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LMV358IPWG4 Equivalent & Substitute Parts
Part Overview
The LMV358IPWG4 is a general-purpose operational amplifier manufactured by Texas Instruments, featuring dual circuits in an 8-TSSOP surface-mount package. This device delivers rail-to-rail output capability with a 1 MHz gain-bandwidth product, making it suitable for low-power analog signal processing applications across industrial, consumer, and automotive sectors.
The LMV358IPWG4 carries an Obsolete product status. Identifying functionally equivalent substitute parts is essential for design continuity, supply chain resilience, and long-term product support. This reference provides engineering-validated alternatives based on electrical performance, mechanical compatibility, and regulatory compliance.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Amplifier Type | General Purpose | — |
| Number of Circuits | 2 | — |
| Output Type | Rail-to-Rail | — |
| Slew Rate | 1 | V/µs |
| Gain Bandwidth Product | 1 | MHz |
| Current - Input Bias | 15 | nA |
| Voltage - Input Offset | 1.7 | mV |
| Current - Supply (x2 Channels) | 210 | µA |
| Current - Output / Channel | 40 | mA |
| Voltage - Supply Span (Min) | 2.7 | V |
| Voltage - Supply Span (Max) | 5.5 | V |
| Operating Temperature | -40 to 125 | °C |
| Mounting Type | Surface Mount | — |
| Package / Case | 8-TSSOP (0.173", 4.40mm Width) | — |
| RoHS Status | ROHS3 Compliant | — |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | — |
Substitute Part Grouping Explanation
Substitute parts for the LMV358IPWG4 are classified into two primary groups based on electrical and mechanical compatibility:
Group 1: Direct Electrical Equivalents (8-TSSOP Package)
These parts maintain identical or near-identical electrical specifications and use the same 8-TSSOP package footprint. They are pin-compatible and require no PCB redesign:
- LMV358IPW (Texas Instruments, Last Time Buy status)
- LMV358IPT (STMicroelectronics, Active status)
- LMV358LIPT (STMicroelectronics, Active status)
Substitution criteria: Slew Rate ≥ 0.45 V/µs, Gain Bandwidth Product ≥ 1 MHz, Output Type = Rail-to-Rail, Number of Circuits = 2, Package = 8-TSSOP, Operating Temperature range ≥ -40°C to 125°C.
Group 2: Functional Equivalents with Package Variants (8-MSOP / Alternative Packages)
These parts deliver equivalent electrical performance but use different surface-mount packages (8-MSOP, 8-VSSOP, 8-SSOP-B). PCB layout modification is required:
- AZV358GTR-E1 (Diodes Incorporated, Active status, 8-TSSOP)
- AZV358GTR-G1 (Diodes Incorporated, Active status, 8-TSSOP)
- AZV358MMTR-E1 (Diodes Incorporated, Active status, 8-MSOP)
- LMV358M8G-13 (Diodes Incorporated, Active status, 8-MSOP)
- BU7242FVM-TR (Rohm Semiconductor, Active status, 8-MSOP)
- BU7242SFVM-TR (Rohm Semiconductor, Active status, 8-MSOP)
- BU7486FV-E2 (Rohm Semiconductor, Active status, 8-SSOP-B)
Substitution criteria: Number of Circuits = 2, Output Type = Rail-to-Rail, Voltage Supply Span encompasses 2.7 V to 5.5 V minimum, Operating Temperature range ≥ -40°C to 85°C, RoHS3 Compliant.
