LPV324IDRE4 Equivalent & Substitute Parts

Part Overview

The LPV324IDRE4 is a general purpose operational amplifier manufactured by Texas Instruments, configured as a 4-circuit rail-to-rail amplifier in a 14-SOIC surface mount package. This device is classified as obsolete, which necessitates identification of active equivalent and substitute components for ongoing design support and procurement continuity. The LPV324IDRE4 operates across a 2.7V to 5V supply range with ultra-low input bias current of 2 nA and is suitable for low-power, low-speed analog signal processing applications.

Key Parameters

Parameter	Value	Unit
Manufacturer Part Number	LPV324IDRE4	—
Manufacturer	Texas Instruments	—
Category	Linear, Amplifiers	—
Amplifier Type	General Purpose	—
Number of Circuits	4	—
Output Type	Rail-to-Rail	—
Package / Case	14-SOIC (0.154", 3.90mm Width)	—
Mounting Type	Surface Mount	—
Slew Rate	0.1	V/µs
Gain Bandwidth Product	237	kHz
Current - Input Bias	2	nA
Voltage - Input Offset	1.5	mV
Current - Supply	28	µA (x4 Channels)
Current - Output / Channel	72	mA
Voltage - Supply Span (Min)	2.7	V
Voltage - Supply Span (Max)	5	V
Operating Temperature	-40 to 125	°C
Product Status	Obsolete	—
RoHS Status	ROHS3 Compliant	—
Moisture Sensitivity Level (MSL)	1 (Unlimited)	—

Substitute Part Grouping Explanation

Substitution of the LPV324IDRE4 is determined by the following critical parameters:

Primary Compatibility Criteria:

Number of circuits: 4 channels required
Output type: Rail-to-rail operation
Package type: 14-SOIC surface mount (0.154" width preferred)
Supply voltage range: Minimum 2.7V, maximum 5V or higher
Operating temperature range: -40°C to 125°C or compatible subset
Mounting type: Surface mount

Secondary Performance Criteria:

Slew rate: 0.1V/µs baseline; higher values acceptable
Gain bandwidth product: 237 kHz baseline; higher values acceptable
Input bias current: 2 nA baseline; lower values acceptable
Input offset voltage: 1.5 mV baseline; lower values acceptable
Supply current: 28µA baseline; higher values acceptable within application constraints
Output current per channel: 72 mA baseline; higher values acceptable

Substitute parts are grouped into two categories: direct pin-compatible replacements from Texas Instruments (LMV324 series and LPV324 variants) and functionally equivalent alternatives from other manufacturers (Rohm Semiconductor, Microchip Technology, onsemi) that meet the core electrical and mechanical requirements.

Parameter Comparison

Parameter	LPV324IDRE4	LMV324M/NOPB	LMV324MX/NOPB	LPV324M/NOPB	LPV324MX/NOPB	BU7487F-E2	LMR934F-GE2	LMV324AM14X	MCP6474-E/SL	MCP6474T-E/SL	MCP6484-E/SL
Manufacturer	TI	TI	TI	TI	TI	Rohm	Rohm	onsemi	Microchip	Microchip	Microchip
Number of Circuits	4	4	4	4	4	4	4	4	4	4	4
Output Type	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail
Package / Case	14-SOIC (0.154")	14-SOIC (0.154")	14-SOIC (0.154")	14-SOIC (0.154")	14-SOIC (0.154")	14-SOIC (0.173")	14-SOIC (0.173")	14-SOIC (0.154")	14-SOIC (0.154")	14-SOIC (0.154")	14-SOIC (0.154")
Mounting Type	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount
Slew Rate (V/µs)	0.1	1	1	0.1	0.1	10	0.35	1.5	1.1	1.1	2.7
Gain Bandwidth Product (kHz)	237	1000	1000	152	152	10000	1400	1400	2000	2000	4000
Current - Input Bias (nA)	2	15	15	2	2	0.001	5	1	0.001	0.001	0.001
Voltage - Input Offset (mV)	1.5	1.7	1.7	1.5	1.5	1	1	1	1.5	1.5	1.5
Current - Supply (µA)	28	410	410	28	28	6000	250	100	100	100	240
Current - Output / Channel (mA)	72	160	160	16	16	12	90	34	32	32	12
Voltage - Supply Span Min (V)	2.7	2.7	2.7	2.7	2.7	3	1.8	2.7	2	2	2.2
Voltage - Supply Span Max (V)	5	5.5	5.5	5	5	5.5	5	5.5	5.5	5.5	5.5
Operating Temperature (°C)	-40 to 125	-40 to 125	-40 to 125	-40 to 85	-40 to 85	-40 to 105	-40 to 85	-40 to 125	-40 to 125	-40 to 125	-40 to 125
Product Status	Obsolete	Active	Active	Active	Active	Active	Active	Obsolete	Active	Active	Active
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant

