LMV932DR2G Equivalent & Substitute Parts

Part Overview

The LMV932DR2G is an active CMOS amplifier integrated circuit manufactured by onsemi, configured as a dual-channel (2 circuit) rail-to-rail operational amplifier in an 8-SOIC surface mount package. This device is classified as a linear amplifier and maintains Active product status with full RoHS3 compliance and unlimited moisture sensitivity rating (MSL 1).

Substitute parts are identified when design requirements permit operation within alternative electrical and mechanical parameter ranges while maintaining functional compatibility in the target application. Substitution becomes necessary when the primary part experiences supply constraints, when alternative packaging formats are required, or when performance specifications allow for components with different electrical characteristics.

Substiute Parts

LMV932DR2G
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Key Parameters

Parameter LMV932DR2G Unit
Amplifier Type CMOS
Number of Circuits 2
Output Type Rail-to-Rail
Slew Rate 0.35 V/µs
Gain Bandwidth Product 1.5 MHz
Current - Input Bias 1 nA
Voltage - Input Offset 1 mV
Current - Supply (x2 Channels) 75 µA
Current - Output / Channel 80 mA
Voltage - Supply Span (Min) 1.8 V
Voltage - Supply Span (Max) 5 V
Operating Temperature -40 to 125 °C
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154", 3.90mm Width)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the LMV932DR2G is determined by alignment across the following critical parameters:

Mandatory Compatibility Criteria:

  • Dual-channel configuration (2 circuits)
  • Rail-to-rail output capability
  • CMOS amplifier topology
  • Surface mount technology
  • Operating temperature range support
  • Supply voltage span compatibility (minimum 1.8 V to maximum 5 V or higher)
  • RoHS3 compliance and MSL 1 rating

Performance Parameter Ranges: Substitute parts are grouped based on slew rate, gain bandwidth product, input bias current, supply current, and output current capabilities. Parts with lower performance specifications (reduced slew rate, lower bandwidth) are suitable for applications with relaxed frequency response requirements. Parts with higher performance specifications provide enhanced bandwidth and slew rate performance for demanding signal processing applications.

Package Considerations: The primary part uses 8-SOIC packaging (0.154" width, 3.90mm). Substitute parts may employ 8-SOIC or 8-SOP packaging formats. Physical package dimensions must be verified for PCB layout compatibility.

Parameter Comparison

Part Number Manufacturer Amplifier Type Slew Rate (V/µs) GBW (MHz) Input Bias (pA/nA) Supply Current (µA/nA) Output Current (mA) Temp Range (°C) Package
LMV932DR2G onsemi CMOS 0.35 1.5 1 nA 75 µA 80 -40 to 125 8-SOIC (3.90mm)
BU7242F-E2 Rohm Semiconductor CMOS 0.4 0.9 1 pA 180 µA 12 -40 to 85 8-SOP (4.40mm)
BU7262F-E2 Rohm Semiconductor CMOS 1.1 2 1 pA 550 µA 12 -40 to 85 8-SOP (4.40mm)
BU7262SF-E2 Rohm Semiconductor CMOS 1.1 2 1 pA 550 µA 12 -40 to 105 8-SOP (4.40mm)
BU7266F-E2 Rohm Semiconductor CMOS 0.0024 0.004 1 pA 0.7 µA 4 -40 to 85 8-SOP (4.40mm)
BU7266SF-E2 Rohm Semiconductor CMOS 0.0024 0.004 1 pA 0.7 µA 4 -40 to 105 8-SOP (4.40mm)
BU7486F-E2 Rohm Semiconductor CMOS 10 10 1 pA 6000 µA 12 -40 to 105 8-SOP (4.40mm)
ISL28213FBZ Renesas Electronics Corporation General Purpose 1 2 3 pA 90 µA 22 -40 to 125 8-SOIC (3.90mm)
ISL28214FBZ Renesas Electronics Corporation General Purpose 2.5 5 3 pA 300 µA 31 -40 to 125 8-SOIC (3.90mm)
LMR932F-GE2 Rohm Semiconductor General Purpose 0.35 1.4 5 nA 140 µA 90 -40 to 85 8-SOP (4.40mm)
LMR932FJ-GE2 Rohm Semiconductor General Purpose 0.35 1.4 5 nA 140 µA 90 -40 to 85 8-SOP-J (3.90mm)

