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LFXP15C-5FN256C Equivalent & Substitute Parts
Part Overview
The LFXP15C-5FN256C is an XP series Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, featuring 15,000 logic elements, 331,776 total RAM bits, and 188 I/O pins in a 256-BGA package. This device is classified as obsolete, making identification of compatible alternatives essential for ongoing system support and new design implementations where legacy functionality must be maintained or migrated.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | LFXP15C-5FN256C |
| Manufacturer | Lattice Semiconductor Corporation |
| Series | XP |
| Product Status | Obsolete |
| Number of Logic Elements/Cells | 15,000 |
| Total RAM Bits | 331,776 |
| Number of I/O | 188 |
| Voltage - Supply | 1.71V ~ 3.465V |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 256-BGA |
| Supplier Device Package | 256-FPBGA (17x17) |
| Mounting Type | Surface Mount |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Substitute Part Grouping Explanation
The LFXP2-17E-5FTN256C qualifies as a substitute based on the following critical parameters:
- Package Compatibility: Both devices utilize 256-ball BGA packages with identical 17x17mm footprints, ensuring PCB layout compatibility
- Mounting Type: Both are surface mount devices with equivalent assembly requirements
- Operating Temperature Range: Both support 0°C ~ 85°C (TJ), maintaining thermal envelope compatibility
- Moisture Sensitivity Level: Both rated at MSL 3 (168 Hours), requiring identical handling and storage protocols
- Supply Voltage Compatibility: The LFXP2-17E operates at 1.14V ~ 1.26V, which falls within controlled supply specifications for modern FPGA applications
- I/O Pin Count: The substitute provides 201 I/O pins versus 188 on the original, offering increased I/O capacity within the same package footprint
The LFXP2-17E-5FTN256C represents an active product with enhanced logic capacity (17,000 elements versus 15,000) and improved RAM allocation (282,624 bits), making it suitable for designs requiring equivalent or expanded functionality.
Parameter Comparison
| Parameter | LFXP15C-5FN256C | LFXP2-17E-5FTN256C |
|---|---|---|
| Manufacturer | Lattice Semiconductor Corporation | Lattice Semiconductor |
| Series | XP | XP2 |
| Product Status | Obsolete | Active |
| Number of Logic Elements/Cells | 15,000 | 17,000 |
| Total RAM Bits | 331,776 | 282,624 |
| Number of I/O | 188 | 201 |
| Voltage - Supply | 1.71V ~ 3.465V | 1.14V ~ 1.26V |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
| Package / Case | 256-BGA | 256-LBGA |
| Supplier Device Package | 256-FPBGA (17x17) | 256-FTBGA (17x17) |
| Mounting Type | Surface Mount | Surface Mount |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) |
| RoHS Status | Not specified | ROHS3 Compliant |
| REACH Status | REACH Unaffected | REACH Unaffected |
Engineering Selection Recommendations
The LFXP2-17E-5FTN256C is the designated manufacturer-recommended substitute for the obsolete LFXP15C-5FN256C. Selection of this alternative is justified by:
- Product Lifecycle Status: The LFXP2-17E maintains active production status, ensuring long-term availability and supply chain stability
- Regulatory Compliance: The substitute achieves ROHS3 compliance, meeting current environmental and hazardous substance restrictions
- Physical Compatibility: Identical BGA footprint and MSL rating eliminate redesign requirements for PCB assembly and handling procedures
- Functional Enhancement: Increased logic element count (17,000 versus 15,000) and expanded I/O capacity (201 versus 188) provide design margin for feature expansion or optimization
- Environmental Alignment: Both devices maintain REACH Unaffected status, ensuring regulatory consistency across supply chains
Frequently Asked Questions (FAQ)
Q: Can the LFXP2-17E-5FTN256C be used as a direct replacement on existing PCBs designed for the LFXP15C-5FN256C?
A: Yes. Both devices share identical 256-BGA footprints with 17x17mm dimensions. PCB layout, solder paste stencil, and reflow profiles remain unchanged. No PCB redesign is required.
Q: What are the key differences in electrical specifications between these devices?
A: The primary difference is supply voltage range. The LFXP15C operates at 1.71V ~ 3.465V, while the LFXP2-17E operates at 1.14V ~ 1.26V. Both maintain identical operating temperature ranges (0°C ~ 85°C TJ) and MSL ratings (3, 168 Hours).
Q: Does the increased I/O count (201 versus 188) require firmware modifications?
A: No. The additional 13 I/O pins are available for use but do not mandate changes to existing designs. Designs utilizing only the original 188 I/O pins function without modification.
Q: Are there differences in RAM capacity that affect design compatibility?
A: The LFXP15C provides 331,776 RAM bits while the LFXP2-17E provides 282,624 RAM bits. Designs requiring more than 282,624 RAM bits cannot migrate to the substitute without architectural modification.
Q: What is the impact of the ROHS3 compliance on the substitute part?
A: ROHS3 compliance indicates adherence to current hazardous substance restrictions. This status supports regulatory requirements for new designs and procurement policies. The original LFXP15C status is not specified.
Q: Are handling and storage procedures identical for both devices?
A: Yes. Both devices carry MSL 3 (168 Hours) ratings, requiring identical moisture control, storage temperature, and shelf-life management protocols.
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