LM5100AMR/NOPB Equivalent & Substitute Parts

Part Overview

The LM5100AMR/NOPB is a half-bridge gate driver IC manufactured by Texas Instruments, designed for driving N-channel MOSFETs in half-bridge configurations. This device operates with a supply voltage range of 9V to 14V and delivers peak output currents of 3A for both source and sink operations. The part is classified as Last Time Buy, indicating end-of-life status. Identifying equivalent and substitute parts is necessary to ensure design continuity and maintain supply chain reliability for applications requiring half-bridge gate driver functionality.

Substiute Parts

LM5100AMR/NOPB

Texas InstrumentsIn Stock: 1907LM5100AMR/NOPB Datasheet

Current PartRFQ

UCC27200ADDAR

Texas InstrumentsIn Stock: 3263UCC27200ADDAR Datasheet

MFR RecommendedRFQ

HIP2100EIBZ

Renesas Electronics CorporationIn Stock: 25739HIP2100EIBZ Datasheet

MFR RecommendedRFQ

HIP2100IBZ

Renesas Electronics CorporationIn Stock: 21977HIP2100IBZ Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the LM5100AMR/NOPB is determined by the following critical parameters: half-bridge driven configuration, independent channel type, 2-driver count, N-channel MOSFET gate type, non-inverting input type, and compatible package form factor (8-PowerSOIC or 8-SOIC with 0.154" width and 3.90mm pitch).

The substitute parts identified—UCC27200ADDAR, HIP2100EIBZ, and HIP2100IBZ—maintain these core functional and mechanical specifications. Variations in supply voltage range, peak output current, rise/fall time characteristics, and operating temperature limits represent performance differences that must be evaluated against specific application requirements but do not preclude substitution within the defined electrical and mechanical constraints.

Parameter Comparison

Engineering Selection Recommendations

UCC27200ADDAR is the manufacturer-recommended primary substitute from Texas Instruments. This part maintains identical half-bridge gate driver functionality with compatible package form factor and extends the supply voltage operating range to 8V ~ 17V, providing broader application flexibility. The part is in Active product status with established supply chain availability.

HIP2100EIBZ and HIP2100IBZ are functionally equivalent alternatives from Renesas Electronics Corporation. Both maintain the required half-bridge configuration, independent channel topology, and non-inverting input characteristics. The primary distinction between these two Renesas options is the exposed pad variant (HIP2100EIBZ) versus standard package (HIP2100IBZ). Both are in Active product status. Applications requiring peak output currents of 2A or less can utilize these parts without performance compromise. The extended operating temperature range (-55°C ~ 150°C) of the Renesas devices provides enhanced thermal margin for demanding environments.

All substitute parts carry ROHS3 compliance and REACH Unaffected status, maintaining regulatory alignment with the original part.

Frequently Asked Questions (FAQ)

Q: Can UCC27200ADDAR directly replace LM5100AMR/NOPB in existing designs?

A: Yes. UCC27200ADDAR maintains identical half-bridge gate driver functionality, compatible 8-PowerSOIC package footprint, and equivalent electrical performance. The extended supply voltage range (8V ~ 17V versus 9V ~ 14V) provides additional design margin without requiring circuit modifications.

Q: What is the key difference between HIP2100EIBZ and HIP2100IBZ?

A: HIP2100EIBZ includes an exposed pad for enhanced thermal dissipation, while HIP2100IBZ uses a standard 8-SOIC package without exposed pad. Both maintain identical electrical specifications and half-bridge gate driver functionality. Package selection depends on thermal management requirements of the specific application.

Q: Are the Renesas HIP2100 devices suitable for applications requiring 3A peak output current?

A: HIP2100EIBZ and HIP2100IBZ are rated for 2A peak output current (source and sink). Applications requiring 3A peak output current should use UCC27200ADDAR, which maintains the 3A specification of the original LM5100AMR/NOPB.

Q: Do all substitute parts require PCB layout modifications?

A: No. All substitute parts use compatible 8-PowerSOIC or 8-SOIC package form factors with identical 0.154" width and 3.90mm pitch. Direct footprint compatibility is maintained without PCB redesign.

Q: What is the operating temperature advantage of Renesas HIP2100 devices?

A: HIP2100EIBZ and HIP2100IBZ operate across -55°C ~ 150°C (TJ), compared to LM5100AMR/NOPB at -40°C ~ 125°C (TJ). This extended range accommodates applications in extreme thermal environments without performance degradation.

Q: Are all substitute parts RoHS and REACH compliant?

A: Yes. UCC27200ADDAR, HIP2100EIBZ, and HIP2100IBZ are all ROHS3 Compliant and REACH Unaffected, maintaining regulatory alignment with the original LM5100AMR/NOPB.