LFXP20E-5FN484C Equivalent & Substitute Parts

Part Overview

The LFXP20E-5FN484C is an XP series Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation. This device features 20,000 logic elements, 405,504 total RAM bits, and 340 I/O pins in a 484-BBGA package. The product is currently obsolete, which necessitates identification of functionally compatible alternatives for ongoing system support and new designs requiring equivalent or enhanced capabilities.

Substiute Parts

LFXP20E-5FN484C
Lattice Semiconductor CorporationIn Stock: 1019LFXP20E-5FN484C Datasheet
LFXP20E-5FN484C
Current Part
LFXP2-30E-5FN484C
Lattice Semiconductor CorporationIn Stock: 1121LFXP2-30E-5FN484C Datasheet
LFXP2-30E-5FN484C
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number LFXP20E-5FN484C
Manufacturer Lattice Semiconductor Corporation
Series XP
Logic Elements/Cells 20,000
Total RAM Bits 405,504
Number of I/O 340
Voltage Supply Range 1.14V ~ 1.26V
Package / Case 484-BBGA
Supplier Device Package 484-FPBGA (23x23)
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Product Status Obsolete

Substitute Part Grouping Explanation

The LFXP2-30E-5FN484C qualifies as a direct substitute based on the following alignment of critical parameters:

Package Compatibility: Both devices use the 484-BBGA package with identical 23x23mm footprint and Surface Mount mounting type, ensuring PCB-level compatibility without layout modifications.

Electrical Compatibility: Both devices operate within the same voltage supply range (1.14V ~ 1.26V) and share identical operating temperature specifications (0°C ~ 85°C TJ), enabling direct integration into existing power delivery and thermal management systems.

I/O Pin Count: The substitute provides 363 I/O pins compared to the original 340 I/O pins, representing a 6.8% increase that maintains backward compatibility while offering expanded I/O capacity.

Logic and Memory Resources: The substitute device provides enhanced resources with 29,000 logic elements (45% increase) and 396,288 RAM bits, supporting designs requiring greater computational capacity within the same physical footprint.

Moisture and Environmental Compliance: Both devices share MSL 3 (168 Hours) rating and REACH Unaffected status, maintaining equivalent handling and environmental compliance requirements.

Parameter Comparison

Parameter LFXP20E-5FN484C (Original) LFXP2-30E-5FN484C (Substitute)
Manufacturer Lattice Semiconductor Corporation Lattice Semiconductor Corporation
Series XP XP2
Logic Elements/Cells 20,000 29,000
Total RAM Bits 405,504 396,288
Number of I/O 340 363
Voltage Supply Range 1.14V ~ 1.26V 1.14V ~ 1.26V
Package / Case 484-BBGA 484-BBGA
Supplier Device Package 484-FPBGA (23x23) 484-FPBGA (23x23)
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
Product Status Obsolete Active
RoHS Status Not specified ROHS3 Compliant

Engineering Selection Recommendations

The LFXP2-30E-5FN484C is the qualified substitute for the obsolete LFXP20E-5FN484C. Selection is based on:

Product Status: The substitute is Active, ensuring long-term availability and manufacturing support, whereas the original is Obsolete.

Compliance Certification: The substitute carries ROHS3 Compliant status, meeting current environmental and regulatory requirements for new designs and procurement.

Physical and Electrical Compatibility: Identical package footprint, voltage supply range, operating temperature, and MSL rating enable direct replacement without system redesign.

Resource Enhancement: The substitute provides increased logic elements and I/O capacity within the same physical constraints, supporting design scalability without PCB modifications.

Frequently Asked Questions (FAQ)

Q: Can the LFXP2-30E-5FN484C replace the LFXP20E-5FN484C in existing designs?

A: Yes. Both devices share identical package geometry (484-FPBGA 23x23mm), voltage supply range (1.14V ~ 1.26V), operating temperature (0°C ~ 85°C TJ), and MSL rating (3). PCB-level replacement is direct without layout modifications.

Q: What are the key differences between these devices?

A: The substitute offers 45% more logic elements (29,000 vs. 20,000), 23 additional I/O pins (363 vs. 340), and Active product status versus Obsolete. RAM capacity is comparable (396,288 vs. 405,504 bits). The substitute includes ROHS3 compliance certification.

Q: Are there any electrical compatibility concerns?

A: No. Both devices operate at identical voltage supply range (1.14V ~ 1.26V) and temperature specifications (0°C ~ 85°C TJ), ensuring compatibility with existing power delivery and thermal management infrastructure.

Q: Does the increased I/O pin count affect PCB compatibility?

A: No. The additional 23 I/O pins are accommodated within the same 484-pin BGA package footprint. Existing pin assignments remain unchanged, and unused pins can be left unconnected.

Q: What is the significance of the Active product status for the substitute?

A: Active status ensures ongoing manufacturing availability, technical support, and supply chain continuity. This is critical for production designs and long-term system support, contrasting with the Obsolete status of the original device.

Q: Are moisture handling requirements identical?

A: Yes. Both devices carry MSL 3 (168 Hours) rating, requiring identical storage, handling, and reflow procedures.

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