LFXP6C-4F256C Equivalent & Substitute Parts

Part Overview

The LFXP6C-4F256C is an XP series Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, featuring 188 I/O pins, 6000 logic elements, and 73728 total RAM bits in a 256-BGA package. This device is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and new design implementations.

Substiute Parts

LFXP6C-4F256C

Lattice Semiconductor CorporationIn Stock: 7237LFXP6C-4F256C Datasheet

Current PartRFQ

LCMXO2-7000HC-5FTG256C

Lattice Semiconductor CorporationIn Stock: 1158LCMXO2-7000HC-5FTG256C Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the LFXP6C-4F256C is determined by the following critical parameters:

• Logic element count (minimum 6000 cells required)
• Total RAM capacity (minimum 73728 bits)
• I/O pin count (minimum 188 pins)
• Supply voltage compatibility (overlap with 1.71V ~ 3.465V range)
• Package type (256-pin BGA form factor)
• Surface mount capability
• Operating temperature range (0°C ~ 85°C)

The LCMXO2-7000HC-5FTG256C meets these substitution criteria with equivalent or superior specifications across all critical parameters.

Parameter Comparison

Engineering Selection Recommendations

The LCMXO2-7000HC-5FTG256C is the designated manufacturer-recommended substitute for the obsolete LFXP6C-4F256C. Selection of this substitute is supported by the following factors:

• Active product status ensures long-term availability and supply chain continuity
• Logic element and RAM capacity exceed the original specification, providing design margin
• I/O pin count (206) exceeds the original requirement (188), accommodating expanded functionality
• Supply voltage range overlap (2.375V ~ 3.465V) maintains compatibility with existing power delivery systems
• Identical package pin count (256) and BGA form factor enable direct PCB layout compatibility
• ROHS3 compliance addresses regulatory requirements not met by the obsolete original part
• Identical operating temperature and MSL ratings ensure thermal and moisture handling equivalence

Frequently Asked Questions (FAQ)

Q: Can the LCMXO2-7000HC-5FTG256C be used as a direct replacement for the LFXP6C-4F256C?

A: The LCMXO2-7000HC-5FTG256C meets all critical substitution parameters: equivalent logic element capacity, superior RAM capacity, compatible I/O count, overlapping supply voltage range, identical package pin count, and matching thermal specifications. However, design verification is required to confirm FPGA configuration compatibility and firmware adaptation for the MachXO2 architecture.

Q: What is the difference between 256-BGA and 256-LBGA packaging?

A: Both packages contain 256 pins in a ball grid array format with identical 17x17mm dimensions. The LBGA designation indicates a low-profile variant. Pin-to-pin compatibility is maintained for PCB layout purposes.

Q: Does the lower minimum supply voltage of the LCMXO2-7000HC-5FTG256C affect compatibility?

A: The substitute part specifies a minimum supply voltage of 2.375V compared to the original 1.71V minimum. If your system operates below 2.375V, the substitute cannot be used. For systems operating at 2.375V or higher, the overlapping voltage range ensures full compatibility.

Q: Why does the substitute have more I/O pins (206 vs 188)?

A: The LCMXO2-7000HC-5FTG256C is a higher-capacity device within the same package family. The additional I/O pins provide expanded functionality but do not prevent substitution. Unused pins can remain unconnected in the design.

Q: Is firmware or configuration code modification required?

A: The LFXP6C-4F256C (XP series) and LCMXO2-7000HC-5FTG256C (MachXO2 series) are different FPGA architectures. FPGA bitstream files are not interchangeable. Design reconfiguration and recompilation using MachXO2-compatible development tools are necessary.