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LTH-306-09 Equivalent & Substitute Parts
Part Overview
The LTH-306-09 is an optical sensor module manufactured by Lite-On Inc., designed as a slot-type actuated sensor with PC pins for through-hole mounting. This component is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and new design implementations. The module's through-hole mounting configuration and PC pin interface define its primary application scope.
Substiute Parts
Key Parameters
| Parameter | LTH-306-09 |
|---|---|
| Manufacturer | Lite-On Inc. |
| Category | Optical Sensors |
| Description | Optical Sensor Module, PC Pins, Actuated Sensor |
| Product Status | Obsolete |
| Mounting Type | Through Hole |
| Package / Case | Module, PC Pins, Actuated Sensor |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| ECCN | EAR99 |
| HTSUS | 8541.41.0000 |
Substitute Part Grouping Explanation
The OPB848 qualifies as a substitute for the LTH-306-09 based on the following alignment criteria:
Matching Parameters:
- Both components are optical sensors in the same functional category
- Both utilize through-hole mounting configuration
- Both maintain MSL rating of 1 (Unlimited)
- Both are classified under EAR99 export control
Functional Basis: The OPB848 is a through-beam optical sensor with phototransistor output, providing slot-type sensing capability equivalent to the LTH-306-09's actuated sensor design. The PCB mount configuration of the OPB848 accommodates standard through-hole circuit board integration.
Parameter Comparison
| Parameter | LTH-306-09 | OPB848 |
|---|---|---|
| Manufacturer | Lite-On Inc. | TT Electronics / Optek Technology |
| Category | Optical Sensors | Optical Sensors |
| Product Status | Obsolete | Active |
| Mounting Type | Through Hole | Through Hole |
| Package / Case | Module, PC Pins, Actuated Sensor | PCB Mount |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) |
| ECCN | EAR99 | EAR99 |
Engineering Selection Recommendations
The OPB848 is the designated substitute for the obsolete LTH-306-09. Selection of this alternative is supported by:
- Product Status Alignment: The OPB848 maintains active production status, ensuring long-term availability and supply chain continuity
- Compliance Certification: Both components share identical MSL and ECCN classifications, eliminating compliance barriers to substitution
- Mounting Compatibility: Through-hole mounting configuration is preserved, reducing circuit board redesign requirements
- Regulatory Status: The OPB848 is ROHS3 Compliant and REACH Unaffected, meeting current environmental and regulatory standards
Frequently Asked Questions (FAQ)
Q: Can the OPB848 directly replace the LTH-306-09 without circuit board modification?
A: The OPB848 maintains through-hole mounting compatibility. However, the transition from a module-based PC pin interface to a PCB mount configuration may require footprint verification and potential layout adjustments depending on the original circuit board design.
Q: What are the key electrical differences between these components?
A: The OPB848 provides specified electrical parameters including 50 mA maximum DC forward current, 30 V collector-emitter breakdown voltage, and 12µs response time. The LTH-306-09 specifications for these parameters are not provided in the available documentation.
Q: Are there any environmental or compliance concerns with this substitution?
A: Both components share MSL 1 (Unlimited) ratings and EAR99 export classification. The OPB848 additionally carries ROHS3 Compliance and REACH Unaffected status, indicating alignment with current environmental regulations.
Q: What is the sensing distance specification for the OPB848?
A: The OPB848 is specified for 0.100" (2.54mm) sensing distance with through-beam sensing method and phototransistor output configuration.
Q: Is the OPB848 available in the same packaging as the LTH-306-09?
A: The OPB848 is supplied in bulk packaging, whereas the LTH-306-09 packaging specification is not provided. Packaging format should be confirmed with the component supplier for procurement purposes.
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