Engineering Selection Recommendations

Direct Substitution Candidates (Matching Temperature Range):

ISL28213FBZ and ISL28214FBZ from Renesas Electronics Corporation maintain the extended operating temperature range of -40°C to 125°C, matching the LMV932DR2G specification. Both devices employ 8-SOIC packaging with 3.90mm width, providing identical PCB footprint compatibility. ISL28213FBZ operates at 1 V/µs slew rate with 2 MHz bandwidth, while ISL28214FBZ provides enhanced performance at 2.5 V/µs slew rate with 5 MHz bandwidth. Both are classified as General Purpose amplifiers with rail-to-rail output and maintain RoHS3 compliance with MSL 1 rating.

Performance-Optimized Substitutes (Higher Bandwidth):

BU7262F-E2 and BU7262SF-E2 from Rohm Semiconductor deliver 2 MHz gain bandwidth product with 1.1 V/µs slew rate, exceeding the LMV932DR2G bandwidth specification. BU7262SF-E2 extends the operating temperature to -40°C to 105°C. Both employ 8-SOP packaging (4.40mm width) and maintain full RoHS3 compliance. These parts are suitable for applications requiring higher frequency response than the primary part.

Ultra-Low Power Substitutes:

BU7266F-E2 and BU7266SF-E2 from Rohm Semiconductor operate at 700 nA supply current with 4 kHz bandwidth, providing extreme power efficiency for battery-powered or energy-constrained applications. BU7266SF-E2 supports -40°C to 105°C operating range. These parts employ 8-SOP packaging and maintain RoHS3 compliance. Selection is appropriate only when application bandwidth requirements are limited to audio or DC signal processing.

High-Performance Substitutes:

BU7486F-E2 from Rohm Semiconductor provides 10 V/µs slew rate with 10 MHz bandwidth, supporting high-speed signal processing applications. Operating temperature range extends to -40°C to 105°C. Supply voltage minimum is 3 V (higher than LMV932DR2G at 1.8 V), requiring verification of circuit supply architecture. 8-SOP packaging (4.40mm) and RoHS3 compliance are maintained.

Lower-Performance Substitutes (Reduced Specifications):

BU7242F-E2 from Rohm Semiconductor operates at 0.9 MHz bandwidth with 0.4 V/µs slew rate, suitable for applications with relaxed frequency response requirements. Operating temperature range is -40°C to 85°C. 8-SOP packaging (4.40mm) and RoHS3 compliance are maintained.

General Purpose Alternatives:

LMR932F-GE2 and LMR932FJ-GE2 from Rohm Semiconductor provide 1.4 MHz bandwidth with 0.35 V/µs slew rate, closely matching LMV932DR2G performance. LMR932FJ-GE2 employs 8-SOP-J packaging with 3.90mm width, providing footprint compatibility. Operating temperature range is -40°C to 85°C. Both maintain RoHS3 compliance and MSL 1 rating.

All substitute parts maintain Active product status, RoHS3 compliance, and MSL 1 (Unlimited) moisture sensitivity rating, ensuring compatibility with standard manufacturing and storage protocols.

Frequently Asked Questions (FAQ)

Q: Can BU7262F-E2 replace LMV932DR2G in all applications?

A: BU7262F-E2 is electrically compatible as a dual-channel rail-to-rail CMOS amplifier with higher bandwidth (2 MHz vs. 1.5 MHz) and faster slew rate (1.1 V/µs vs. 0.35 V/µs). However, the operating temperature range is limited to -40°C to 85°C compared to LMV932DR2G at -40°C to 125°C. Substitution is valid only for applications operating within the -40°C to 85°C range. Package dimensions differ (8-SOP 4.40mm vs. 8-SOIC 3.90mm), requiring PCB layout verification.

