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M2 Diode Equivalent & Substitute Parts
Part Overview
The M2 is a general-purpose rectifier diode manufactured by Diotec Semiconductor, classified as a standard recovery diode in the DO-214AC (SMA) surface mount package. This component is rated for 100 V DC reverse voltage with 1 A average rectified current and operates across a junction temperature range of -50°C to 150°C. The part maintains Active product status and is suitable for standard rectification applications requiring surface mount integration.
Equivalent and substitute parts are identified to address inventory availability, packaging format preferences, and supply chain continuity while maintaining full electrical and mechanical compatibility.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - DC Reverse (Vr) (Max) | 100 | V |
| Current - Average Rectified (Io) | 1 | A |
| Voltage - Forward (Vf) (Max) @ If | 1.1 @ 1 A | V |
| Reverse Recovery Time (trr) | 1.5 | µs |
| Current - Reverse Leakage @ Vr | 5 @ 100 V | µA |
| Speed Classification | Standard Recovery >500ns, > 200mA (Io) | - |
| Package / Case | DO-214AC, SMA | - |
| Mounting Type | Surface Mount | - |
| Operating Temperature - Junction | -50 to 150 | °C |
Substitute Part Grouping Explanation
Substitution of the M2 diode is determined by strict equivalence across all critical electrical parameters and mechanical compatibility. The substitute part must satisfy the following criteria:
Electrical Parameters (Must Match):
- Voltage - DC Reverse (Vr) (Max): 100 V
- Current - Average Rectified (Io): 1 A
- Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 1 A
- Reverse Recovery Time (trr): 1.5 µs
- Current - Reverse Leakage @ Vr: 5 µA @ 100 V
- Speed Classification: Standard Recovery >500ns, > 200mA (Io)
Mechanical Parameters (Must Match):
- Package / Case: DO-214AC, SMA
- Mounting Type: Surface Mount
- Operating Temperature - Junction: -50°C to 150°C
The identified substitute part maintains identical electrical performance and mechanical form factor, with the primary distinction being packaging format (Tape & Reel versus individual unit packaging) and enhanced compliance certifications.
Parameter Comparison
| Parameter | M2 (Main Part) | M2 (Substitute - Tape & Reel) | Match Status |
|---|---|---|---|
| Manufacturer | Diotec Semiconductor | Diotec Semiconductor | Identical |
| Category | Diodes, Rectifiers | Diodes, Rectifiers | Identical |
| Voltage - DC Reverse (Vr) (Max) | 100 V | 100 V | Identical |
| Current - Average Rectified (Io) | 1 A | 1 A | Identical |
| Voltage - Forward (Vf) (Max) @ If | 1.1 V @ 1 A | 1.1 V @ 1 A | Identical |
| Speed | Standard Recovery >500ns, > 200mA (Io) | Standard Recovery >500ns, > 200mA (Io) | Identical |
| Reverse Recovery Time (trr) | 1.5 µs | 1.5 µs | Identical |
| Current - Reverse Leakage @ Vr | 5 µA @ 100 V | 5 µA @ 100 V | Identical |
| Package / Case | DO-214AC, SMA | DO-214AC, SMA | Identical |
| Mounting Type | Surface Mount | Surface Mount | Identical |
| Operating Temperature - Junction | -50°C ~ 150°C | -50°C ~ 150°C | Identical |
| Product Status | Active | Active | Identical |
| Packaging Format | Individual Unit | Tape & Reel (TR) | Different |
| RoHS Status | Not applicable | ROHS3 Compliant | Different |
Engineering Selection Recommendations
The M2 diode in Tape & Reel packaging format serves as a direct parametric equivalent to the main part specification. Both variants are manufactured by Diotec Semiconductor and maintain Active product status, confirming ongoing production and supply availability.
Selection Basis:
The substitute part is electrically and mechanically interchangeable with the main part across all critical performance parameters. The distinction between the two variants is limited to packaging format and compliance documentation status.
Packaging Consideration:
Selection between individual unit packaging and Tape & Reel format depends on assembly process requirements and procurement volume. Tape & Reel packaging is standard for automated surface mount assembly operations and typically offers cost efficiency for production quantities.
Compliance Status:
The Tape & Reel variant carries ROHS3 compliance certification, whereas the main part lists RoHS status as Not applicable. This distinction does not affect electrical or mechanical compatibility but may influence procurement decisions based on regulatory requirements or customer specifications.
Frequently Asked Questions (FAQ)
Q: Are the M2 diodes in different packaging formats electrically identical?
A: Yes. Both the individual unit and Tape & Reel variants of the M2 diode share identical electrical specifications, including reverse voltage rating (100 V), forward current (1 A), forward voltage drop (1.1 V @ 1 A), and reverse recovery time (1.5 µs). The packaging format difference does not affect component performance.
Q: Can I substitute the Tape & Reel packaged M2 for the individual unit version in my circuit design?
A: Yes. The Tape & Reel variant is a direct substitute for the individual unit packaging. Both use the DO-214AC (SMA) surface mount package and are mounted identically on PCBs. The only difference is the delivery format and quantity per reel.
Q: What is the significance of the RoHS compliance difference between the two variants?
A: The Tape & Reel variant carries ROHS3 compliance certification, while the main part lists RoHS status as Not applicable. This reflects different compliance documentation availability from the manufacturer. Both parts are suitable for applications requiring RoHS compliance; the certification status difference does not indicate a material composition difference.
Q: Are there any temperature or thermal performance differences between the variants?
A: No. Both variants operate across the identical junction temperature range of -50°C to 150°C and maintain the same thermal characteristics. Selection between packaging formats does not affect thermal performance.
Q: Which packaging format should I select for high-volume production?
A: Tape & Reel packaging is standard for automated surface mount assembly processes and is typically specified for production quantities. Individual unit packaging is suitable for prototyping, low-volume builds, or manual assembly operations.
Q: Can I use either variant interchangeably in my existing PCB design?
A: Yes. Both variants use the identical DO-214AC (SMA) surface mount package footprint. PCB layout and component placement remain unchanged regardless of which packaging format is selected for procurement.
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