LMC6062I MDC Equivalent & Substitute Parts

Part Overview

The LMC6062I MDC is a CMOS amplifier integrated circuit featuring two independent circuits with push-pull, rail-to-rail output configuration. This die-format component is designed for applications requiring low input bias current and low input offset voltage in a compact form factor. The part is currently in Last Time Buy status, indicating discontinued production. Identification of equivalent substitute parts is necessary for design continuity, inventory management, and long-term product support.

Key Parameters

Parameter	Value	Unit
Amplifier Type	CMOS	—
Number of Circuits	2	—
Output Type	Push-Pull, Rail-to-Rail	—
Slew Rate	0.035	V/µs
Gain Bandwidth Product	100	kHz
Current - Input Bias	0.01	pA
Voltage - Input Offset	100	µV
Current - Supply (per Channel)	40	µA
Current - Output / Channel	35	mA
Voltage - Supply Span (Min)	4.5	V
Voltage - Supply Span (Max)	15.5	V
Operating Temperature Range	-40 to 85	°C (TJ)
Mounting Type	Surface Mount	—
Package / Case	Die	—
RoHS Status	ROHS3 Compliant	—

Substitute Part Grouping Explanation

Substitution of the LMC6062I MDC is determined by electrical and mechanical parameter equivalence within the CMOS amplifier category. The critical parameters defining substitutability are:

Amplifier Type: CMOS topology
Circuit Count: Dual-channel configuration (2 circuits)
Output Configuration: Push-pull, rail-to-rail output
Electrical Performance: Slew rate (0.035 V/µs), gain bandwidth product (100 kHz), input bias current (0.01 pA), input offset voltage (100 µV)
Supply Voltage Range: 4.5 V to 15.5 V operation
Output Current Capability: 35 mA per channel minimum
Temperature Range: -40°C to 85°C (TJ)
Compliance: RoHS3 and REACH requirements

The LMC6062IMX/NOPB is identified as the manufacturer-recommended substitute. This part maintains identical electrical specifications and core functionality while differing in package format (8-SOIC versus die) and product status (Active versus Last Time Buy).

Parameter Comparison

Parameter	LMC6062I MDC (Main Part)	LMC6062IMX/NOPB (Substitute)	Unit
Manufacturer	Texas Instruments	Texas Instruments	—
Category	Linear, Amplifiers	Linear, Amplifiers	—
Series	LMC®	LMC®	—
Amplifier Type	CMOS	CMOS	—
Number of Circuits	2	2	—
Output Type	Push-Pull, Rail-to-Rail	Push-Pull, Rail-to-Rail	—
Slew Rate	0.035	0.035	V/µs
Gain Bandwidth Product	100	100	kHz
Current - Input Bias	0.01	0.01	pA
Voltage - Input Offset	100	100	µV
Current - Supply (per Channel)	40	40	µA
Current - Output / Channel	35	35	mA
Voltage - Supply Span (Min)	4.5	4.5	V
Voltage - Supply Span (Max)	15.5	15.5	V
Operating Temperature Range	-40 to 85	-40 to 85	°C (TJ)
Mounting Type	Surface Mount	Surface Mount	—
Package / Case	Die	8-SOIC (0.154", 3.90mm Width)	—
Product Status	Last Time Buy	Active	—
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	—
REACH Status	REACH Unaffected	REACH Unaffected	—

Engineering Selection Recommendations

The LMC6062IMX/NOPB is the direct electrical equivalent to the LMC6062I MDC. Both parts are manufactured by Texas Instruments, belong to the LMC® series, and maintain identical electrical specifications across all critical parameters including slew rate, gain bandwidth product, input bias current, input offset voltage, supply current, output current, supply voltage range, and operating temperature range.

The primary distinction is packaging format: the main part is supplied as a die, while the substitute is packaged in 8-SOIC form factor. This packaging difference requires circuit board redesign and assembly process modification if substitution is implemented.

The LMC6062IMX/NOPB holds Active product status, ensuring continued availability and manufacturing support, whereas the LMC6062I MDC is in Last Time Buy status. Both parts satisfy RoHS3 and REACH compliance requirements.

Selection of the LMC6062IMX/NOPB is appropriate for new designs, production continuity, and long-term supply chain stability. Die-format applications requiring the LMC6062I MDC specification must source remaining inventory or implement circuit redesign to accommodate the 8-SOIC package.

Frequently Asked Questions (FAQ)

Q: Can the LMC6062IMX/NOPB directly replace the LMC6062I MDC in existing designs?

A: Electrical substitution is complete; all functional parameters are identical. Physical substitution requires circuit board redesign due to package format difference (die versus 8-SOIC). The 8-SOIC package includes integrated leads and solder pads, whereas the die format requires direct die attachment and wire bonding.

Q: What is the significance of the Last Time Buy status on the LMC6062I MDC?

A: Last Time Buy status indicates that Texas Instruments has discontinued production of this part. Existing inventory will be depleted, and no future manufacturing runs are planned. Users must transition to alternative parts or secure remaining stock for legacy applications.

Q: Are there electrical performance differences between the die and 8-SOIC package versions?

A: No. The LMC6062I MDC and LMC6062IMX/NOPB maintain identical electrical specifications. Package format does not affect amplifier performance parameters.

Q: What are the compliance implications of substituting these parts?

A: Both parts are ROHS3 Compliant and REACH Unaffected. Substitution does not introduce compliance risk for either regulation.

Q: Is the LMC6062IMX/NOPB suitable for high-volume production?

A: Yes. The LMC6062IMX/NOPB holds Active product status with 5251 pieces in current inventory, supporting production requirements. The die format LMC6062I MDC has limited remaining inventory (930 pieces) and is not recommended for new production commitments.

Q: What is the Moisture Sensitivity Level (MSL) of the substitute part?

A: The LMC6062IMX/NOPB has MSL 1 (Unlimited), indicating no moisture sensitivity restrictions during storage or handling.

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