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LP339N/NOPB Equivalent & Substitute Parts
Part Overview
The LP339N/NOPB is a general-purpose comparator IC manufactured by Texas Instruments, featuring four independent comparators in a 14-DIP through-hole package. This device operates across a wide supply voltage range (2V to 36V single supply, ±1V to ±18V dual supply) and is designed for applications requiring precision voltage comparison with CMOS, MOS, and open-collector output configurations.
The LP339N/NOPB maintains active product status with 913 units in current inventory and full RoHS3 compliance. Substitute parts become necessary when addressing specific application requirements such as surface-mount packaging, extended operating temperature ranges, automotive qualification, or when managing component obsolescence in legacy designs.
Substiute Parts
Key Parameters
| Parameter | LP339N/NOPB |
|---|---|
| Manufacturer | Texas Instruments |
| Number of Elements | 4 |
| Output Type | CMOS, MOS, Open-Collector |
| Voltage Supply Range (Single/Dual) | 2V ~ 36V / ±1V ~ 18V |
| Input Offset Voltage (Max) | 5mV @ 5V |
| Input Bias Current (Max) | 0.025µA @ 5V |
| Output Current (Typ) | 30mA @ 5V |
| Quiescent Current (Max) | 100µA |
| Operating Temperature | 0°C ~ 70°C |
| Package Type | 14-DIP (0.300", 7.62mm) |
| Mounting Type | Through Hole |
| RoHS Status | RoHS3 Compliant |
| Product Status | Active |
Substitute Part Grouping Explanation
Substitution eligibility for the LP339N/NOPB is determined by the following critical parameters:
Functional Equivalence Requirements:
- Four independent comparator elements
- General-purpose comparator architecture
- Supply voltage range compatibility (minimum 2V ~ 36V single supply or ±1V ~ ±18V dual supply)
- Output type compatibility (CMOS, MOS, or Open-Collector configurations)
- Operating temperature range (minimum 0°C ~ 70°C coverage)
Package and Mounting Considerations:
- 14-pin DIP or SOIC package configurations
- Through-hole or surface-mount mounting types
- Pin-compatible footprints
Compliance and Regulatory Alignment:
- RoHS3 compliance status
- REACH compliance status
- Automotive qualification (AEC-Q100) where applicable
The substitute parts identified—LM339AN, LM339NE4, LM2901QS14-13, and LM2901S14-13—meet these functional and electrical requirements while offering variations in packaging, mounting technology, temperature range, and product lifecycle status.
Parameter Comparison
| Parameter | LP339N/NOPB | LM339AN | LM339NE4 | LM2901QS14-13 | LM2901S14-13 |
|---|---|---|---|---|---|
| Manufacturer | Texas Instruments | Harris Corporation | Texas Instruments | Diodes Incorporated | Diodes Incorporated |
| Number of Elements | 4 | 4 | 4 | 4 | 4 |
| Output Type | CMOS, MOS, Open-Collector | Open-Collector | Open-Collector | CMOS, TTL | Not Specified |
| Voltage Supply Range (Single/Dual) | 2V ~ 36V / ±1V ~ 18V | 2V ~ 32V / ±1V ~ 16V | 2V ~ 30V / ±1V ~ 15V | 2V ~ 36V / ±1V ~ 18V | 2V ~ 36V / ±1V ~ 18V |
| Input Offset Voltage (Max) | 5mV @ 5V | 2mV @ 30V | 5mV @ 30V | 7mV @ 5V | 7mV @ 5V |
| Input Bias Current (Max) | 0.025µA @ 5V | 0.1µA @ 5V | 0.25µA @ 5V | 0.25µA @ 5V | 0.25µA @ 5V |
| Output Current (Typ) | 30mA @ 5V | 16mA @ 5V | 20mA | 16mA @ 5V | 16mA @ 5V |
| Quiescent Current (Max) | 100µA | 2.5mA | 2.5mA | 2.5mA | 2.5mA |
| Operating Temperature | 0°C ~ 70°C | 0°C ~ 70°C | 0°C ~ 70°C | -40°C ~ 125°C | -40°C ~ 125°C |
| Package Type | 14-DIP (0.300", 7.62mm) | 14-DIP (0.300", 7.62mm) | 14-DIP (0.300", 7.62mm) | 14-SOIC (0.154", 3.90mm) | 14-SOIC (0.154", 3.90mm) |
| Mounting Type | Through Hole | Through Hole | Through Hole | Surface Mount | Surface Mount |
| RoHS Status | RoHS3 Compliant | RoHS Non-Compliant | RoHS3 Compliant | RoHS3 Compliant | RoHS3 Compliant |
| Product Status | Active | Obsolete | Discontinued at DiGi Electronics | Active | Active |
Engineering Selection Recommendations
For Through-Hole DIP Package Retention:
LM339NE4 provides direct pin-compatible substitution in 14-DIP packaging with maintained RoHS3 compliance and active Texas Instruments support. This part is suitable for designs requiring through-hole assembly and standard operating temperature ranges (0°C to 70°C). Note that LM339NE4 shows discontinued status at DiGi Electronics; verify current availability through alternative distributors.
