the M25P10-AVMN6PYA are qualified based on the following critical parameters:

Memory capacity: 1Mbit
Memory organization: 128K x 8
Interface protocol: SPI
Supply voltage compatibility: 2.3V ~ 3.6V
Operating temperature range: -40°C ~ 85°C
Package type: 8-SOIC with matching physical dimensions
RoHS3 compliance and MSL rating: 3 (168 Hours)

The W25X10CLSNIG from Winbond Electronics meets all substitution criteria. While this part operates at a higher clock frequency (104 MHz versus 50 MHz), it maintains full backward compatibility with the M25P10-AVMN6PYA in applications requiring the specified memory capacity, interface, voltage range, and temperature specifications.

Parameter Comparison

Parameter	M25P10-AVMN6PYA (Micron)	W25X10CLSNIG (Winbond)
Memory Size	1Mbit	1Mbit
Memory Organization	128K x 8	128K x 8
Memory Interface	SPI	SPI
Clock Frequency	50 MHz	104 MHz
Voltage Supply Range	2.3V ~ 3.6V	2.3V ~ 3.6V
Operating Temperature	-40°C ~ 85°C	-40°C ~ 85°C
Package Type	8-SOIC (0.154", 3.90mm Width)	8-SOIC (0.154", 3.90mm Width)
Write Cycle Time (Page)	5ms	800µs
Product Status	Obsolete	Active
RoHS Status	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level	3 (168 Hours)	3 (168 Hours)

Engineering Selection Recommendations

The W25X10CLSNIG is a direct functional substitute for the M25P10-AVMN6PYA. Both components share identical memory capacity, organization, interface protocol, supply voltage range, operating temperature specifications, package dimensions, and compliance certifications.

The W25X10CLSNIG offers superior performance characteristics with a maximum clock frequency of 104 MHz and reduced page write cycle time of 800µs compared to the M25P10-AVMN6PYA specifications. The W25X10CLSNIG maintains active product status with verified programmability support, ensuring long-term availability and supply chain continuity.

Both parts are ROHS3 compliant with identical MSL ratings of 3 (168 Hours), confirming equivalent environmental and handling requirements.

Frequently Asked Questions (FAQ)

Q: Can the W25X10CLSNIG directly replace the M25P10-AVMN6PYA in existing designs?

A: Yes. Both components share identical memory capacity (1Mbit), organization (128K x 8), SPI interface, supply voltage range (2.3V ~ 3.6V), operating temperature range (-40°C ~ 85°C), and 8-SOIC package dimensions. Pin-to-pin compatibility is confirmed.

Q: What are the differences between these two parts?

A: The W25X10CLSNIG operates at a higher maximum clock frequency (104 MHz versus 50 MHz) and features faster page write cycle time (800µs versus 5ms). These represent performance improvements with no functional limitations for applications designed for the M25P10-AVMN6PYA.

Q: Are there any compliance or certification differences?

A: Both parts are ROHS3 compliant with identical Moisture Sensitivity Level ratings of 3 (168 Hours). No compliance differences exist between the two components.

Q: Why is the M25P10-AVMN6PYA classified as obsolete?

A: The M25P10-AVMN6PYA has reached end-of-life status. The W25X10CLSNIG from Winbond Electronics is an active product offering equivalent functionality with enhanced performance characteristics and assured long-term availability.

Q: Are the package dimensions identical?

A: Yes. Both components use 8-SOIC packaging with identical physical dimensions of 0.154" width and 3.90mm overall width, ensuring direct PCB footprint compatibility.

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