LPC812M101FDH16FP Equivalent & Substitute Parts

Part Overview

The LPC812M101FDH16FP is an ARM Cortex-M0+ based 32-bit microcontroller from NXP USA Inc., designed for embedded applications requiring low power consumption and compact form factor. This device integrates 16KB of FLASH program memory, 4KB of RAM, and operates at 30MHz with a supply voltage range of 1.8V to 3.6V. The part is currently classified as obsolete, making identification of compatible substitute components essential for ongoing production support, design updates, and inventory management.

Substiute Parts

LPC812M101FDH16FP

NXP USA Inc.In Stock: 878LPC812M101FDH16FP Datasheet

Current PartRFQ

LPC812M101JDH16FP

NXP USA Inc.In Stock: 2254LPC812M101JDH16FP Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the LPC812M101FDH16FP is determined by strict equivalence across the following critical parameters:

• Processor Architecture: ARM Cortex-M0+ core
• Memory Configuration: 16KB FLASH, 4KB RAM
• Operating Frequency: 30MHz
• Supply Voltage Range: 1.8V ~ 3.6V
• I/O Count: 14 pins
• Connectivity Interfaces: I2C, SPI, UART/USART
• Package Type: 16-TSSOP form factor
• Peripheral Set: Brown-out Detect/Reset, POR, PWM, WDT

The LPC812M101JDH16FP qualifies as a direct substitute because it maintains identical specifications across all electrical and mechanical parameters. The primary distinction is product status: the substitute part is currently active in production, whereas the main part is obsolete. Packaging differs only in supplier delivery format (tube versus unspecified), which does not affect functional compatibility or PCB integration.

Parameter Comparison

Engineering Selection Recommendations

The LPC812M101JDH16FP is a direct functional equivalent to the LPC812M101FDH16FP. Selection of the substitute part is justified on the following grounds:

• Compliance Alignment: Both parts maintain ROHS3 compliance and REACH unaffected status, ensuring regulatory consistency across product lifecycles.
• Production Continuity: The substitute part is currently in active production status with confirmed inventory availability (2220 units), whereas the main part is obsolete with limited remaining stock (848 units).
• Electrical Equivalence: All electrical specifications, memory configurations, operating parameters, and peripheral sets are identical, ensuring drop-in compatibility at the circuit level.
• Package Compatibility: Both parts utilize the 16-TSSOP package with identical physical dimensions, enabling direct PCB layout reuse without redesign.

Frequently Asked Questions (FAQ)

Q: Can LPC812M101JDH16FP be used as a direct replacement for LPC812M101FDH16FP in existing designs?

A: Yes. The substitute part is electrically and mechanically equivalent across all specified parameters. No circuit modifications, firmware changes, or PCB layout adjustments are required for integration.

Q: What is the difference between the two part numbers?

A: The primary difference is product lifecycle status. LPC812M101FDH16FP is obsolete, while LPC812M101JDH16FP is active in production. The letter designation in the part number (D versus J) reflects NXP's internal packaging or manufacturing code but does not indicate functional differences.

Q: Are there any packaging differences between these parts?

A: Both parts are supplied in 16-TSSOP packages with identical physical dimensions (0.173" width, 4.40mm). The main part has unspecified packaging format, while the substitute is supplied in tube packaging. This difference affects only logistics and handling, not electrical or mechanical compatibility.

Q: What inventory considerations should guide part selection?

A: The substitute part (LPC812M101JDH16FP) has significantly higher inventory availability (2220 units) compared to the main part (848 units). For new production orders and long-term supply chain planning, the substitute part is the recommended selection.

Q: Are both parts compliant with current environmental and regulatory standards?

A: Yes. Both parts are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements for electronic component manufacturing and distribution.