LMV761MA Equivalent & Substitute Parts

Part Overview

The LMV761MA is a general-purpose comparator IC manufactured by Texas Instruments, housed in an 8-SOIC surface-mount package. This device features push-pull output configuration with single/dual supply voltage range of 2.7V to 5V, making it suitable for precision signal comparison applications across industrial and consumer electronics. The part is currently in Last Time Buy status, indicating end-of-life production. Identifying qualified substitute parts ensures design continuity and supply chain reliability for ongoing production requirements.

Substiute Parts

LMV761MA

Texas InstrumentsIn Stock: 6823LMV761MA Datasheet

Current PartRFQ

LMV761MA/NOPB

National SemiconductorIn Stock: 2994LMV761MA/NOPB Datasheet

DirectRFQ

BU5255HFV-TR

Rohm SemiconductorIn Stock: 5674BU5255HFV-TR Datasheet

MFR RecommendedRFQ

BU7231SG-TR

ROHM SemiconductorIn Stock: 691BU7231SG-TR Datasheet

MFR RecommendedRFQ

MAX40004ANS02+T

Analog Devices Inc./Maxim IntegratedIn Stock: 2366MAX40004ANS02+T Datasheet

MFR RecommendedRFQ

MAX40005ANS02+

Analog Devices Inc./Maxim IntegratedIn Stock: 1185MAX40005ANS02+ Datasheet

MFR RecommendedRFQ

TC75S70L6X,LF

Toshiba Semiconductor and StorageIn Stock: 5958TC75S70L6X,LF Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the LMV761MA are qualified based on the following electrical and mechanical compatibility criteria:

Primary Substitution Criteria:

• Output Type: Push-Pull configuration
• Functional Category: General Purpose Comparator
• Supply Voltage Range: Minimum 2.7V to 5V overlap required
• Input Offset Voltage: Maximum specification ≤ 0.2mV acceptable for direct replacement
• Propagation Delay: Maximum ≤ 225ns for timing-critical applications
• Operating Temperature Range: Minimum -40°C to 125°C coverage
• RoHS3 Compliance: Required for regulatory alignment

Secondary Compatibility Factors:

• Package form factor (8-SOIC preferred for direct PCB compatibility; alternative packages acceptable with board redesign)
• Quiescent current specifications
• CMRR/PSRR performance levels

Substitute parts are grouped into two categories: direct pin-compatible replacements (same package) and functional equivalents (alternative packages requiring board layout modification).

Parameter Comparison

Engineering Selection Recommendations

Direct Pin-Compatible Replacement (No PCB Redesign Required):

LMV761MA/NOPB is the primary direct substitute. Manufactured by National Semiconductor, this part maintains identical electrical specifications (0.2mV input offset, 225ns propagation delay, 100dB CMRR/110dB PSRR) and 8-SOIC packaging. Both parts are ROHS3 compliant with unlimited moisture sensitivity rating. The LMV761MA/NOPB is in Active product status, ensuring long-term availability and supply continuity.

Functional Equivalents Requiring Board Layout Modification:

TC75S70L6X,LF (Toshiba) offers the closest performance match among alternative packages. It maintains push-pull output, general-purpose comparator classification, and ROHS3 compliance. Operating temperature range extends to -40°C to 85°C. Propagation delay of 800ns exceeds the original 225ns specification but remains acceptable for non-timing-critical applications. The 6-UFDFN package requires PCB redesign.

BU7231SG-TR (Rohm Semiconductor) provides extended supply voltage range (1.8V to 5.5V) and operates across -40°C to 105°C. Quiescent current is significantly lower at 15µA versus 700µA. The 5-SSOP package requires board layout modification. Input offset voltage of 11mV and propagation delay of 1.7µs represent performance trade-offs.

BU5255HFV-TR (Rohm Semiconductor) supports dual supply operation (±0.9V to 2.75V) and single supply (1.8V to 5.5V). Operating temperature limited to -40°C to 85°C. Quiescent current of 15mA is significantly higher than the original specification. The 5-HVSOF package requires PCB redesign.

MAX40004ANS02+T (Analog Devices Inc./Maxim Integrated) features ultra-low quiescent current of 1.3µA and operates across the full -40°C to 125°C temperature range. Propagation delay of 25µs is substantially longer, limiting use to low-frequency applications. The 4-WLP package is the smallest form factor, requiring significant board layout modification.

Compliance and Regulatory Status:

All substitute parts maintain ROHS3 compliance and EAR99 export classification, ensuring regulatory alignment with the original LMV761MA. All parts are classified as REACH Unaffected.

Frequently Asked Questions (FAQ)

Q: Can LMV761MA/NOPB be used as a direct replacement without PCB modification?

A: Yes. LMV761MA/NOPB is packaged in the same 8-SOIC form factor with identical pin configuration and electrical specifications. No PCB layout changes are required. Both parts are manufactured to the same functional standard with equivalent performance characteristics.

Q: What is the primary difference between LMV761MA and the Rohm alternatives (BU5255HFV-TR, BU7231SG-TR)?

A: The LMV761MA features superior input offset voltage (0.2mV versus 6-11mV) and faster propagation delay (225ns versus 1.6-1.7µs). Rohm parts offer extended supply voltage ranges and lower quiescent current in some configurations. Package form factors differ, requiring board redesign for Rohm substitutes.

Q: Is the MAX40004ANS02+T suitable for high-speed applications?

A: No. The MAX40004ANS02+T has a propagation delay of 25µs, which is approximately 111 times slower than the LMV761MA (225ns). This part is suitable only for low-frequency comparison applications where speed is not critical.

Q: Which substitute part has the lowest power consumption?

A: MAX40004ANS02+T offers the lowest quiescent current at 1.3µA. However, this part requires a 4-WLP package redesign and has significantly slower propagation delay. For applications requiring both low power and fast response, TC75S70L6X,LF provides a balanced alternative with 35µA quiescent current and 800ns propagation delay.

Q: Can substitute parts with different package types be used interchangeably?

A: No. Parts with different package types (8-SOIC, 5-SSOP, 5-HVSOF, 4-WLP, 6-UFDFN) require PCB layout and schematic redesign. Pin counts, pinout configurations, and footprints differ. Only LMV761MA/NOPB maintains identical packaging and pinout for direct substitution.

Q: What is the operating temperature limitation for substitute parts?

A: LMV761MA and LMV761MA/NOPB support -40°C to 125°C. TC75S70L6X,LF and BU5255HFV-TR are limited to -40°C to 85°C. BU7231SG-TR extends to -40°C to 105°C. MAX40004ANS02+T supports the full -40°C to 125°C range. Verify application temperature requirements before selection.

Q: Are all substitute parts ROHS3 compliant?

A: Yes. All listed substitute parts maintain ROHS3 compliance and REACH Unaffected status, matching the regulatory requirements of the original LMV761MA.