LM75ADP/DG,118 Equivalent & Substitute Parts

Part Overview

The LM75ADP/DG,118 is a digital temperature sensor manufactured by NXP USA Inc., designed for local temperature measurement across the -55°C to 125°C range with 11-bit resolution and I2C output interface. This part is classified as obsolete, making equivalent substitute parts necessary for new designs and ongoing production requirements. The sensor operates on supply voltages between 2.8V and 5.5V, featuring programmable limits, output switching, and shutdown mode capabilities in an 8-TSSOP surface mount package.

Key Parameters

Parameter	Value
Sensor Type	Digital, Local
Sensing Temperature Range	-55°C ~ 125°C
Output Type	I2C
Supply Voltage	2.8V ~ 5.5V
Resolution	11 bits
Accuracy	±2°C (±3°C)
Package Type	8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type	Surface Mount
Features	Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
RoHS Status	ROHS3 Compliant

Substitute Part Grouping Explanation

Substitute parts for the LM75ADP/DG,118 are qualified based on the following electrical and mechanical parameters:

Core Compatibility Criteria:

Sensor type: Digital, Local temperature measurement
Temperature range: -55°C to 125°C operating capability
Output interface: I2C or I2C/SMBus compatible
Resolution: 11-bit minimum
Package: 8-TSSOP or 8-MSOP footprint compatibility
Supply voltage: Minimum 2.8V operation requirement
Surface mount configuration

Substitute Categories:

Direct Equivalent (NXP Variant): LM75ADP,118 maintains identical electrical specifications and package configuration as the main part, with active product status and improved inventory availability.

Microchip AT30TS Series: AT30TS74-XM8M-B, AT30TS74-XM8M-T, AT30TS750A-XM8M-B, AT30TS750A-XM8M-T, AT30TS75A-XM8M-T meet all core compatibility criteria with enhanced supply voltage range (1.7V ~ 5.5V) and active product status. These parts support I2C/SMBus protocol and maintain 11-bit resolution with identical package footprint.

Microchip AT30TSE Series: AT30TSE752A-XM8M-B, AT30TSE754A-XM8M-B, AT30TSE754A-XM8M-T, AT30TSE758A-XM8M-T provide equivalent functionality with improved accuracy specifications (±1°C) and active product status. All maintain 8-TSSOP/MSOP package compatibility and I2C/SMBus interface.

Parameter Comparison

Part Number	Manufacturer	Product Status	Sensor Type	Temperature Range	Output Type	Supply Voltage	Resolution	Accuracy	Package	RoHS Status
LM75ADP/DG,118	NXP USA Inc.	Obsolete	Digital, Local	-55°C ~ 125°C	I2C	2.8V ~ 5.5V	11 b	±2°C (±3°C)	8-TSSOP	ROHS3
LM75ADP,118	NXP USA Inc.	Active	Digital, Local	-55°C ~ 125°C	I2C	2.8V ~ 5.5V	11 b	±2°C (±3°C)	8-TSSOP	ROHS3
AT30TS74-XM8M-B	Microchip Technology	Active	Digital, Local	-55°C ~ 125°C	I2C/SMBus	1.7V ~ 5.5V	11 b	±2°C (±3°C)	8-TSSOP/MSOP	ROHS3
AT30TS74-XM8M-T	Microchip Technology	Active	Digital, Local	-55°C ~ 125°C	I2C/SMBus	1.7V ~ 5.5V	11 b	±2°C (±3°C)	8-TSSOP/MSOP	ROHS3
AT30TS750A-XM8M-B	Microchip Technology	Active	Digital, Local	-55°C ~ 125°C	I2C/SMBus	1.7V ~ 5.5V	11 b	±1°C (±3°C)	8-TSSOP/MSOP	ROHS3
AT30TS750A-XM8M-T	Microchip Technology	Active	Digital, Local	-55°C ~ 125°C	I2C/SMBus	1.7V ~ 5.5V	11 b	±1°C (±3°C)	8-TSSOP/MSOP	ROHS3
AT30TS75A-XM8M-T	Microchip Technology	Active	Digital, Local	-55°C ~ 125°C	I2C/SMBus	1.7V ~ 5.5V	11 b	±1°C (±3°C)	8-TSSOP/MSOP	ROHS3
AT30TSE752A-XM8M-B	Microchip Technology	Active	Digital, Local	-55°C ~ 125°C	I2C/SMBus	1.7V ~ 5.5V	11 b	±1°C (±3°C)	8-TSSOP/MSOP	ROHS3
AT30TSE754A-XM8M-B	Microchip Technology	Active	Digital, Local	-55°C ~ 125°C	I2C/SMBus	1.7V ~ 5.5V	11 b	±1°C (±3°C)	8-TSSOP/MSOP	ROHS3
AT30TSE754A-XM8M-T	Microchip Technology	Active	Digital, Local	-55°C ~ 125°C	I2C/SMBus	1.7V ~ 5.5V	11 b	±1°C (±3°C)	8-TSSOP/MSOP	ROHS3
AT30TSE758A-XM8M-T	Microchip Technology	Active	Digital, Local	-55°C ~ 125°C	I2C/SMBus	1.7V ~ 5.5V	11 b	±1°C (±3°C)	8-TSSOP/MSOP	ROHS3

