LSM330DTR Equivalent & Substitute Parts

Part Overview

The LSM330DTR is a 6-axis inertial measurement unit (IMU) combining accelerometer, gyroscope, and temperature sensor functionality with I2C and SPI digital output interfaces. Manufactured by STMicroelectronics, this component is packaged in a 28-pin VFLGA module and operates across the industrial temperature range of -40°C to 85°C.

The LSM330DTR is classified as obsolete. Identifying equivalent and substitute parts is necessary to support ongoing design requirements, system maintenance, and production continuity where this component is specified in existing applications.

Substiute Parts

LSM330DTR
STMicroelectronicsIn Stock: 21899LSM330DTR Datasheet
LSM330DTR
Current Part
LSM6DSLTR
STMicroelectronicsIn Stock: 50603LSM6DSLTR Datasheet
LSM6DSLTR
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Key Parameters

Parameter Value
Manufacturer STMicroelectronics
Category Motion Sensors
Sensor Type Accelerometer, Gyroscope, Temperature, 6 Axis
Output Type I2C, SPI
Operating Temperature Range -40°C ~ 85°C (TA)
Package / Case 28-VFLGA Module
Supplier Device Package 28-LGA (3x5.5)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS Code 8542.39.0001
Product Status Obsolete

Substitute Part Grouping Explanation

Substitution of the LSM330DTR is determined by the following critical parameters:

Functional Equivalence: The substitute part must provide 6-axis IMU functionality combining accelerometer, gyroscope, and temperature sensing with identical output interface options (I2C and SPI).

Operating Temperature Compatibility: The substitute must support the full industrial temperature range of -40°C to 85°C to ensure operation across all specified environmental conditions.

Digital Interface Compatibility: Both I2C and SPI output protocols must be supported to maintain compatibility with existing firmware and hardware interfaces.

Regulatory and Compliance Alignment: The substitute must maintain ROHS3 compliance, REACH unaffected status, and identical ECCN and HTSUS classifications to ensure regulatory continuity.

Moisture Sensitivity and Handling: MSL rating of 3 (168 Hours) must be maintained to preserve component shelf life and manufacturing process compatibility.

The LSM6DSLTR meets all these substitution criteria while offering active product status and improved availability.

Parameter Comparison

Parameter LSM330DTR (Main Part) LSM6DSLTR (Substitute)
Manufacturer STMicroelectronics STMicroelectronics
Category Motion Sensors Motion Sensors
Sensor Type Accelerometer, Gyroscope, Temperature, 6 Axis Accelerometer, Gyroscope, Temperature, 6 Axis
Output Type I2C, SPI I2C, SPI
Operating Temperature Range -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
ECCN EAR99 EAR99
HTSUS Code 8542.39.0001 8542.39.0001
Product Status Obsolete Active
Package / Case 28-VFLGA Module 14-VFLGA Module
Supplier Device Package 28-LGA (3x5.5) 14-LGA (2.5x3)

Engineering Selection Recommendations

The LSM6DSLTR is a qualified substitute for the LSM330DTR based on the following engineering criteria:

Functional Compatibility: Both components provide identical 6-axis IMU sensor functionality with accelerometer, gyroscope, and temperature measurement capabilities. Both support I2C and SPI digital communication protocols, ensuring firmware and interface compatibility.

Environmental and Regulatory Compliance: The LSM6DSLTR maintains the same operating temperature range (-40°C to 85°C), RoHS3 compliance status, REACH unaffected designation, and identical ECCN and HTSUS classifications. Moisture sensitivity levels are equivalent, preserving component handling and storage requirements.

Product Lifecycle Status: The LSM330DTR is obsolete, while the LSM6DSLTR maintains active product status with established supply chain availability. This transition supports long-term design sustainability and production continuity.

Package Consideration: The LSM6DSLTR uses a 14-pin VFLGA package compared to the 28-pin VFLGA of the LSM330DTR. PCB layout modifications are required to accommodate the different pin count and physical dimensions (2.5x3 mm versus 3x5.5 mm).

Frequently Asked Questions (FAQ)

Q: Can the LSM6DSLTR directly replace the LSM330DTR without PCB modifications?

A: No. The LSM6DSLTR uses a 14-LGA package (2.5x3 mm) while the LSM330DTR uses a 28-LGA package (3x5.5 mm). PCB layout redesign is required to accommodate the different pin count and physical footprint.

Q: Are the I2C and SPI interfaces identical between these components?

A: Both components support I2C and SPI output protocols. However, pin assignments differ due to the different package configurations. Firmware and hardware interface verification is necessary during integration.

Q: Does the LSM6DSLTR maintain the same operating temperature range?

A: Yes. Both components operate across -40°C to 85°C, ensuring compatibility with identical environmental specifications.

Q: What are the regulatory compliance implications of this substitution?

A: Both components maintain ROHS3 compliance, REACH unaffected status, EAR99 ECCN classification, and identical HTSUS codes (8542.39.0001). No regulatory documentation changes are required.

Q: Why is the LSM6DSLTR recommended over the LSM330DTR?

A: The LSM330DTR is classified as obsolete. The LSM6DSLTR provides equivalent functional performance with active product status, ensuring long-term supply chain availability and design continuity.

Q: Are the moisture sensitivity requirements the same?

A: Yes. Both components have MSL rating 3 (168 Hours), requiring identical component handling, storage, and manufacturing process controls.

Q: What is the primary difference between these two components?

A: The primary difference is package configuration. The LSM6DSLTR integrates the same 6-axis IMU functionality into a smaller 14-pin VFLGA package, compared to the 28-pin VFLGA of the LSM330DTR. This results in reduced PCB footprint and improved space efficiency.

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