Q: What is the difference between BU7262F-E2 and BU7262SF-E2?

A: Both parts are electrically identical with 2 MHz bandwidth and 1.1 V/µs slew rate. BU7262SF-E2 extends the operating temperature range to -40°C to 105°C and uses Tape & Reel packaging, while BU7262F-E2 operates to -40°C to 85°C with Cut Tape & Digi-Reel packaging. Selection depends on temperature requirements and packaging format compatibility with assembly processes.

Q: Is ISL28213FBZ a direct replacement for LMV932DR2G?

A: ISL28213FBZ maintains the extended temperature range (-40°C to 125°C) and uses identical 8-SOIC packaging (3.90mm width), providing direct PCB footprint compatibility. However, ISL28213FBZ is classified as a General Purpose amplifier rather than CMOS type, with 1 V/µs slew rate and 2 MHz bandwidth. Input bias current is 3 pA versus 1 nA for LMV932DR2G. Electrical performance is compatible for most applications, but device classification and input bias characteristics differ.

Q: When should BU7266F-E2 or BU7266SF-E2 be selected?

A: These ultra-low power devices (700 nA supply current) are selected exclusively for battery-powered or energy-harvesting applications where power consumption is the primary design constraint. The 4 kHz bandwidth and 0.0024 V/µs slew rate limit use to DC signal conditioning, audio frequency processing, or sensor signal amplification. These parts are unsuitable for applications requiring bandwidth above 4 kHz.

Q: What are the package compatibility considerations?

A: LMV932DR2G uses 8-SOIC packaging with 0.154" width (3.90mm). ISL28213FBZ, ISL28214FBZ, and LMR932FJ-GE2 maintain this 3.90mm width, providing direct footprint compatibility. BU7242F-E2, BU7262F-E2, BU7262SF-E2, BU7266F-E2, BU7266SF-E2, BU7486F-E2, and LMR932F-GE2 use 8-SOP packaging with 0.173" width (4.40mm), requiring PCB layout modification. Verify pad spacing and trace routing before substitution.

Q: Does supply voltage range affect substitution decisions?

A: LMV932DR2G operates from 1.8 V to 5 V. Most substitute parts support 1.8 V to 5.5 V, providing extended upper voltage margin. Exception: BU7486F-E2 requires minimum 3 V supply, incompatible with 1.8 V to 3 V applications. Verify circuit supply architecture before selecting BU7486F-E2.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. All listed substitute parts maintain RoHS3 compliance and MSL 1 (Unlimited) moisture sensitivity rating, matching LMV932DR2G environmental and regulatory specifications. No additional compliance verification is required for standard manufacturing environments.

Q: How do input bias current differences affect circuit design?

A: LMV932DR2G specifies 1 nA input bias current. Most Rohm Semiconductor substitutes (BU7242F-E2, BU7262F-E2, BU7262SF-E2, BU7266F-E2, BU7266SF-E2, BU7486F-E2) specify 1 pA, representing 1000-fold reduction. Renesas ISL28213FBZ and ISL28214FBZ specify 3 pA. Lower input bias current reduces input offset voltage drift and improves precision in high-impedance signal conditioning circuits. LMR932F-GE2 and LMR932FJ-GE2 specify 5 nA, intermediate between primary and substitute parts.

Q: What output current capability differences exist?

A: LMV932DR2G provides 80 mA per channel. ISL28214FBZ provides 31 mA, ISL28213FBZ provides 22 mA, and LMR932F-GE2/LMR932FJ-GE2 provide 90 mA. Rohm BU7242F-E2, BU7262F-E2, BU7262SF-E2, and BU7486F-E2 provide 12 mA. BU7266F-E2 and BU7266SF-E2 provide 4 mA. Output current capability must match load impedance requirements. Lower output current parts are unsuitable for driving low-impedance loads or capacitive loads requiring high transient current.

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