LFXP15C-5FN388C Equivalent & Substitute Parts

Part Overview

The LFXP15C-5FN388C is an XP series Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, featuring 268 I/O pins and 15,000 logic elements in a 388-BBGA package. This device is classified as obsolete, making identification of suitable substitute components essential for ongoing design support, production continuity, and system maintenance. The XP2 series successor provides enhanced capabilities while maintaining compatibility within the Lattice FPGA ecosystem.

Substiute Parts

LFXP15C-5FN388C

Lattice Semiconductor CorporationIn Stock: 984LFXP15C-5FN388C Datasheet

Current PartRFQ

LFXP2-17E-5FN484C

Lattice Semiconductor CorporationIn Stock: 1505LFXP2-17E-5FN484C Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the LFXP15C-5FN388C is determined by the following critical parameters:

• Logic Element Count: The substitute must provide equal or greater logic capacity (minimum 15,000 elements)
• I/O Pin Count: The substitute must support equal or greater I/O capability (minimum 268 pins)
• Memory Capacity: The substitute must provide equal or greater embedded RAM (minimum 331,776 bits)
• Package Type: The substitute must be compatible with surface mount assembly processes
• Operating Temperature Range: The substitute must support the required thermal operating window (0°C ~ 85°C)
• Supply Voltage Compatibility: The substitute must operate within acceptable voltage ranges for the application

The LFXP2-17E-5FN484C qualifies as a direct substitute based on superior specifications across all critical parameters while maintaining the same manufacturing process node and thermal characteristics.

Parameter Comparison

Engineering Selection Recommendations

The LFXP2-17E-5FN484C is the qualified substitute for the obsolete LFXP15C-5FN388C. Selection is based on the following factors:

• Product Status: The LFXP2-17E-5FN484C maintains active product status with ongoing manufacturer support, ensuring long-term availability and supply chain stability
• Regulatory Compliance: Both devices share identical REACH and ECCN classifications (3A991D), maintaining export and regulatory compliance
• Logic Capacity: The substitute provides 17,000 logic elements, exceeding the original 15,000-element requirement
• I/O Expansion: The substitute offers 358 I/O pins compared to the original 268 pins, providing additional design flexibility
• Thermal Compatibility: Both devices operate within the same temperature range (0°C ~ 85°C), ensuring thermal design compatibility
• Packaging: The 484-BBGA package accommodates the increased I/O count while maintaining surface mount assembly compatibility

Design migration requires PCB layout revision to accommodate the larger 484-BBGA package footprint and increased pin count. Firmware and HDL designs require validation against the XP2 architecture specifications.

Frequently Asked Questions (FAQ)

Q: Can the LFXP2-17E-5FN484C be used as a direct pin-for-pin replacement?

A: No. The LFXP2-17E-5FN484C uses a 484-BBGA package with 358 I/O pins, compared to the 388-BBGA package with 268 I/O pins in the original device. PCB layout redesign is required. Pin mapping must be re-evaluated during design migration.

Q: What are the key differences in electrical specifications?

A: The primary difference is supply voltage range. The LFXP15C-5FN388C operates at 1.71V ~ 3.465V, while the LFXP2-17E-5FN484C operates at 1.14V ~ 1.26V. Power supply design must be adjusted accordingly. Both devices maintain identical operating temperature ranges and moisture sensitivity levels.

Q: Is the LFXP2-17E-5FN484C suitable for applications requiring the exact I/O count of the original device?

A: Yes. The substitute provides 358 I/O pins, exceeding the original 268-pin requirement. Unused pins can be configured as no-connect (NC) during design implementation. The additional I/O capacity provides design margin and future expansion capability.

Q: Are there any compliance or regulatory considerations for substitution?

A: Both devices share identical REACH and ECCN classifications. No additional regulatory documentation is required for substitution. Moisture sensitivity levels are identical (MSL 3, 168 hours), maintaining handling and storage requirements.

Q: What design validation is required before production substitution?

A: HDL designs must be recompiled and validated against XP2 architecture specifications. Timing analysis must be re-performed on the new device. Power consumption estimates should be updated based on XP2 specifications. Thermal analysis should account for any changes in power dissipation.