LMC6584BIN Equivalent & Substitute Parts

Part Overview

The LMC6584BIN is a CMOS amplifier integrated circuit manufactured by Texas Instruments, containing four independent operational amplifier circuits in a 14-pin DIP package. This device is classified as obsolete and is no longer in active production. The LMC6584BIN features rail-to-rail output capability and operates across a wide supply voltage range of 1.8V to 10V, making it suitable for low-power analog signal processing applications.

Due to its obsolete status, locating replacement units from original inventory becomes increasingly difficult. Identifying functionally equivalent substitute parts ensures design continuity and maintains system performance in applications where the LMC6584BIN is currently deployed or specified.

Substiute Parts

LMC6584BIN

Texas InstrumentsIn Stock: 1071LMC6584BIN Datasheet

Current PartRFQ

AD8534ARZ

Analog Devices Inc.In Stock: 15161AD8534ARZ Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the LMC6584BIN is determined by the following critical parameters:

Functional Equivalence Criteria:

• Four independent operational amplifier circuits
• Rail-to-rail output capability
• CMOS or general-purpose amplifier architecture
• Operating temperature range compatibility (-40°C to 85°C)

Electrical Performance Criteria:

• Supply voltage range overlap or compatibility
• Slew rate and gain bandwidth product sufficient for application requirements
• Input bias current and input offset voltage within acceptable tolerances
• Output current capability per channel

Physical and Compliance Criteria:

• Package form factor (through-hole DIP vs. surface-mount alternatives)
• RoHS and REACH compliance status
• Moisture sensitivity level

The AD8534ARZ qualifies as a manufacturer-recommended substitute based on matching the four-circuit configuration, rail-to-rail output, and identical operating temperature range. However, substitution requires evaluation of package compatibility and supply voltage range differences.

Parameter Comparison

Engineering Selection Recommendations

Product Status Consideration: The LMC6584BIN is classified as obsolete, whereas the AD8534ARZ maintains active production status. This distinction is significant for long-term supply chain planning and component availability.

Compliance and Certification: The AD8534ARZ is ROHS3 compliant, whereas the LMC6584BIN is RoHS non-compliant. Both devices are REACH unaffected and carry the same ECCN and HTSUS classifications. Selection of the AD8534ARZ aligns with modern regulatory requirements for electronic components in regulated markets.

Package Form Factor: The LMC6584BIN uses through-hole 14-DIP packaging, while the AD8534ARZ uses surface-mount 14-SOIC packaging. Direct pin-for-pin substitution on existing printed circuit boards designed for DIP packages requires either adapter solutions or circuit board redesign.

Electrical Performance Trade-offs: The AD8534ARZ demonstrates superior electrical characteristics in slew rate (5V/µs vs. 1.2V/µs), gain bandwidth product (3MHz vs. 1.2MHz), input bias current (5pA vs. 20pA), and output current per channel (250mA vs. 70mA). These improvements support higher-speed signal processing applications.

The AD8534ARZ operates within a narrower supply voltage range (2.7V to 6V) compared to the LMC6584BIN (1.8V to 10V). Applications requiring operation below 2.7V or above 6V cannot use the AD8534ARZ as a direct substitute.

Frequently Asked Questions (FAQ)

Q: Can the AD8534ARZ replace the LMC6584BIN in existing circuit boards?

A: Direct replacement on through-hole DIP-based circuit boards is not possible without adapter hardware or board redesign. The AD8534ARZ uses 14-SOIC surface-mount packaging, whereas the LMC6584BIN uses 14-DIP through-hole packaging. Pin assignments are identical, but physical mounting methods differ fundamentally.

Q: What are the key electrical differences between these devices?

A: The AD8534ARZ provides higher slew rate (5V/µs vs. 1.2V/µs), higher gain bandwidth product (3MHz vs. 1.2MHz), lower input bias current (5pA vs. 20pA), and higher output current per channel (250mA vs. 70mA). The AD8534ARZ operates within a narrower supply voltage range (2.7V to 6V vs. 1.8V to 10V).

Q: Is the AD8534ARZ suitable for low-voltage applications below 2.7V?

A: No. The AD8534ARZ minimum supply voltage is 2.7V. Applications requiring operation at 1.8V or 2.4V must use the LMC6584BIN or identify alternative devices with lower minimum supply voltage specifications.

Q: What is the significance of the RoHS compliance difference?

A: The AD8534ARZ is ROHS3 compliant, meeting current regulatory requirements for electronic components in the European Union and other regulated markets. The LMC6584BIN is RoHS non-compliant. New designs should prioritize RoHS-compliant components; existing systems using non-compliant components may face restrictions on distribution or use in certain jurisdictions.

Q: Are the four amplifier circuits within each device independently functional?

A: Yes. Both the LMC6584BIN and AD8534ARZ contain four independent operational amplifier circuits. Each circuit operates independently with separate input and output connections, allowing flexible configuration for single-stage, multi-stage, or parallel amplification topologies.

Q: What mounting considerations apply when transitioning from DIP to SOIC packaging?

A: Through-hole DIP packages mount vertically through circuit board holes and are suitable for breadboard prototyping and legacy board designs. Surface-mount SOIC packages require reflow soldering equipment and are standard in modern manufacturing. Circuit board layout, thermal management, and assembly processes differ significantly between these packaging types.