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LMV722MX Equivalent & Substitute Parts
Part Overview
The LMV722MX is a general-purpose operational amplifier featuring dual-channel configuration with rail-to-rail output capability in an 8-SOIC surface mount package. Manufactured by Texas Instruments, this device is classified as obsolete product status. Due to its obsolescence, identifying functionally equivalent and compatible substitute components is essential for design continuity, procurement flexibility, and long-term supply chain management. Substitute parts must maintain compatibility across electrical performance parameters, mechanical packaging, and thermal operating ranges to ensure seamless integration into existing circuit designs.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Amplifier Type | General Purpose | — |
| Number of Circuits | 2 | — |
| Output Type | Rail-to-Rail | — |
| Slew Rate | 5.25 | V/µs |
| Gain Bandwidth Product | 10 | MHz |
| Current - Input Bias | 260 | nA |
| Voltage - Input Offset | 80 | µV |
| Current - Supply (per channel) | 2.01 | mA |
| Current - Output / Channel | 52.6 | mA |
| Voltage - Supply Span (Min) | 2.2 | V |
| Voltage - Supply Span (Max) | 5.5 | V |
| Operating Temperature Range | -40 to 85 | °C |
| Package / Case | 8-SOIC (0.154", 3.90mm Width) | — |
| Mounting Type | Surface Mount | — |
Substitute Part Grouping Explanation
Substitute parts for the LMV722MX are categorized based on strict adherence to the following electrical and mechanical compatibility criteria:
Primary Substitution Criteria:
- Dual-channel configuration (2 circuits)
- Rail-to-rail output capability
- 8-SOIC or equivalent surface mount package (0.154" width, 3.90mm)
- Gain bandwidth product of 10 MHz or greater
- Supply voltage range encompassing 2.2V to 5.5V minimum
- Operating temperature range of -40°C to 85°C or broader
- General-purpose amplifier classification
Grouping Logic:
Group 1: Direct Electrical Equivalents (Active Status) Parts maintaining near-identical electrical specifications with active product status and modern compliance certifications. These components provide direct functional replacement with enhanced supply chain availability.
Group 2: Functional Equivalents with Performance Trade-offs Parts meeting core substitution criteria but with variations in specific parameters such as slew rate, input bias current, or supply current. These substitutes remain functionally compatible within the defined parameter envelope but may require circuit validation for performance-critical applications.
Group 3: Alternative Amplifier Architectures CMOS-based amplifiers offering rail-to-rail output and dual-channel configuration with different performance characteristics. These parts substitute based on functional requirements rather than parameter-for-parameter equivalence.
Parameter Comparison
| Part Number | Manufacturer | Amplifier Type | Slew Rate (V/µs) | GBW (MHz) | Input Bias (nA) | Input Offset (µV) | Supply Current (mA) | Output Current (mA) | Supply Min (V) | Supply Max (V) | Temp Range (°C) | Product Status | Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| LMV722MX | Texas Instruments | General Purpose | 5.25 | 10 | 260 | 80 | 2.01 | 52.6 | 2.2 | 5.5 | -40 to 85 | Obsolete | 8-SOIC |
| LMV722MX/NOPB | National Semiconductor | General Purpose | 5.25 | 10 | 260 | 80 | 2.01 | 52.6 | 2.2 | 5.5 | -40 to 85 | Active | 8-SOIC |
| AD8692ARZ | Analog Devices Inc. | General Purpose | 5.0 | 10 | 0.001 | 400 | 0.95 | 80 | 2.7 | 6.0 | -40 to 125 | Active | 8-SOIC |
| AD8692ARZ-REEL | Analog Devices Inc. | General Purpose | 5.0 | 10 | 0.001 | 400 | 0.95 | 80 | 2.7 | 6.0 | -40 to 125 | Active | 8-SOIC |
| LMV822AIDT | STMicroelectronics | General Purpose | 1.9 | 5.5 | 60 | 800 | 0.3 | 70 | 2.5 | 5.5 | -40 to 125 | Active | 8-SOIC |
| LMV822IDT | STMicroelectronics | General Purpose | 1.9 | 5.5 | 60 | 3500 | 0.3 | 70 | 2.5 | 5.5 | -40 to 125 | Active | 8-SOIC |
