LMC6482MMD8 Equivalent & Substitute Parts

Part Overview

The LMC6482MMD8 is an ultra-low bias current, precision CMOS amplifier manufactured by Texas Instruments. This device features two circuits with rail-to-rail output capability, designed for applications requiring minimal input bias current and low-noise signal conditioning. The part is supplied in die form (unpackaged semiconductor die) and maintains Active product status.

Substitute parts are necessary when die-form packaging is unsuitable for the application, when higher inventory availability is required, or when alternative package configurations better serve manufacturing and assembly requirements. The LMC6482AIMX/NOPB provides equivalent core functionality in a standard 8-SOIC surface-mount package with significantly higher stock availability.

Substiute Parts

LMC6482MMD8

Texas InstrumentsIn Stock: 1201LMC6482MMD8 Datasheet

Current PartRFQ

LMC6482AIMX/NOPB

Texas InstrumentsIn Stock: 65307LMC6482AIMX/NOPB Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the LMC6482MMD8 is determined by the following core electrical and mechanical parameters:

Electrical Equivalence Criteria:

• Amplifier Type: CMOS (determines input/output characteristics)
• Number of Circuits: 2 (dual-channel requirement)
• Output Type: Rail-to-Rail (output swing specification)
• Slew Rate: 1.3 V/µs (transient response)
• Supply Voltage Range: 3 V to 15.5 V (operating envelope)
• Output Current: 30 mA per channel (drive capability)

Mechanical & Packaging Criteria:

• Mounting Type: Surface Mount (assembly compatibility)
• Product Status: Active (ongoing availability and support)
• Compliance: ROHS3 Compliant (regulatory requirement)

The LMC6482AIMX/NOPB qualifies as a direct substitute because it maintains all critical electrical parameters within the specified ranges and provides the same core functionality in a standard 8-SOIC package format. The primary difference is packaging configuration: the substitute transitions from die form to a fully packaged, ready-to-assemble surface-mount component.

Parameter Comparison

Engineering Selection Recommendations

LMC6482MMD8 (Die Form): Select this configuration when custom hybrid packaging, multi-chip modules, or specialized assembly processes are required. Die form is appropriate for high-volume applications where custom packaging justifies the integration complexity. This part maintains Active product status and ROHS3 compliance.

LMC6482AIMX/NOPB (8-SOIC Package): Select this configuration for standard PCB assembly, prototyping, and production environments utilizing conventional surface-mount technology. The 8-SOIC package provides immediate compatibility with automated pick-and-place equipment and standard reflow soldering processes. This substitute demonstrates superior performance in input bias current (0.02 pA versus 25 pA) and gain bandwidth product (1.5 MHz versus 1.25 MHz), while maintaining all core electrical specifications. Inventory availability is significantly higher (65,200 units versus 1,116 units). Both parts maintain Active product status and ROHS3 compliance.

The substitute part is suitable for direct functional replacement in applications where die-form packaging is not a design requirement.

Frequently Asked Questions (FAQ)

Q: Can the LMC6482AIMX/NOPB replace the LMC6482MMD8 in my application?

A: Yes, provided your application does not require die-form packaging. The LMC6482AIMX/NOPB maintains all critical electrical specifications: dual CMOS circuits, rail-to-rail output, 1.3 V/µs slew rate, 30 mA output current per channel, and 3 V to 15.5 V supply range. The substitute is packaged in 8-SOIC form, suitable for standard PCB assembly.

Q: What are the key differences between these parts?

A: The primary difference is packaging: LMC6482MMD8 is supplied as an unpackaged die; LMC6482AIMX/NOPB is supplied in 8-SOIC surface-mount package. The substitute offers improved input bias current (0.02 pA versus 25 pA) and higher gain bandwidth product (1.5 MHz versus 1.25 MHz). Operating temperature range differs: LMC6482MMD8 operates -55°C to 125°C; LMC6482AIMX/NOPB operates -40°C to 85°C.

Q: Are there temperature range considerations for substitution?

A: Yes. The LMC6482MMD8 supports extended temperature operation from -55°C to 125°C. The LMC6482AIMX/NOPB operates from -40°C to 85°C. If your application requires operation below -40°C or above 85°C, the die form is required.

Q: What is the inventory status of each part?

A: LMC6482MMD8 has 1,116 units in stock. LMC6482AIMX/NOPB has 65,200 units in stock. The packaged substitute offers significantly higher availability.

Q: Are both parts RoHS compliant?

A: Yes. Both LMC6482MMD8 and LMC6482AIMX/NOPB are ROHS3 compliant and maintain Active product status with Texas Instruments.

Q: What package format is the LMC6482AIMX/NOPB?

A: The LMC6482AIMX/NOPB is supplied in 8-SOIC (Small Outline Integrated Circuit) package with 0.154-inch body width and 3.90mm overall width. This is a standard surface-mount package compatible with automated assembly equipment.

Q: Can I use the LMC6482AIMX/NOPB in a die-bonding application?

A: No. The LMC6482AIMX/NOPB is a fully packaged component in 8-SOIC form. Applications requiring die-form semiconductor material must use LMC6482MMD8.