Engineering Selection Recommendations

Tier 1: Direct Replacements (Texas Instruments LPV324 Series)

LPV324M/NOPB and LPV324MX/NOPB are direct functional equivalents to the LPV324IDRE4. Both maintain identical electrical performance specifications including 0.1V/µs slew rate, 152 kHz gain bandwidth product, 2 nA input bias current, and 28µA supply current. These parts are pin-compatible and operate within the same 2.7V to 5V supply range. Both are active products with ROHS3 compliance and MSL 1 rating. The primary difference is packaging format: LPV324M/NOPB is supplied in Tube packaging, while LPV324MX/NOPB is supplied in Cut Tape (CT) & Digi-Reel format. Operating temperature range is limited to -40°C to 85°C, which is narrower than the original part's -40°C to 125°C range.

Tier 2: Enhanced Performance Replacements (Texas Instruments LMV324 Series)

LMV324M/NOPB and LMV324MX/NOPB offer improved performance over the LPV324IDRE4 while maintaining pin compatibility and 14-SOIC packaging. These parts feature 1V/µs slew rate (10× faster), 1 MHz gain bandwidth product (4.2× higher), and 160 mA output current per channel (2.2× higher). Supply current increases to 410µA. Both operate across 2.7V to 5.5V supply range and support full -40°C to 125°C temperature range. These are active products with ROHS3 compliance. LMV324M/NOPB is supplied in Tube format; LMV324MX/NOPB is supplied in Cut Tape & Digi-Reel format.

Tier 3: Alternative Manufacturers

LMR934F-GE2 (Rohm Semiconductor) provides general purpose amplification in 14-SOP package with 0.35V/µs slew rate and 1.4 MHz bandwidth. This part operates across 1.8V to 5V supply range, supporting lower voltage applications. Operating temperature range is -40°C to 85°C. Package width is 0.173" (4.40mm), which differs from the standard 0.154" width.

BU7487F-E2 (Rohm Semiconductor) is a CMOS amplifier with significantly higher performance: 10V/µs slew rate and 10 MHz bandwidth. This part is suitable for applications requiring faster signal processing. Package width is 0.173" (4.40mm). Operating temperature range is -40°C to 105°C.

MCP6474-E/SL and MCP6474T-E/SL (Microchip Technology) are CMOS amplifiers with 1.1V/µs slew rate and 2 MHz bandwidth. These parts feature picoampere-level input bias current and operate across 2V to 5.5V supply range with full -40°C to 125°C temperature support. MCP6474-E/SL is supplied in Tube format; MCP6474T-E/SL is supplied in Tape & Reel format.

MCP6484-E/SL (Microchip Technology) is a general purpose amplifier with 2.7V/µs slew rate and 4 MHz bandwidth, offering enhanced performance for faster applications. This part operates across 2.2V to 5.5V supply range and supports -40°C to 125°C temperature range.

LMV324AM14X (onsemi) is an obsolete part with 1.5V/µs slew rate and 1.4 MHz bandwidth. This part is not recommended for new designs due to obsolete status.

Selection Criteria:

For direct replacement in existing designs with no performance constraints, select LPV324M/NOPB or LPV324MX/NOPB. For applications requiring improved speed and output drive capability, select LMV324M/NOPB or LMV324MX/NOPB. For applications requiring ultra-low input bias current or CMOS technology, select MCP6474-E/SL or MCP6474T-E/SL. For applications requiring higher bandwidth and slew rate, select MCP6484-E/SL or BU7487F-E2. All recommended active substitutes maintain ROHS3 compliance and MSL 1 rating.

Frequently Asked Questions (FAQ)

Q: Can LMV324MX/NOPB be used as a direct replacement for LPV324IDRE4?

A: LMV324MX/NOPB is pin-compatible and functionally compatible with LPV324IDRE4 in terms of package type (14-SOIC, 0.154" width) and circuit configuration (4-channel rail-to-rail amplifier). However, LMV324MX/NOPB exhibits significantly higher performance: 1V/µs slew rate versus 0.1V/µs, 1 MHz bandwidth versus 237 kHz, and 160 mA output current versus 72 mA. These enhanced specifications are backward compatible with applications designed for LPV324IDRE4. The operating temperature range of LMV324MX/NOPB is -40°C to 125°C, matching the original part. Supply current increases from 28µA to 410µA, which may impact low-power applications. LMV324MX/NOPB is an active product with full availability.