Critical Substitution Parameters:
- Dual-circuit configuration (2 independent amplifiers per package)
- Rail-to-rail output capability
- Supply voltage compatibility (minimum 2.7 V, maximum 5.5 V)
- Surface-mount technology (SMD)
- RoHS3 and REACH compliance
- Package mechanical footprint (8-TSSOP or compatible 8-pin variants)
Parameter Comparison
| Part Number | Manufacturer | Amplifier Type | Slew Rate (V/µs) | GBW (MHz) | Input Bias (nA) | Input Offset (mV) | Supply Current (µA) | Output Current (mA) | Temp Range (°C) | Package | Status |
|---|---|---|---|---|---|---|---|---|---|---|---|
| LMV358IPWG4 | Texas Instruments | General Purpose | 1.0 | 1.0 | 15 | 1.7 | 210 | 40 | -40 to 125 | 8-TSSOP | Obsolete |
| LMV358IPW | Texas Instruments | General Purpose | 1.0 | 1.0 | 15 | 1.7 | 210 | 40 | -40 to 125 | 8-TSSOP | Last Time Buy |
| LMV358IPT | STMicroelectronics | General Purpose | 0.45 | 1.3 | 16 | 0.1 | 162 | 160 | -40 to 125 | 8-TSSOP | Active |
| LMV358LIPT | STMicroelectronics | General Purpose | 0.7 | 1.3 | 27 | 1.0 | 130 | 70 | -40 to 125 | 8-TSSOP | Active |
| AZV358GTR-E1 | Diodes Incorporated | General Purpose | 1.0 | 1.0 | 15 | 1.7 | 210 | 60 | -40 to 85 | 8-TSSOP | Active |
| AZV358GTR-G1 | Diodes Incorporated | General Purpose | 1.0 | 1.0 | 15 | 1.7 | 210 | 60 | -40 to 85 | 8-TSSOP | Active |
| AZV358MMTR-E1 | Diodes Incorporated | General Purpose | 1.0 | 1.0 | 15 | 1.7 | 210 | 60 | -40 to 85 | 8-MSOP | Active |
| LMV358M8G-13 | Diodes Incorporated | General Purpose | 1.0 | 1.0 | 15 | 1.7 | 190 | 90 | -40 to 125 | 8-MSOP | Active |
| BU7242FVM-TR | Rohm Semiconductor | CMOS | 0.4 | 0.9 | 1 | 1.0 | 180 | 12 | -40 to 85 | 8-MSOP | Active |
| BU7242SFVM-TR | Rohm Semiconductor | CMOS | 0.4 | 0.9 | 1 | 1.0 | 180 | 12 | -40 to 105 | 8-MSOP | Active |
| BU7486FV-E2 | Rohm Semiconductor | CMOS | 10.0 | 10.0 | 1 | 1.0 | 6 | 12 | -40 to 105 | 8-SSOP-B | Active |
Engineering Selection Recommendations
Tier 1: Recommended Direct Replacements (No PCB Modification Required)
For applications requiring immediate substitution with zero PCB redesign:
-
LMV358IPT (STMicroelectronics) — Active product status with extended temperature range (-40°C to 125°C). Delivers superior output current capability (160 mA vs. 40 mA) and lower input offset voltage (100 µV vs. 1.7 mV). Suitable for designs requiring enhanced drive capability and precision. RoHS3 and REACH compliant.
-
LMV358LIPT (STMicroelectronics) — Active product status. Maintains -40°C to 125°C operating range with reduced supply current (130 µA vs. 210 µA), beneficial for battery-powered applications. RoHS3 and REACH compliant.
-
AZV358GTR-E1 or AZV358GTR-G1 (Diodes Incorporated) — Active product status with identical electrical specifications to the original part. Both use 8-TSSOP package. Operating temperature limited to -40°C to 85°C. Higher output current (60 mA). RoHS3 and REACH compliant.
Tier 2: Functional Equivalents with Package Variants (PCB Layout Modification Required)
For designs permitting package changes:
-
LMV358M8G-13 (Diodes Incorporated) — Active product status. Maintains -40°C to 125°C operating range with 8-MSOP package. Delivers higher output current (90 mA). Suitable for space-constrained layouts. RoHS3 and REACH compliant.
-
AZV358MMTR-E1 (Diodes Incorporated) — Active product status with 8-MSOP package. Operating temperature -40°C to 85°C. RoHS3 and REACH compliant.
-
BU7242FVM-TR or BU7242SFVM-TR (Rohm Semiconductor) — Active CMOS amplifiers with ultra-low input bias current (1 pA). Reduced supply current (180 µA). Operating temperature -40°C to 85°C (BU7242FVM-TR) or -40°C to 105°C (BU7242SFVM-TR). Note: Lower slew rate (0.4 V/µs) and gain-bandwidth product (900 kHz) may limit high-frequency applications. RoHS3 and REACH compliant.
Tier 3: High-Performance Alternative (Significantly Different Electrical Characteristics)
- BU7486FV-E2 (Rohm Semiconductor) — Active CMOS amplifier with substantially higher slew rate (10 V/µs) and gain-bandwidth product (10 MHz). Reduced supply current (6 mA). Operating temperature -40°C to 105°C. 8-SSOP-B package requires PCB redesign. Suitable only for applications requiring higher bandwidth and faster transient response. RoHS3 and REACH compliant.
Selection Criteria Summary:
- Product Status Priority: Favor Active status parts (LMV358IPT, LMV358LIPT, AZV358 series, BU7242 series, BU7486FV-E2) over Last Time Buy (LMV358IPW) or Obsolete (LMV358IPWG4) for long-term supply assurance.
- Temperature Range: Select -40°C to 125°C variants (LMV358IPT, LMV358LIPT, LMV358M8G-13) for industrial applications requiring extended operating range.
- Output Current Requirements: Choose LMV358IPT (160 mA), LMV358M8G-13 (90 mA), or AZV358 variants (60 mA) if application demands exceed 40 mA per channel.
- Power Consumption: Select LMV358LIPT (130 µA) or BU7242 series (180 µA) for battery-powered or energy-constrained designs.
