LFXP6E-4FN256C Equivalent & Substitute Parts

Part Overview

The LFXP6E-4FN256C is an XP series Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation, featuring 188 I/O pins and 6000 logic elements in a 256-BGA package. This device is classified as obsolete, making equivalent and substitute parts necessary for ongoing design support and production continuity. The LFXP6E-4FN256C operates at 1.14V to 1.26V supply voltage with a maximum operating temperature of 85°C.

Substiute Parts

LFXP6E-4FN256C

Lattice Semiconductor CorporationIn Stock: 8923LFXP6E-4FN256C Datasheet

Current PartRFQ

LFXP2-8E-5FTN256C

Lattice Semiconductor CorporationIn Stock: 15928LFXP2-8E-5FTN256C Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the LFXP6E-4FN256C is determined by the following critical parameters:

• Supply Voltage Compatibility: Both main and substitute parts must operate within 1.14V to 1.26V
• Package Type: Both parts use 256-pin BGA packages (256-FPBGA and 256-FTBGA are mechanically compatible 17x17 footprints)
• Operating Temperature Range: Both parts support 0°C to 85°C (TJ)
• Mounting Type: Both parts are surface mount devices
• I/O Pin Count: The substitute part provides 201 I/O pins, exceeding the original 188 I/O requirement
• Logic Element Capacity: The substitute part provides 8000 logic elements, exceeding the original 6000 element capacity
• RAM Capacity: The substitute part provides 226304 total RAM bits, exceeding the original 73728 bits

The LFXP2-8E-5FTN256C qualifies as a direct substitute based on electrical and mechanical compatibility within the specified parameter ranges.

Parameter Comparison

Engineering Selection Recommendations

The LFXP2-8E-5FTN256C is the qualified substitute for the obsolete LFXP6E-4FN256C based on the following factors:

• Electrical Compatibility: Identical supply voltage range (1.14V ~ 1.26V) and operating temperature range (0°C ~ 85°C)
• Package Compatibility: Both devices use 17x17 mm 256-pin BGA packages with identical footprints
• Enhanced Capacity: The substitute part provides increased logic elements (8000 vs. 6000), RAM (226304 vs. 73728 bits), and I/O pins (201 vs. 188), ensuring functional compatibility with designs originally targeting the LFXP6E-4FN256C
• Product Status: The substitute part is active and in production, ensuring long-term availability
• Regulatory Compliance: Both parts maintain REACH Unaffected status and identical MSL ratings

Frequently Asked Questions (FAQ)

Q: Can the LFXP2-8E-5FTN256C directly replace the LFXP6E-4FN256C on existing PCBs?

A: Yes. Both devices use identical 256-pin BGA packages with 17x17 mm footprints and matching pin assignments for the 188 I/O pins required by the original design. The substitute part's additional I/O pins and logic capacity do not affect compatibility.

Q: Are the supply voltage requirements identical?

A: Yes. Both parts operate within the same 1.14V to 1.26V supply voltage range and support identical operating temperatures from 0°C to 85°C.

Q: What is the difference between 256-FPBGA and 256-FTBGA packages?

A: Both designations refer to 256-pin Fine-Pitch Ball Grid Array packages with 17x17 mm dimensions. The FPBGA and FTBGA variants are mechanically and electrically compatible for PCB assembly purposes.

Q: Does the increased logic element count affect design compatibility?

A: No. The LFXP2-8E-5FTN256C provides 8000 logic elements compared to the original 6000, which represents additional capacity. Designs utilizing up to 6000 logic elements will function identically on the substitute part.

Q: Are moisture sensitivity levels the same?

A: Yes. Both parts carry MSL 3 rating with a 168-hour floor life, requiring identical handling and storage procedures.