LM339AN offers through-hole DIP compatibility but carries RoHS non-compliance status and obsolete product classification. This part is not recommended for new designs or applications with RoHS compliance requirements.
For Surface-Mount SOIC Package Migration:
LM2901QS14-13 provides surface-mount 14-SOIC packaging with extended operating temperature range (-40°C to 125°C) and automotive AEC-Q100 qualification. This part maintains full RoHS3 compliance and active product status, making it suitable for designs transitioning to surface-mount assembly or requiring automotive-grade reliability.
LM2901S14-13 offers surface-mount 14-SOIC packaging with extended temperature range and active product status. Moisture sensitivity level (MSL 3, 168 hours) requires controlled storage conditions compared to the main part's unlimited MSL rating.
Compliance Considerations:
All recommended substitutes maintain REACH compliance and EAR99 export classification consistent with the LP339N/NOPB. RoHS3 compliance is preserved in LM339NE4, LM2901QS14-13, and LM2901S14-13, ensuring regulatory alignment for restricted substance applications.
Frequently Asked Questions (FAQ)
Q: Can LM339AN be used as a direct replacement for LP339N/NOPB?
A: LM339AN provides electrical and functional equivalence with identical 14-DIP through-hole packaging and pin configuration. However, LM339AN carries obsolete product status and RoHS non-compliance. Use only in legacy system maintenance where RoHS compliance is not required and component availability can be confirmed.
Q: What are the key differences between through-hole DIP and surface-mount SOIC substitutes?
A: Through-hole DIP substitutes (LM339NE4, LM339AN) maintain the original mounting technology and require through-hole PCB assembly. Surface-mount SOIC substitutes (LM2901QS14-13, LM2901S14-13) require surface-mount assembly equipment and offer extended operating temperature ranges (-40°C to 125°C versus 0°C to 70°C). SOIC packages occupy less board space and support automated assembly processes.
Q: Are the LM2901 series parts pin-compatible with LP339N/NOPB?
A: LM2901QS14-13 and LM2901S14-13 maintain functional equivalence and 14-pin configurations but use SOIC surface-mount packaging rather than DIP through-hole packaging. Pin assignments are functionally equivalent; however, PCB footprint redesign is required for assembly compatibility.
Q: What supply voltage limitations exist when substituting parts?
A: LM339AN supports 2V to 32V single supply (versus 2V to 36V for LP339N/NOPB) and ±1V to ±16V dual supply (versus ±1V to ±18V). LM339NE4 supports 2V to 30V single supply and ±1V to ±15V dual supply. Verify application supply voltage requirements fall within the substitute part's specified range before selection.
Q: Which substitute offers the best long-term availability and compliance?
A: LM2901QS14-13 combines active product status, RoHS3 compliance, automotive AEC-Q100 qualification, and extended operating temperature range. This part is recommended for new designs requiring long-term component availability and regulatory compliance. LM339NE4 provides through-hole compatibility with RoHS3 compliance but shows discontinued status at major distributors.
Q: How do quiescent current differences affect circuit design?
A: LP339N/NOPB specifies 100µA maximum quiescent current, while all substitute parts specify 2.5mA maximum. This 25-fold increase in quiescent current may impact low-power applications. Verify total circuit power consumption requirements before substitution in battery-powered or energy-constrained designs.
Q: What moisture sensitivity considerations apply to surface-mount substitutes?
A: LM2901QS14-13 carries MSL 1 (unlimited moisture sensitivity level), requiring no special storage precautions. LM2901S14-13 carries MSL 3 (168 hours), requiring controlled humidity storage and bake-out procedures before reflow soldering. Verify manufacturing and assembly process capabilities for MSL 3 component handling.
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