LP8900TLX-3333/NOPB Equivalent & Substitute Parts

Part Overview

The LP8900TLX-3333/NOPB is a linear voltage regulator IC from Texas Instruments, classified as a Power Management (PMIC) component. This device provides positive fixed 2.8V output at 200mA with dual output configuration in a 6-DSBGA surface mount package. The part is currently in active production status with 30,400 units available in inventory. Substitute parts are identified when electrical specifications, output configuration, and package compatibility remain identical across manufacturers or packaging variants.

Substiute Parts

LP8900TLX-3333/NOPB

Texas InstrumentsIn Stock: 30439LP8900TLX-3333/NOPB Datasheet

Current PartRFQ

LP8900TLE-3333/NOPB

National SemiconductorIn Stock: 10516LP8900TLE-3333/NOPB Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the LP8900TLX-3333/NOPB are identified based on strict electrical and mechanical parameter matching. The following criteria determine substitution eligibility:

• Output voltage configuration: Positive fixed 2.8V
• Output current capability: 200mA
• Maximum input voltage: 5.5V
• Voltage dropout specification: 0.16V @ 200mA
• Dual regulator configuration (2 outputs)
• Package type: 6-DSBGA (1.5x1.3)
• Surface mount mounting type
• Operating temperature range: -40°C ~ 85°C
• Control features: Enable function
• Protection features: Over Temperature, Short Circuit

The LP8900TLE-3333/NOPB meets all these criteria and qualifies as a parametric equivalent. The primary difference is packaging format (Tape & Reel versus Bulk), which does not affect electrical performance or functional compatibility.

Parameter Comparison

Engineering Selection Recommendations

Both the LP8900TLX-3333/NOPB and LP8900TLE-3333/NOPB are active production components with identical electrical specifications and package geometry. Selection between these parts is determined by supply chain requirements and packaging format preference.

The LP8900TLX-3333/NOPB is supplied in Tape & Reel format, suitable for automated assembly processes. The LP8900TLE-3333/NOPB is supplied in Bulk format, appropriate for manual handling or alternative packaging workflows.

Both parts maintain ROHS3 compliance status and are classified under ECCN EAR99 with HTSUS code 8542.39.0001. Moisture sensitivity level is rated at MSL 1 (Unlimited) for the primary part.

Frequently Asked Questions (FAQ)

Q: Can LP8900TLE-3333/NOPB replace LP8900TLX-3333/NOPB in production?

A: Yes. Both parts are parametric equivalents with identical electrical specifications, output voltage (2.8V), current rating (200mA), dropout voltage (0.16V @ 200mA), and 6-DSBGA package geometry. The only difference is packaging format (Tape & Reel versus Bulk), which does not affect electrical performance or PCB assembly compatibility.

Q: What determines if a part is a valid substitute?

A: Substitution eligibility is based on matching output voltage configuration, output current capability, maximum input voltage, voltage dropout specification, number of regulators, package type, mounting method, operating temperature range, control features, and protection features. All these parameters must be identical between the main part and substitute.

Q: Does packaging format affect electrical performance?

A: No. Tape & Reel and Bulk packaging formats contain identical die and internal circuitry. The packaging format only affects handling, storage, and assembly logistics. Electrical specifications and functional performance remain unchanged.

Q: Are there any compliance differences between these parts?

A: Both parts are active production components. The LP8900TLX-3333/NOPB specifies ROHS3 compliance. Compliance documentation should be verified with the supplier for the LP8900TLE-3333/NOPB variant.

Q: What is the significance of the 6-DSBGA package specification?

A: The 6-DSBGA (1.5x1.3) package is a ball grid array with 6 connection points in a 1.5mm x 1.3mm footprint. This package geometry is identical across both substitute parts, ensuring PCB layout and reflow profile compatibility without modification.