LTH-306-09 Equivalent & Substitute Parts

Part Overview

The LTH-306-09 is an optical sensor module manufactured by Lite-On Inc., designed as a slot-type actuated sensor with PC pins for through-hole mounting. This component is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and new design implementations. The module's through-hole mounting configuration and PC pin interface define its primary application scope.

Substiute Parts

LTH-306-09
Lite-On Inc.In Stock: 882LTH-306-09 Datasheet
LTH-306-09
Current Part
OPB848
TT Electronics / Optek TechnologyIn Stock: 1351OPB848 Datasheet
OPB848
MFR Recommended

Key Parameters

Parameter LTH-306-09
Manufacturer Lite-On Inc.
Category Optical Sensors
Description Optical Sensor Module, PC Pins, Actuated Sensor
Product Status Obsolete
Mounting Type Through Hole
Package / Case Module, PC Pins, Actuated Sensor
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8541.41.0000

Substitute Part Grouping Explanation

The OPB848 qualifies as a substitute for the LTH-306-09 based on the following alignment criteria:

Matching Parameters:

  • Both components are optical sensors in the same functional category
  • Both utilize through-hole mounting configuration
  • Both maintain MSL rating of 1 (Unlimited)
  • Both are classified under EAR99 export control

Functional Basis: The OPB848 is a through-beam optical sensor with phototransistor output, providing slot-type sensing capability equivalent to the LTH-306-09's actuated sensor design. The PCB mount configuration of the OPB848 accommodates standard through-hole circuit board integration.

Parameter Comparison

Parameter LTH-306-09 OPB848
Manufacturer Lite-On Inc. TT Electronics / Optek Technology
Category Optical Sensors Optical Sensors
Product Status Obsolete Active
Mounting Type Through Hole Through Hole
Package / Case Module, PC Pins, Actuated Sensor PCB Mount
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited)
ECCN EAR99 EAR99

Engineering Selection Recommendations

The OPB848 is the designated substitute for the obsolete LTH-306-09. Selection of this alternative is supported by:

  • Product Status Alignment: The OPB848 maintains active production status, ensuring long-term availability and supply chain continuity
  • Compliance Certification: Both components share identical MSL and ECCN classifications, eliminating compliance barriers to substitution
  • Mounting Compatibility: Through-hole mounting configuration is preserved, reducing circuit board redesign requirements
  • Regulatory Status: The OPB848 is ROHS3 Compliant and REACH Unaffected, meeting current environmental and regulatory standards

Frequently Asked Questions (FAQ)

Q: Can the OPB848 directly replace the LTH-306-09 without circuit board modification?

A: The OPB848 maintains through-hole mounting compatibility. However, the transition from a module-based PC pin interface to a PCB mount configuration may require footprint verification and potential layout adjustments depending on the original circuit board design.

Q: What are the key electrical differences between these components?

A: The OPB848 provides specified electrical parameters including 50 mA maximum DC forward current, 30 V collector-emitter breakdown voltage, and 12µs response time. The LTH-306-09 specifications for these parameters are not provided in the available documentation.

Q: Are there any environmental or compliance concerns with this substitution?

A: Both components share MSL 1 (Unlimited) ratings and EAR99 export classification. The OPB848 additionally carries ROHS3 Compliance and REACH Unaffected status, indicating alignment with current environmental regulations.

Q: What is the sensing distance specification for the OPB848?

A: The OPB848 is specified for 0.100" (2.54mm) sensing distance with through-beam sensing method and phototransistor output configuration.

Q: Is the OPB848 available in the same packaging as the LTH-306-09?

A: The OPB848 is supplied in bulk packaging, whereas the LTH-306-09 packaging specification is not provided. Packaging format should be confirmed with the component supplier for procurement purposes.

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