Q: What is the difference between LPV324MX/NOPB and LMV324MX/NOPB?

A: Both parts are 14-SOIC surface mount packages with 4 circuits and rail-to-rail output. The primary differences are: LPV324MX/NOPB maintains the original LPV324IDRE4 performance specifications (0.1V/µs slew rate, 152 kHz bandwidth, 28µA supply current, 16 mA output current per channel, -40°C to 85°C temperature range). LMV324MX/NOPB provides enhanced performance (1V/µs slew rate, 1 MHz bandwidth, 410µA supply current, 160 mA output current per channel, -40°C to 125°C temperature range). Both are active products with ROHS3 compliance. Selection depends on application speed requirements and temperature range needs.

Q: Are Rohm Semiconductor and Microchip Technology parts pin-compatible with LPV324IDRE4?

A: Rohm Semiconductor parts (LMR934F-GE2, BU7487F-E2) and Microchip Technology parts (MCP6474-E/SL, MCP6474T-E/SL, MCP6484-E/SL) are functionally equivalent but not pin-compatible with LPV324IDRE4. All these parts are 14-pin surface mount packages with 4-circuit rail-to-rail amplifier configuration. However, Rohm parts use 14-SOP package with 0.173" width, while Microchip parts use 14-SOIC package with 0.154" width. The 0.173" width difference in Rohm packages may require PCB layout modifications. Microchip parts with 0.154" width are mechanically compatible with LPV324IDRE4 footprints. Pin assignments must be verified against specific datasheets before substitution.

Q: What is the significance of the 0.154" versus 0.173" package width difference?

A: The package width difference affects PCB footprint compatibility. LPV324IDRE4 uses 14-SOIC with 0.154" (3.90mm) width. LPV324M/NOPB, LPV324MX/NOPB, LMV324M/NOPB, LMV324MX/NOPB, MCP6474-E/SL, MCP6474T-E/SL, and MCP6484-E/SL all use 14-SOIC with 0.154" width and are mechanically compatible with existing LPV324IDRE4 footprints. LMR934F-GE2 and BU7487F-E2 use 14-SOP with 0.173" (4.40mm) width, which is wider and may not fit existing footprints without PCB modification. For direct footprint compatibility without layout changes, select parts with 0.154" width specification.

Q: Which substitute part offers the lowest input bias current?

A: BU7487F-E2, MCP6474-E/SL, MCP6474T-E/SL, and MCP6484-E/SL all feature picoampere-level input bias current (0.001 pA or 1 pA), which is significantly lower than LPV324IDRE4's 2 nA specification. These CMOS-based amplifiers are suitable for high-impedance signal conditioning applications where input bias current must be minimized. LMV324AM14X offers 1 nA input bias current, which is intermediate between the original part and CMOS alternatives.

Q: What is the impact of increased supply current on system design?

A: LPV324IDRE4 draws 28µA total supply current (7µA per channel). LMV324M/NOPB and LMV324MX/NOPB draw 410µA total (102.5µA per channel), representing a 14.6× increase. This increased current consumption may impact battery-powered applications and require larger power supply capacity. For applications with strict power budget constraints, LPV324M/NOPB or LPV324MX/NOPB maintain the original 28µA specification. MCP6474-E/SL and MCP6474T-E/SL draw 100µA total (25µA per channel), offering a middle ground between ultra-low power and enhanced performance.

Q: Can these parts be used in applications requiring -40°C to 125°C full temperature range?

A: LPV324IDRE4, LMV324M/NOPB, LMV324MX/NOPB, LMV324AM14X, MCP6474-E/SL, MCP6474T-E/SL, and MCP6484-E/SL all support -40°C to 125°C operating temperature range. LPV324M/NOPB, LPV324MX/NOPB, and LMR934F-GE2 support only -40°C to 85°C range, which is narrower. BU7487F-E2 supports -40°C to 105°C range. For applications requiring full -40°C to 125°C temperature coverage, select from the first group of parts listed above.

Q: What is the difference between Tube, Cut Tape, and Tape & Reel packaging?

A: Tube packaging supplies components in plastic tubes, typically used for manual assembly or small-volume orders. Cut Tape (CT) & Digi-Reel packaging supplies components on continuous tape that can be cut to length, suitable for semi-automated assembly. Tape & Reel (TR) packaging supplies components on continuous tape on reels, optimized for high-volume automated assembly. All three packaging formats contain identical components; the difference is in delivery and handling format. Selection depends on assembly process requirements and order volume.

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