| LMR932F-GE2 | Rohm Semiconductor | General Purpose | 0.35 | 1.4 | 5 | 1000 | 0.14 | 90 | 1.8 | 5.0 | -40 to 85 | Active | 8-SOIC |
| MCP617-I/SN | Microchip Technology | CMOS | 0.08 | 0.19 | 5 | 150 | 0.019 | 17 | 2.3 | 5.5 | -40 to 85 | Active | 8-SOIC |
| BU7266F-E2 | Rohm Semiconductor | CMOS | 0.0024 | 0.004 | 1 | 1000 | 0.0007 | 4 | 1.8 | 5.5 | -40 to 85 | Active | 8-SOP |
| BU7266SF-E2 | Rohm Semiconductor | CMOS | 0.0024 | 0.004 | 1 | 1000 | 0.0007 | 4 | 1.8 | 5.5 | -40 to 105 | Active | 8-SOP |
| BU7486F-E2 | Rohm Semiconductor | CMOS | 10 | 10 | 1 | 1000 | 6 | 12 | 3.0 | 5.5 | -40 to 105 | Active | 8-SOP |
Engineering Selection Recommendations
Tier 1: Recommended Direct Substitutes
LMV722MX/NOPB (National Semiconductor) represents the optimal substitute for the obsolete LMV722MX. This part maintains identical electrical specifications across all critical parameters: 5.25V/µs slew rate, 10 MHz gain bandwidth product, 260 nA input bias current, and 80 µV input offset voltage. The component is packaged in the same 8-SOIC form factor and operates across the identical -40°C to 85°C temperature range. Product status is active with current manufacturing availability. This part provides direct pin-for-pin and functional compatibility without circuit modification requirements.
Tier 2: High-Performance Active Alternatives
AD8692ARZ and AD8692ARZ-REEL (Analog Devices Inc.) offer enhanced performance characteristics suitable for applications requiring extended temperature operation. These parts maintain the 10 MHz gain bandwidth product and 5V/µs slew rate comparable to the original specification. Key advantages include significantly lower input bias current (1 pA versus 260 nA), extended operating temperature range (-40°C to 125°C), and RoHS3 compliance. Supply voltage range extends to 6V maximum. These substitutes are appropriate for designs where improved temperature stability and lower input bias current provide circuit benefits. Both tube and reel packaging options are available.
Tier 3: Automotive-Qualified Alternatives
LMV822AIDT and LMV822IDT (STMicroelectronics) provide automotive-grade alternatives with AEC-Q100 qualification. These parts feature lower supply current (0.3 mA versus 2.01 mA), extended temperature range (-40°C to 125°C), and RoHS3 compliance. Trade-offs include reduced slew rate (1.9V/µs versus 5.25V/µs) and lower gain bandwidth product (5.5 MHz versus 10 MHz). These substitutes are suitable for power-sensitive applications and automotive environments where qualification status is required.
Tier 4: Low-Power and Ultra-Low-Power Options
LMR932F-GE2 (Rohm Semiconductor) and MCP617-I/SN (Microchip Technology) provide ultra-low supply current alternatives for battery-powered and energy-constrained applications. These parts sacrifice bandwidth and slew rate performance but deliver significant power consumption reduction. LMR932F-GE2 operates at 140 µA supply current with 1.4 MHz bandwidth. MCP617-I/SN operates at 19 µA supply current with 190 kHz bandwidth. These options are applicable only when bandwidth requirements can be relaxed.
Tier 5: Specialized CMOS Architectures
BU7266F-E2, BU7266SF-E2, and BU7486F-E2 (Rohm Semiconductor) represent CMOS-based amplifier architectures. BU7486F-E2 maintains 10 MHz bandwidth with 10V/µs slew rate, making it suitable for high-speed applications. BU7266 variants offer ultra-low power consumption (700 nA) but with significantly reduced bandwidth (4 kHz). These parts substitute based on functional requirements rather than parameter equivalence and require application-specific validation.
Compliance and Certification Considerations:
- RoHS Status: AD8692 series and STMicroelectronics LMV822 variants are RoHS3 compliant. Original LMV722MX is RoHS non-compliant.
- Automotive Qualification: LMV822AIDT and LMV822IDT carry AEC-Q100 qualification for automotive applications.
- Moisture Sensitivity: All listed parts maintain MSL 1 (Unlimited) rating.