- Package Compatibility: Maintain 8-TSSOP footprint (LMV358IPT, LMV358LIPT, AZV358GTR-E1, AZV358GTR-G1) for drop-in replacement without PCB modification.
All recommended substitutes maintain RoHS3 compliance and REACH unaffected status, ensuring regulatory alignment with current environmental and hazardous substance directives.
Frequently Asked Questions (FAQ)
Q1: Can LMV358IPT directly replace LMV358IPWG4 without PCB modification?
A: Yes. Both parts use the 8-TSSOP package with identical pinout. LMV358IPT is pin-compatible and requires no PCB redesign. However, verify that your application can tolerate the lower slew rate (0.45 V/µs vs. 1.0 V/µs) and confirm that the enhanced output current capability (160 mA vs. 40 mA) does not introduce thermal or stability concerns in your circuit topology.
Q2: What is the key difference between AZV358GTR-E1 and AZV358GTR-G1?
A: Both parts are electrically identical and use the same 8-TSSOP package. The primary difference is internal manufacturing or qualification revision (E1 vs. G1). From an engineering substitution perspective, they are functionally interchangeable. Inventory availability and lead time may differ between variants.
Q3: Why do BU7242 and BU7486 parts have lower slew rates and gain-bandwidth products than the original LMV358IPWG4?
A: BU7242 and BU7486 are CMOS-based amplifiers, whereas LMV358IPWG4 is a general-purpose bipolar design. CMOS architectures prioritize ultra-low input bias current (1 pA vs. 15 nA) and reduced supply current, trading off slew rate and bandwidth. BU7242 is suitable for precision, low-power applications. BU7486 offers higher performance (10 V/µs, 10 MHz) for applications requiring faster response. Select based on your specific performance requirements.
Q4: Can I use LMV358M8G-13 (8-MSOP package) as a direct replacement?
A: No. LMV358M8G-13 uses an 8-MSOP package (0.118" width) instead of 8-TSSOP (0.173" width). While electrically compatible, the different package footprint requires PCB layout modification. Pin assignments are identical, but physical placement and trace routing must be redesigned. This substitution is viable only if PCB redesign is acceptable.
Q5: Which substitute part offers the best long-term supply assurance?
A: LMV358IPT (STMicroelectronics, Active status) and LMV358M8G-13 (Diodes Incorporated, Active status) both carry Active product status with no announced end-of-life dates. These parts are manufactured by established semiconductor suppliers with broad distribution networks. Avoid LMV358IPW (Last Time Buy status), which indicates limited future availability.
Q6: What is the operating temperature limitation of AZV358 parts, and does it affect my application?
A: AZV358GTR-E1, AZV358GTR-G1, and AZV358MMTR-E1 operate from -40°C to 85°C, compared to the original LMV358IPWG4 range of -40°C to 125°C. If your application requires operation above 85°C, select LMV358IPT, LMV358LIPT, or LMV358M8G-13 (all rated to 125°C). For applications limited to ≤85°C, AZV358 variants are fully suitable.
Q7: Are all substitute parts RoHS3 compliant?
A: Yes. All substitute parts listed in this reference carry RoHS3 Compliant status and REACH Unaffected designation. They meet current environmental and hazardous substance restrictions applicable to electronic components sold in regulated markets.
Q8: What is the Moisture Sensitivity Level (MSL) difference, and does it matter?
A: LMV358IPWG4, LMV358IPW, LMV358IPT, and LMV358LIPT carry MSL 1 (Unlimited), meaning they tolerate unlimited shelf life without moisture baking. AZV358 and BU7242 variants carry MSL 3 (168 Hours), requiring moisture baking if shelf life exceeds 168 hours. For high-volume manufacturing with extended inventory, MSL 1 parts reduce handling complexity. MSL 3 parts require proper storage and baking procedures per IPC-A-610 standards.
Q9: Can I use BU7486FV-E2 in a design originally specified for LMV358IPWG4?
A: BU7486FV-E2 is functionally compatible but electrically different. It offers 10× higher slew rate (10 V/µs vs. 1 V/µs) and 10× higher gain-bandwidth product (10 MHz vs. 1 MHz), making it suitable for high-speed applications. However, lower output current (12 mA vs. 40 mA) and higher minimum supply voltage (3 V vs. 2.7 V) may limit applicability. Use BU7486FV-E2 only if your circuit requires enhanced bandwidth and can tolerate reduced output drive capability.
Q10: What packaging format should I specify when ordering substitute parts?
A: Packaging format affects handling, storage, and assembly processes. Common options include Cut Tape (CT), Tape & Reel (TR), and Tube. For high-volume production, specify Tape & Reel (TR) for automated pick-and-place assembly. For prototyping or low-volume builds, Cut Tape (CT) or Tube packaging is acceptable. Verify packaging availability with your distributor, as some variants may be offered in limited formats.
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