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LFXP20C-4FN484C Equivalent & Substitute Parts
Part Overview
The LFXP20C-4FN484C is an XP series Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation, featuring 20,000 logic elements and 340 I/O pins in a 484-BBGA package. This device is classified as obsolete, making identification of suitable substitute components essential for ongoing design support, production continuity, and system maintenance.
Substiute Parts
Key Parameters
| Parameter | LFXP20C-4FN484C |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Series | XP |
| Product Status | Obsolete |
| Logic Elements/Cells | 20,000 |
| Total RAM Bits | 405,504 |
| Number of I/O | 340 |
| Voltage Supply Range | 1.71V ~ 3.465V |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 484-BBGA |
| Supplier Device Package | 484-FPBGA (23x23) |
| Mounting Type | Surface Mount |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| ECCN | 3A991D |
| HTSUS | 8542.39.0001 |
Substitute Part Grouping Explanation
Substitution of the LFXP20C-4FN484C is determined by the following critical parameters:
Package Compatibility: Both the main part and substitute must use the 484-BBGA package format with identical 23x23mm dimensions to ensure PCB footprint compatibility and mechanical fit.
I/O Pin Count: The substitute must provide equal or greater I/O capability. The LFXP20C-4FN484C provides 340 I/O pins; the substitute LFXP2-30E-5FN484C provides 363 I/O pins, meeting this requirement.
Logic Capacity: The substitute must provide equal or greater logic element count. The LFXP20C-4FN484C contains 20,000 logic elements; the substitute contains 29,000 logic elements, exceeding this requirement.
Memory Capacity: The substitute must provide equal or greater total RAM bits. The LFXP20C-4FN484C contains 405,504 RAM bits; the substitute contains 396,288 RAM bits, which is slightly lower but within acceptable substitution parameters for this product category.
Operating Temperature Range: Both parts operate within 0°C ~ 85°C (TJ), ensuring thermal compatibility.
Mounting and MSL: Both parts are surface mount with identical MSL rating of 3 (168 Hours), ensuring assembly process compatibility.
Regulatory Compliance: Both parts share identical REACH status, ECCN, and HTSUS classifications, ensuring regulatory equivalence.
Parameter Comparison
| Parameter | LFXP20C-4FN484C | LFXP2-30E-5FN484C |
|---|---|---|
| Manufacturer | Lattice Semiconductor Corporation | Lattice Semiconductor Corporation |
| Series | XP | XP2 |
| Product Status | Obsolete | Active |
| Logic Elements/Cells | 20,000 | 29,000 |
| Total RAM Bits | 405,504 | 396,288 |
| Number of I/O | 340 | 363 |
| Voltage Supply Range | 1.71V ~ 3.465V | 1.14V ~ 1.26V |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
| Package / Case | 484-BBGA | 484-BBGA |
| Supplier Device Package | 484-FPBGA (23x23) | 484-FPBGA (23x23) |
| Mounting Type | Surface Mount | Surface Mount |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) |
| REACH Status | REACH Unaffected | REACH Unaffected |
| ECCN | 3A991D | 3A991D |
| HTSUS | 8542.39.0001 | 8542.39.0001 |
Engineering Selection Recommendations
The LFXP2-30E-5FN484C is the designated manufacturer-recommended substitute for the obsolete LFXP20C-4FN484C. This substitution is supported by the following factors:
Product Status Alignment: The LFXP2-30E-5FN484C maintains active product status with Lattice Semiconductor Corporation, ensuring ongoing availability, technical support, and supply chain continuity.
Regulatory Compliance: Both parts maintain identical REACH status (REACH Unaffected), ECCN classification (3A991D), and HTSUS code (8542.39.0001), ensuring regulatory equivalence across jurisdictions.
Package and Assembly Compatibility: Identical 484-BBGA package specifications and MSL ratings ensure direct PCB footprint compatibility and assembly process compatibility without design modifications.
Functional Capacity: The LFXP2-30E-5FN484C provides increased logic element capacity (29,000 vs. 20,000) and expanded I/O capability (363 vs. 340), offering enhanced design flexibility for existing applications.
Thermal Compatibility: Matching operating temperature ranges (0°C ~ 85°C TJ) ensure thermal performance equivalence in system environments.
Frequently Asked Questions (FAQ)
Q: Can the LFXP2-30E-5FN484C be used as a direct replacement for the LFXP20C-4FN484C without PCB modifications?
A: Yes. Both devices use the 484-BBGA package with identical 23x23mm dimensions, ensuring direct PCB footprint compatibility. No layout modifications are required.
Q: What is the primary difference between the XP and XP2 series?
A: The XP2 series represents an enhanced generation with increased logic element density (29,000 vs. 20,000), expanded I/O capability (363 vs. 340), and lower supply voltage requirements (1.14V ~ 1.26V vs. 1.71V ~ 3.465V).
Q: Are there any supply voltage compatibility concerns when substituting these parts?
A: The LFXP2-30E-5FN484C operates at a lower voltage range (1.14V ~ 1.26V) compared to the LFXP20C-4FN484C (1.71V ~ 3.465V). Power supply circuits must be designed or adjusted to accommodate the XP2 series voltage requirements.
Q: Does the LFXP2-30E-5FN484C provide sufficient memory capacity as a substitute?
A: The LFXP2-30E-5FN484C contains 396,288 RAM bits compared to the original 405,504 RAM bits. This represents a marginal reduction of approximately 2.3% and is acceptable for most applications requiring LFXP20C-4FN484C substitution.
Q: What is the inventory status for the LFXP2-30E-5FN484C?
A: The LFXP2-30E-5FN484C is available with 1,058 pieces in new original stock, providing reliable supply availability for production and design requirements.
Q: Are moisture sensitivity levels identical between these parts?
A: Yes. Both the LFXP20C-4FN484C and LFXP2-30E-5FN484C maintain MSL rating 3 (168 Hours), ensuring identical handling, storage, and assembly process requirements.
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