- REACH Status: All parts are REACH Unaffected.
Frequently Asked Questions (FAQ)
Q1: Can LMV722MX/NOPB be used as a direct replacement for LMV722MX?
A: Yes. LMV722MX/NOPB is a direct functional and pin-for-pin equivalent. Electrical specifications, package type, and operating temperature range are identical. The primary difference is active product status versus obsolete status, making it the preferred substitute for procurement and long-term supply chain continuity.
Q2: What are the key differences between AD8692ARZ and the original LMV722MX?
A: AD8692ARZ maintains the 10 MHz gain bandwidth product and comparable slew rate (5V/µs versus 5.25V/µs). Primary differences include: significantly lower input bias current (1 pA versus 260 nA), higher input offset voltage (400 µV versus 80 µV), lower supply current (0.95 mA versus 2.01 mA), extended temperature range (-40°C to 125°C versus -40°C to 85°C), and RoHS3 compliance. These differences make AD8692ARZ suitable for temperature-sensitive and power-constrained applications.
Q3: Are the LMV822 variants suitable substitutes for high-speed applications?
A: LMV822AIDT and LMV822IDT are not optimal for high-speed applications. These parts feature reduced slew rate (1.9V/µs versus 5.25V/µs) and lower gain bandwidth product (5.5 MHz versus 10 MHz). They are better suited for applications prioritizing low power consumption, extended temperature operation, and automotive qualification over bandwidth performance.
Q4: What is the difference between 8-SOIC and 8-SOP packages?
A: Both are surface mount packages with 8 pins. The primary difference is physical dimensions: 8-SOIC measures 0.154" (3.90mm) width, while 8-SOP measures 0.173" (4.40mm) width. These dimensional differences may affect PCB layout compatibility. Verify footprint compatibility before substituting parts with different package designations.
Q5: Can CMOS amplifiers like BU7266 or MCP617 replace the LMV722MX?
A: CMOS amplifiers can substitute only in applications where bandwidth requirements are significantly relaxed. BU7266 variants operate at 4 kHz bandwidth with 700 nA supply current. MCP617 operates at 190 kHz bandwidth with 19 µA supply current. These parts are suitable for low-frequency signal conditioning and ultra-low-power applications but are not appropriate for 10 MHz bandwidth applications.
Q6: Which substitute offers the best balance of performance and compliance?
A: AD8692ARZ provides optimal balance for most applications. It maintains 10 MHz bandwidth and comparable slew rate, offers RoHS3 compliance, extends operating temperature to 125°C, and reduces supply current. For automotive applications, LMV822AIDT provides AEC-Q100 qualification with trade-offs in bandwidth and slew rate.
Q7: Are there supply chain advantages to selecting specific substitutes?
A: Yes. LMV722MX/NOPB offers the highest inventory availability (35,400 pieces) with active product status. AD8692ARZ variants and LMV822 series also maintain substantial inventory levels (1,105 to 25,200 pieces). Verify current inventory status with suppliers before final component selection.
Q8: What thermal considerations apply when substituting with extended temperature range parts?
A: Parts rated to 125°C (AD8692ARZ, LMV822 variants, BU7266SF-E2, BU7486F-E2) provide enhanced thermal margin in applications operating near maximum ambient temperature. However, extended temperature rating does not change circuit behavior within the original -40°C to 85°C operating window. Thermal benefits apply only when designs operate above 85°C.
Q9: How do input bias current differences affect circuit design?
A: Input bias current affects input impedance and DC offset calculations. LMV722MX specifies 260 nA, while AD8692ARZ specifies 1 pA. For high-impedance input circuits, the lower bias current of AD8692ARZ reduces DC offset errors. For standard impedance circuits (below 1 MΩ), the difference is negligible. Verify input impedance requirements before selecting based on bias current specifications.
Q10: What packaging options are available for each substitute?
A: LMV722MX/NOPB is supplied in Bulk packaging. AD8692ARZ is available in Tube packaging; AD8692ARZ-REEL is supplied in Cut Tape & Digi-Reel format. LMV822 variants are supplied in Tape & Reel or Cut Tape & Digi-Reel formats. Rohm and Microchip parts are supplied in Cut Tape & Digi-Reel or Tube formats. Verify packaging compatibility with assembly equipment and procurement requirements.
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