LPAM-40-01.0-L-08-2-K-TR Equivalent & Substitute Parts

Part Overview

The LPAM-40-01.0-L-08-2-K-TR is a 320-position connector array manufactured by Samtec Inc., designed for surface mount applications requiring high-density interconnection. This male pin array connector features gold-plated contacts and is part of the LP Array™ series. The component is currently in active production status with ROHS3 compliance and unlimited moisture sensitivity rating (MSL 1). Alternative equivalent parts may be required for supply chain continuity, design flexibility, or specific procurement requirements.

Substiute Parts

LPAM-40-01.0-L-08-2-K-TR

Samtec Inc.In Stock: 826LPAM-40-01.0-L-08-2-K-TR Datasheet

Current PartRFQ

LPAM-40-01.0-L-08-2-K-TR

Samtec Inc.In Stock: 826LPAM-40-01.0-L-08-2-K-TR Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the LPAM-40-01.0-L-08-2-K-TR is determined by strict equivalence across the following critical parameters:

• Number of Positions: 320 positions (exact match required)
• Pitch: 0.050" (1.27mm) (exact match required)
• Number of Rows: 8 rows (exact match required)
• Connector Type: Array, Male Pins (exact match required)
• Mounting Type: Surface Mount (exact match required)
• Contact Finish: Gold (exact match required)
• Contact Finish Thickness: 10.0µin (0.25µm) (exact match required)
• Height Above Board: 0.145" (3.68mm) (exact match required)
• Mated Stacking Heights: 4mm, 4.5mm (exact match required)
• RoHS Status: ROHS3 Compliant (minimum requirement)
• Moisture Sensitivity Level: MSL 1 or better (minimum requirement)

Only parts meeting all critical parameters qualify as direct equivalents. Deviations in position count, pitch, row configuration, or physical dimensions disqualify a part from substitution consideration.

Parameter Comparison

Engineering Selection Recommendations

The LPAM-40-01.0-L-08-2-K-TR maintains active production status with full ROHS3 compliance and REACH unaffected classification. The component carries MSL 1 rating, indicating no moisture sensitivity restrictions during storage and handling. Selection of equivalent parts should prioritize components with identical active product status and matching compliance certifications. The part's EAR99 export classification and HTSUS code 8536.69.4040 should be verified for any substitute candidates to ensure regulatory consistency. Current inventory availability of 790 pieces in new original condition supports immediate procurement without extended lead times.

Frequently Asked Questions (FAQ)

Q: What parameters must match exactly for a part to be considered a direct substitute for the LPAM-40-01.0-L-08-2-K-TR?

A: Direct substitution requires exact matching of position count (320), pitch (0.050"/1.27mm), row configuration (8 rows), connector type (Array, Male Pins), mounting method (Surface Mount), contact finish (Gold), finish thickness (10.0µin/0.25µm), height above board (0.145"/3.68mm), and mated stacking heights (4mm, 4.5mm). Compliance certifications must meet or exceed ROHS3 and MSL 1 requirements.

Q: Can parts with different pitch values substitute for the LPAM-40-01.0-L-08-2-K-TR?

A: No. Pitch is a critical mechanical parameter that determines PCB footprint compatibility. The 0.050" (1.27mm) pitch is non-negotiable for substitution. Parts with different pitch values will not align with existing board designs.

Q: Are there any restrictions on moisture handling for this connector?

A: No. The MSL 1 rating indicates unlimited moisture sensitivity, meaning the component requires no special moisture control during storage, handling, or assembly processes.

Q: What is the significance of the gold contact finish thickness specification?

A: The 10.0µin (0.25µm) gold plating thickness ensures consistent electrical contact resistance and corrosion resistance over the component's operational life. This specification must be maintained in any equivalent part to guarantee performance equivalence.

Q: Does the LPAM-40-01.0-L-08-2-K-TR support automated assembly processes?

A: Yes. The connector includes board guide and pick-and-place features, enabling integration into standard surface mount assembly workflows without special handling requirements.