LFXP6E-4F256C Equivalent & Substitute Parts

Part Overview

The LFXP6E-4F256C is an XP series Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, featuring 188 I/O pins, 6000 logic elements, and 73728 total RAM bits in a 256-BGA package. This device is classified as obsolete, making identification of compatible alternatives essential for ongoing system support and new design implementations.

Substiute Parts

LFXP6E-4F256C

Lattice Semiconductor CorporationIn Stock: 707LFXP6E-4F256C Datasheet

Current PartRFQ

LFXP2-8E-5FTN256C

Lattice Semiconductor CorporationIn Stock: 15928LFXP2-8E-5FTN256C Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the LFXP6E-4F256C is determined by the following critical parameters:

• Supply Voltage Compatibility: Both devices operate within 1.14V ~ 1.26V range
• Package Footprint: 256-pin BGA package (17x17mm) maintains PCB layout compatibility
• Mounting Type: Surface mount technology consistency
• Operating Temperature Range: 0°C ~ 85°C (TJ) operational envelope
• Moisture Sensitivity Level: MSL 3 (168 Hours) handling requirements

The LFXP2-8E-5FTN256C qualifies as a substitute based on these electrical and mechanical parameters. While the substitute device offers increased logic capacity (8000 elements vs. 6000), enhanced RAM (226304 bits vs. 73728), and additional I/O (201 vs. 188), these represent functional enhancements rather than incompatibilities. The substitute maintains identical voltage, temperature, package, and MSL specifications.

Parameter Comparison

Engineering Selection Recommendations

The LFXP2-8E-5FTN256C is the designated manufacturer-recommended substitute for the obsolete LFXP6E-4F256C. Selection of this alternative is supported by:

• Active Product Status: The substitute remains in active production, ensuring long-term availability and supply chain continuity
• Regulatory Compliance: ROHS3 compliance of the substitute addresses modern environmental and regulatory requirements, whereas the original device is RoHS non-compliant
• Electrical Compatibility: Identical supply voltage range (1.14V ~ 1.26V) and operating temperature specifications (0°C ~ 85°C) ensure direct functional compatibility
• Package Compatibility: Both devices utilize 256-pin BGA packages with identical MSL ratings, maintaining PCB assembly process compatibility
• Enhanced Specifications: The substitute provides increased logic capacity, RAM, and I/O count, offering design headroom for future requirements without electrical or thermal penalties

Frequently Asked Questions (FAQ)

Q: Can the LFXP2-8E-5FTN256C directly replace the LFXP6E-4F256C on existing PCBs?

A: Yes. Both devices share identical supply voltage (1.14V ~ 1.26V), operating temperature range (0°C ~ 85°C), and 256-pin BGA package specifications. PCB layout and power delivery designs remain compatible. Firmware or HDL designs may require validation to utilize the enhanced logic and RAM capacity of the substitute.

Q: What is the difference between 256-BGA and 256-LBGA packages?

A: Both designations refer to 256-pin ball grid array packages in 17x17mm form factor. The LBGA designation indicates a low-profile variant. Mechanical compatibility is maintained for standard PCB assembly processes.

Q: Why is the LFXP6E-4F256C classified as obsolete?

A: The XP series has been superseded by the XP2 series, which offers improved performance, enhanced specifications, and modern regulatory compliance. The LFXP2-8E-5FTN256C represents the current-generation equivalent.

Q: Does the increased I/O count (201 vs. 188) on the substitute create compatibility issues?

A: No. Additional I/O pins on the substitute do not create incompatibilities. Unused pins can remain unconnected. Designs utilizing fewer than 188 I/O require no modification.

Q: What is the impact of RoHS3 compliance on the substitute?

A: ROHS3 compliance ensures the substitute meets current environmental and hazardous substance restrictions. This is advantageous for new designs and systems requiring regulatory compliance documentation.