LM4040D82ILPR Equivalent & Substitute Parts

Part Overview

The LM4040D82ILPR is a shunt voltage reference IC manufactured by Texas Instruments, designed to provide a fixed 8.192V output with ±1% tolerance. This through-hole component operates across the industrial temperature range of -40°C to 85°C and is packaged in TO-92-3 (TO-226AA) formed leads configuration. The device is currently in Last Time Buy status, making identification of suitable alternatives essential for ongoing design support and procurement planning.

Substiute Parts

LM4040D82ILPR

Texas InstrumentsIn Stock: 3095LM4040D82ILPR Datasheet

Current PartRFQ

LM4040C82IDBZR

Texas InstrumentsIn Stock: 21070LM4040C82IDBZR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the LM4040D82ILPR is determined by the following critical parameters:

Electrical Compatibility Requirements:

• Fixed output voltage of 8.192V (non-negotiable)
• Output current capability of 15 mA minimum
• Operating temperature range of -40°C to 85°C minimum
• Shunt reference type architecture
• Noise specification of 130 µVrms (10Hz to 10kHz) or better

Mechanical & Packaging Considerations:

• Substitute parts may differ in mounting type (through-hole vs. surface mount)
• Package form factor may change based on application requirements
• Pin configuration must remain compatible with circuit topology

Compliance & Regulatory:

• RoHS3 compliance required
• REACH unaffected status maintained

The LM4040C82IDBZR qualifies as a direct electrical substitute while offering improved performance characteristics and different packaging options.

Parameter Comparison

Engineering Selection Recommendations

The LM4040C82IDBZR is electrically compatible with the LM4040D82ILPR and offers the following advantages:

Product Lifecycle Status: The LM4040C82IDBZR maintains Active product status, ensuring long-term availability and continued manufacturer support, whereas the LM4040D82ILPR is in Last Time Buy status.

Performance Improvements: The substitute part provides tighter tolerance (±0.5% vs. ±1%) and lower temperature coefficient (100 ppm/°C vs. 150 ppm/°C), resulting in improved output voltage stability across temperature variations.

Packaging Transition: The shift from through-hole TO-92-3 to surface-mount SOT-23-3 requires PCB redesign. This transition is appropriate for new designs or board revisions but necessitates layout modifications.

Compliance Continuity: Both parts maintain ROHS3 compliance and REACH unaffected status, ensuring regulatory requirements are met.

Frequently Asked Questions (FAQ)

Q: Can the LM4040C82IDBZR directly replace the LM4040D82ILPR without circuit modifications?

A: Electrical substitution is valid. The LM4040C82IDBZR provides the same 8.192V output, 15 mA current capability, and operating temperature range. However, the packaging differs (SOT-23-3 surface mount vs. TO-92-3 through hole), requiring PCB layout changes and different soldering processes.

Q: What is the significance of the tolerance difference (±1% vs. ±0.5%)?

A: The LM4040C82IDBZR offers tighter initial tolerance, meaning the output voltage will be closer to the nominal 8.192V value at room temperature. This improves system accuracy in applications sensitive to reference voltage precision.

Q: Does the temperature coefficient difference affect circuit performance?

A: The lower temperature coefficient of the LM4040C82IDBZR (100 ppm/°C vs. 150 ppm/°C) results in smaller output voltage drift across the -40°C to 85°C operating range. Applications requiring stable reference voltage over temperature variations benefit from this improvement.

Q: Are there any supply chain considerations for the LM4040C82IDBZR?

A: The LM4040C82IDBZR is in Active product status with significantly higher inventory availability (20,989 pcs vs. 2,994 pcs), providing better long-term procurement security and shorter lead times.

Q: What mounting considerations apply when switching from through-hole to surface mount?

A: Through-hole components (TO-92-3) are inserted into drilled holes and soldered on the opposite side. Surface-mount components (SOT-23-3) are placed directly on the PCB surface and reflow soldered. This requires different assembly equipment and PCB design, including appropriate pad sizing and solder mask openings.

Q: Is the cathode current difference (115 µA vs. 110 µA) significant?

A: The 5 µA difference is negligible for most applications. Both values fall within normal operating parameters for shunt reference circuits and do not affect circuit functionality or design considerations.