Engineering Selection Recommendations

Primary Recommendation: LM75ADP,118 (NXP USA Inc.) provides the most direct substitution path, maintaining identical electrical specifications and package configuration while offering active product status and significantly higher inventory availability (5800 pcs vs. 1029 pcs for the obsolete variant).

Secondary Recommendations: Microchip AT30TS74-XM8M-T and AT30TSE754A-XM8M-T offer active product status with extensive inventory (33,100 pcs and 5,831 pcs respectively). These parts maintain full electrical compatibility with enhanced supply voltage range (1.7V minimum vs. 2.8V) and I2C/SMBus protocol support. The AT30TSE754A-XM8M-T variant provides improved accuracy specification (±1°C) while maintaining all other parameters.

Compliance Considerations: All substitute parts maintain ROHS3 compliance and REACH unaffected status, matching the original part's regulatory requirements. Moisture sensitivity levels vary between MSL 1 (unlimited) and MSL 3 (168 hours), which may impact storage and handling procedures depending on packaging format selection.

Packaging Format Selection: Cut Tape (CT) & Digi-Reel® packaging (LM75ADP,118 and AT30TS74-XM8M-T) supports automated assembly processes. Tube packaging (AT30TS74-XM8M-B, AT30TS750A-XM8M-B, AT30TSE752A-XM8M-B, AT30TSE754A-XM8M-B) accommodates manual assembly and lower-volume applications. Tape & Reel (TR) packaging (AT30TS750A-XM8M-T, AT30TS75A-XM8M-T, AT30TSE754A-XM8M-T, AT30TSE758A-XM8M-T) provides high-volume production capability.

Frequently Asked Questions (FAQ)

Q: Can AT30TS74 and AT30TSE754A parts be used interchangeably with LM75ADP/DG,118?

A: Yes, both Microchip series maintain electrical and mechanical compatibility. The AT30TS74 series matches the original accuracy specification (±2°C), while AT30TSE754A provides improved accuracy (±1°C). All support I2C/SMBus protocol and operate across the -55°C to 125°C range in identical 8-TSSOP/MSOP packages.

Q: What is the difference between AT30TS750A and AT30TS75A variants?

A: Both variants provide ±1°C accuracy and identical electrical specifications. The primary difference is moisture sensitivity level: AT30TS750A-XM8M-T specifies MSL 1 (unlimited storage), while AT30TS75A-XM8M-T specifies MSL 3 (168 hours). Selection depends on storage duration and environmental conditions prior to assembly.

Q: Are there supply voltage compatibility concerns when substituting with Microchip parts?

A: No. Microchip AT30TS and AT30TSE series support 1.7V to 5.5V supply range, which encompasses the original part's 2.8V to 5.5V requirement. This provides additional design flexibility for lower-voltage applications.

Q: How do packaging formats affect component selection?

A: Packaging format selection depends on assembly methodology. Cut Tape & Digi-Reel® formats (LM75ADP,118, AT30TS74-XM8M-T) integrate with automated pick-and-place systems. Tube packaging accommodates manual assembly. Tape & Reel format supports high-volume production runs. All formats maintain identical electrical and mechanical specifications.

Q: What is the significance of the obsolete status for LM75ADP/DG,118?

A: Obsolete status indicates NXP has discontinued this specific variant. The active LM75ADP,118 variant (without the DG suffix) provides identical functionality with ongoing manufacturer support and superior inventory availability, making it the preferred direct replacement.

Q: Do all substitute parts maintain the same feature set?

A: Yes. All listed substitutes support output switching, programmable limits, programmable resolution, and shutdown mode. Microchip variants add one-shot capability as an additional feature. All parts maintain 11-bit resolution and I2C/SMBus protocol compatibility.

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