LFXP6C-3FN256I Equivalent & Substitute Parts

Part Overview

The LFXP6C-3FN256I is an XP series Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation, featuring 188 I/O pins and 6000 logic elements in a 256-BGA package. This device is classified as obsolete, making equivalent and substitute parts necessary for ongoing design support and procurement.

Substiute Parts

LFXP6C-3FN256I
Lattice Semiconductor CorporationIn Stock: 6368LFXP6C-3FN256I Datasheet
LFXP6C-3FN256I
Current Part
LCMXO2-7000HC-4FTG256I
Lattice Semiconductor CorporationIn Stock: 1403LCMXO2-7000HC-4FTG256I Datasheet
LCMXO2-7000HC-4FTG256I
MFR Recommended
LFXP2-8E-5FTN256I
Lattice Semiconductor CorporationIn Stock: 4915LFXP2-8E-5FTN256I Datasheet
LFXP2-8E-5FTN256I
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number LFXP6C-3FN256I
Manufacturer Lattice Semiconductor Corporation
Series XP
Product Status Obsolete
Number of Logic Elements/Cells 6000
Total RAM Bits 73728
Number of I/O 188
Voltage - Supply 1.71V ~ 3.465V
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitute parts for the LFXP6C-3FN256I are selected based on the following critical parameters that determine functional compatibility:

Package Compatibility: All substitute parts maintain the 256-BGA package form factor with 17x17 dimensions, ensuring mechanical and electrical compatibility with existing PCB layouts.

Operating Temperature Range: All substitute parts support the -40°C ~ 100°C operating temperature range, maintaining thermal performance requirements.

Mounting Type: All substitute parts use Surface Mount technology, consistent with the original device.

Moisture Sensitivity Level: All substitute parts maintain MSL 3 (168 Hours) classification.

I/O Pin Count and Logic Element Capacity: Substitute parts provide equal or greater I/O pin counts (188 or higher) and logic element capacity (6000 or higher), ensuring functional equivalence or enhancement.

Supply Voltage: Substitute parts operate within overlapping or compatible voltage ranges with the original device.

Parameter Comparison

Parameter LFXP6C-3FN256I (Main) LCMXO2-7000HC-4FTG256I LFXP2-8E-5FTN256I
Manufacturer Lattice Semiconductor Corporation Lattice Semiconductor Corporation Lattice Semiconductor Corporation
Series XP MachXO2 XP2
Product Status Obsolete Active Active
Number of Logic Elements/Cells 6000 6864 8000
Total RAM Bits 73728 245760 226304
Number of I/O 188 206 201
Voltage - Supply 1.71V ~ 3.465V 2.375V ~ 3.465V 1.14V ~ 1.26V
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Package / Case 256-BGA 256-LBGA 256-LBGA
Supplier Device Package 256-FPBGA (17x17) 256-FTBGA (17x17) 256-FTBGA (17x17)
Mounting Type Surface Mount Surface Mount Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours) 3 (168 Hours)
RoHS Status Not specified ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

LCMXO2-7000HC-4FTG256I: This substitute is an active product from Lattice Semiconductor Corporation's MachXO2 series. It provides 206 I/O pins and 6864 logic elements, exceeding the original device specifications. The device is ROHS3 compliant and maintains the same operating temperature range and MSL classification. This part is suitable for applications requiring enhanced logic capacity and I/O count.

LFXP2-8E-5FTN256I: This substitute is an active product from Lattice Semiconductor Corporation's XP2 series. It provides 201 I/O pins and 8000 logic elements, offering increased logic capacity compared to the original device. The device is ROHS3 compliant and maintains the same operating temperature range and MSL classification. Note that the supply voltage range differs (1.14V ~ 1.26V), requiring voltage regulation verification for existing designs.

Both substitute parts are active products with current manufacturing support, addressing the obsolescence of the original LFXP6C-3FN256I device.

Frequently Asked Questions (FAQ)

Q: Can the LCMXO2-7000HC-4FTG256I directly replace the LFXP6C-3FN256I?

A: The LCMXO2-7000HC-4FTG256I maintains package compatibility (256-BGA, 17x17), operating temperature range (-40°C ~ 100°C), and MSL classification. It provides additional I/O pins (206 vs. 188) and logic elements (6864 vs. 6000). Functional compatibility depends on design-specific requirements and firmware compatibility with the MachXO2 architecture.

Q: What are the key differences between the two substitute parts?

A: The LCMXO2-7000HC-4FTG256I (MachXO2 series) provides 206 I/O and 6864 logic elements with a supply voltage range of 2.375V ~ 3.465V. The LFXP2-8E-5FTN256I (XP2 series) provides 201 I/O and 8000 logic elements with a supply voltage range of 1.14V ~ 1.26V. Both maintain the same package form factor and operating temperature range.

Q: Are the substitute parts RoHS compliant?

A: Both substitute parts are ROHS3 compliant. The original LFXP6C-3FN256I RoHS status was not specified in the available data.

Q: Do the substitute parts have the same package dimensions?

A: All parts use 256-BGA packages with 17x17 dimensions, ensuring mechanical compatibility with existing PCB layouts. The package designations differ slightly (FPBGA vs. FTBGA/LBGA), but the physical footprint remains consistent.

Q: What is the impact of the different supply voltage ranges?

A: The LFXP2-8E-5FTN256I operates at 1.14V ~ 1.26V, which differs from the original device (1.71V ~ 3.465V) and the LCMXO2-7000HC-4FTG256I (2.375V ~ 3.465V). Designs using the LFXP2-8E-5FTN256I require voltage regulation verification to ensure compatibility with existing power delivery systems.

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