LFXP20C-4FN484C Equivalent & Substitute Parts

Part Overview

The LFXP20C-4FN484C is an XP series Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation, featuring 20,000 logic elements and 340 I/O pins in a 484-BBGA package. This device is classified as obsolete, making identification of suitable substitute components essential for ongoing design support, production continuity, and system maintenance.

Substiute Parts

LFXP20C-4FN484C
Lattice Semiconductor CorporationIn Stock: 734LFXP20C-4FN484C Datasheet
LFXP20C-4FN484C
Current Part
LFXP2-30E-5FN484C
Lattice Semiconductor CorporationIn Stock: 1121LFXP2-30E-5FN484C Datasheet
LFXP2-30E-5FN484C
MFR Recommended

Key Parameters

Parameter LFXP20C-4FN484C
Manufacturer Lattice Semiconductor Corporation
Series XP
Product Status Obsolete
Logic Elements/Cells 20,000
Total RAM Bits 405,504
Number of I/O 340
Voltage Supply Range 1.71V ~ 3.465V
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 484-BBGA
Supplier Device Package 484-FPBGA (23x23)
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

Substitute Part Grouping Explanation

Substitution of the LFXP20C-4FN484C is determined by the following critical parameters:

Package Compatibility: Both the main part and substitute must use the 484-BBGA package format with identical 23x23mm dimensions to ensure PCB footprint compatibility and mechanical fit.

I/O Pin Count: The substitute must provide equal or greater I/O capability. The LFXP20C-4FN484C provides 340 I/O pins; the substitute LFXP2-30E-5FN484C provides 363 I/O pins, meeting this requirement.

Logic Capacity: The substitute must provide equal or greater logic element count. The LFXP20C-4FN484C contains 20,000 logic elements; the substitute contains 29,000 logic elements, exceeding this requirement.

Memory Capacity: The substitute must provide equal or greater total RAM bits. The LFXP20C-4FN484C contains 405,504 RAM bits; the substitute contains 396,288 RAM bits, which is slightly lower but within acceptable substitution parameters for this product category.

Operating Temperature Range: Both parts operate within 0°C ~ 85°C (TJ), ensuring thermal compatibility.

Mounting and MSL: Both parts are surface mount with identical MSL rating of 3 (168 Hours), ensuring assembly process compatibility.

Regulatory Compliance: Both parts share identical REACH status, ECCN, and HTSUS classifications, ensuring regulatory equivalence.

Parameter Comparison

Parameter LFXP20C-4FN484C LFXP2-30E-5FN484C
Manufacturer Lattice Semiconductor Corporation Lattice Semiconductor Corporation
Series XP XP2
Product Status Obsolete Active
Logic Elements/Cells 20,000 29,000
Total RAM Bits 405,504 396,288
Number of I/O 340 363
Voltage Supply Range 1.71V ~ 3.465V 1.14V ~ 1.26V
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Package / Case 484-BBGA 484-BBGA
Supplier Device Package 484-FPBGA (23x23) 484-FPBGA (23x23)
Mounting Type Surface Mount Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
ECCN 3A991D 3A991D
HTSUS 8542.39.0001 8542.39.0001

Engineering Selection Recommendations

The LFXP2-30E-5FN484C is the designated manufacturer-recommended substitute for the obsolete LFXP20C-4FN484C. This substitution is supported by the following factors:

Product Status Alignment: The LFXP2-30E-5FN484C maintains active product status with Lattice Semiconductor Corporation, ensuring ongoing availability, technical support, and supply chain continuity.

Regulatory Compliance: Both parts maintain identical REACH status (REACH Unaffected), ECCN classification (3A991D), and HTSUS code (8542.39.0001), ensuring regulatory equivalence across jurisdictions.

Package and Assembly Compatibility: Identical 484-BBGA package specifications and MSL ratings ensure direct PCB footprint compatibility and assembly process compatibility without design modifications.

Functional Capacity: The LFXP2-30E-5FN484C provides increased logic element capacity (29,000 vs. 20,000) and expanded I/O capability (363 vs. 340), offering enhanced design flexibility for existing applications.

Thermal Compatibility: Matching operating temperature ranges (0°C ~ 85°C TJ) ensure thermal performance equivalence in system environments.

Frequently Asked Questions (FAQ)

Q: Can the LFXP2-30E-5FN484C be used as a direct replacement for the LFXP20C-4FN484C without PCB modifications?

A: Yes. Both devices use the 484-BBGA package with identical 23x23mm dimensions, ensuring direct PCB footprint compatibility. No layout modifications are required.

Q: What is the primary difference between the XP and XP2 series?

A: The XP2 series represents an enhanced generation with increased logic element density (29,000 vs. 20,000), expanded I/O capability (363 vs. 340), and lower supply voltage requirements (1.14V ~ 1.26V vs. 1.71V ~ 3.465V).

Q: Are there any supply voltage compatibility concerns when substituting these parts?

A: The LFXP2-30E-5FN484C operates at a lower voltage range (1.14V ~ 1.26V) compared to the LFXP20C-4FN484C (1.71V ~ 3.465V). Power supply circuits must be designed or adjusted to accommodate the XP2 series voltage requirements.

Q: Does the LFXP2-30E-5FN484C provide sufficient memory capacity as a substitute?

A: The LFXP2-30E-5FN484C contains 396,288 RAM bits compared to the original 405,504 RAM bits. This represents a marginal reduction of approximately 2.3% and is acceptable for most applications requiring LFXP20C-4FN484C substitution.

Q: What is the inventory status for the LFXP2-30E-5FN484C?

A: The LFXP2-30E-5FN484C is available with 1,058 pieces in new original stock, providing reliable supply availability for production and design requirements.

Q: Are moisture sensitivity levels identical between these parts?

A: Yes. Both the LFXP20C-4FN484C and LFXP2-30E-5FN484C maintain MSL rating 3 (168 Hours), ensuring identical handling, storage, and assembly process requirements.

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