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LV810RILF Clock Fanout Buffer Equivalent & Substitute Parts
Part Overview
The LV810RILF is a Clock Fanout Buffer (Distribution) IC manufactured by Renesas Electronics Corporation, designed for 1:10 clock distribution at 133 MHz. This device features a 20-SSOP package and operates across a supply voltage range of 1.425V to 2.625V with TTL output configuration. The product is currently classified as obsolete, making equivalent and substitute parts necessary for ongoing system support and new design implementations.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | LV810RILF |
| Manufacturer | Renesas Electronics Corporation |
| Category | Clock/Timing |
| Type | Fanout Buffer (Distribution) |
| Ratio - Input:Output | 1:10 |
| Frequency - Max | 133 MHz |
| Input Type | Clock |
| Output Type | TTL |
| Voltage - Supply | 1.425V ~ 2.625V |
| Operating Temperature | -40°C ~ 85°C |
| Package / Case | 20-SSOP (0.154", 3.90mm Width) |
| Mounting Type | Surface Mount |
| Product Status | Obsolete |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitution for the LV810RILF is determined by the following critical parameters:
Primary Substitution Criteria:
- Ratio - Input:Output: 1:10
- Frequency - Max: 133 MHz or higher
- Package / Case: 20-SSOP (0.154", 3.90mm Width)
- Operating Temperature Range: -40°C ~ 85°C
- Mounting Type: Surface Mount
- RoHS3 Compliance
Substitution Groups:
Group 1: Direct Pin-Compatible Substitutes (Identical Ratio and Package) Parts PI49FCT32807QE and PI49FCT32807QEX from Diodes Incorporated maintain the exact 1:10 ratio, identical 20-SSOP package footprint, and 133 MHz frequency specification. These parts are functionally equivalent with active product status and full RoHS3 compliance.
Group 2: Enhanced Capability Substitute (Higher Frequency, Different Package) Part NB3F8L3010CMNG from onsemi provides enhanced specifications with 3:10 ratio capability and 200 MHz maximum frequency in a 32-VFQFN package. This substitute requires PCB layout redesign due to package change but offers superior frequency performance and multiple input format support (HCSL, LVDS, LVPECL, SSTL, Crystal).
Parameter Comparison
| Parameter | LV810RILF (Main) | PI49FCT32807QE | PI49FCT32807QEX | NB3F8L3010CMNG |
|---|---|---|---|---|
| Manufacturer | Renesas Electronics | Diodes Incorporated | Diodes Incorporated | onsemi |
| Ratio - Input:Output | 1:10 | 1:10 | 1:10 | 3:10 |
| Frequency - Max | 133 MHz | 133 MHz | 133 MHz | 200 MHz |
| Input Type | Clock | CMOS | CMOS | HCSL, LVDS, LVPECL, SSTL, Crystal |
| Output Type | TTL | CMOS | CMOS | LVCMOS, LVTTL |
| Voltage - Supply | 1.425V ~ 2.625V | 2.97V ~ 3.63V | 2.97V ~ 3.63V | 2.375V ~ 3.465V |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 85°C |
| Package / Case | 20-SSOP | 20-SSOP | 20-SSOP | 32-VFQFN Exposed Pad |
| Product Status | Obsolete | Active | Active | Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| MSL Rating | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) |
Engineering Selection Recommendations
For Direct Replacement (No PCB Redesign Required):
PI49FCT32807QE and PI49FCT32807QEX are the primary substitutes for LV810RILF applications. Both parts maintain identical 1:10 distribution ratio, 133 MHz frequency specification, and 20-SSOP package footprint. Both are active products with full RoHS3 compliance and MSL 1 rating. The selection between these two variants depends on packaging requirements: PI49FCT32807QE is supplied in Tube packaging, while PI49FCT32807QEX is supplied in Tape & Reel format.
For Enhanced Performance Applications (PCB Redesign Required):
NB3F8L3010CMNG from onsemi provides superior frequency performance at 200 MHz and supports multiple input signal formats. This substitute requires PCB layout modification due to the 32-VFQFN package change from the original 20-SSOP. This option is suitable for new designs or system upgrades where the enhanced specifications justify redesign effort. The part maintains active product status and full RoHS3 compliance.
Compliance Considerations:
All substitute parts maintain ROHS3 compliance, REACH unaffected status, and MSL 1 (Unlimited) moisture sensitivity rating, ensuring compatibility with existing supply chain and manufacturing processes.
Frequently Asked Questions (FAQ)
Q: Can PI49FCT32807QE directly replace LV810RILF without PCB modifications?
A: Yes. PI49FCT32807QE maintains identical 1:10 ratio, 133 MHz frequency, and 20-SSOP package dimensions. Pin-to-pin compatibility is confirmed for direct socket replacement.
Q: What is the difference between PI49FCT32807QE and PI49FCT32807QEX?
A: Both parts are electrically identical with the same 1:10 ratio, 133 MHz frequency, and 20-SSOP package. The difference is packaging format: PI49FCT32807QE is supplied in Tube, while PI49FCT32807QEX is supplied in Tape & Reel (TR). Select based on your assembly process requirements.
Q: Why does NB3F8L3010CMNG have a different input:output ratio (3:10 vs 1:10)?
A: NB3F8L3010CMNG is a multiplexer-type fanout buffer with enhanced capabilities. The 3:10 ratio indicates it can select from 3 input sources and distribute to 10 outputs. This part requires PCB redesign due to package change (32-VFQFN vs 20-SSOP) but offers 200 MHz frequency and multiple input format support.
Q: Are all substitute parts RoHS3 compliant?
A: Yes. PI49FCT32807QE, PI49FCT32807QEX, and NB3F8L3010CMNG are all ROHS3 compliant with MSL 1 (Unlimited) rating, matching the original LV810RILF specifications.
Q: What supply voltage considerations apply when substituting?
A: LV810RILF operates at 1.425V ~ 2.625V. PI49FCT32807QE and PI49FCT32807QEX require 2.97V ~ 3.63V, requiring voltage supply verification. NB3F8L3010CMNG operates at 2.375V ~ 3.465V. Confirm your system supply voltage compatibility before selection.
Q: Can I use NB3F8L3010CMNG in an existing LV810RILF socket?
A: No. NB3F8L3010CMNG uses a 32-VFQFN package versus the original 20-SSOP, requiring PCB layout redesign and new footprint implementation.
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