LFXP15C-5FN256C Equivalent & Substitute Parts

Part Overview

The LFXP15C-5FN256C is an XP series Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, featuring 15,000 logic elements, 331,776 total RAM bits, and 188 I/O pins in a 256-BGA package. This device is classified as obsolete, making identification of compatible alternatives essential for ongoing system support and new design implementations where legacy functionality must be maintained or migrated.

Substiute Parts

LFXP15C-5FN256C
Lattice Semiconductor CorporationIn Stock: 691LFXP15C-5FN256C Datasheet
LFXP15C-5FN256C
Current Part
LFXP2-17E-5FTN256C
Lattice SemiconductorIn Stock: 1658LFXP2-17E-5FTN256C Datasheet
LFXP2-17E-5FTN256C
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number LFXP15C-5FN256C
Manufacturer Lattice Semiconductor Corporation
Series XP
Product Status Obsolete
Number of Logic Elements/Cells 15,000
Total RAM Bits 331,776
Number of I/O 188
Voltage - Supply 1.71V ~ 3.465V
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

The LFXP2-17E-5FTN256C qualifies as a substitute based on the following critical parameters:

  • Package Compatibility: Both devices utilize 256-ball BGA packages with identical 17x17mm footprints, ensuring PCB layout compatibility
  • Mounting Type: Both are surface mount devices with equivalent assembly requirements
  • Operating Temperature Range: Both support 0°C ~ 85°C (TJ), maintaining thermal envelope compatibility
  • Moisture Sensitivity Level: Both rated at MSL 3 (168 Hours), requiring identical handling and storage protocols
  • Supply Voltage Compatibility: The LFXP2-17E operates at 1.14V ~ 1.26V, which falls within controlled supply specifications for modern FPGA applications
  • I/O Pin Count: The substitute provides 201 I/O pins versus 188 on the original, offering increased I/O capacity within the same package footprint

The LFXP2-17E-5FTN256C represents an active product with enhanced logic capacity (17,000 elements versus 15,000) and improved RAM allocation (282,624 bits), making it suitable for designs requiring equivalent or expanded functionality.

Parameter Comparison

Parameter LFXP15C-5FN256C LFXP2-17E-5FTN256C
Manufacturer Lattice Semiconductor Corporation Lattice Semiconductor
Series XP XP2
Product Status Obsolete Active
Number of Logic Elements/Cells 15,000 17,000
Total RAM Bits 331,776 282,624
Number of I/O 188 201
Voltage - Supply 1.71V ~ 3.465V 1.14V ~ 1.26V
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Package / Case 256-BGA 256-LBGA
Supplier Device Package 256-FPBGA (17x17) 256-FTBGA (17x17)
Mounting Type Surface Mount Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
RoHS Status Not specified ROHS3 Compliant
REACH Status REACH Unaffected REACH Unaffected

Engineering Selection Recommendations

The LFXP2-17E-5FTN256C is the designated manufacturer-recommended substitute for the obsolete LFXP15C-5FN256C. Selection of this alternative is justified by:

  • Product Lifecycle Status: The LFXP2-17E maintains active production status, ensuring long-term availability and supply chain stability
  • Regulatory Compliance: The substitute achieves ROHS3 compliance, meeting current environmental and hazardous substance restrictions
  • Physical Compatibility: Identical BGA footprint and MSL rating eliminate redesign requirements for PCB assembly and handling procedures
  • Functional Enhancement: Increased logic element count (17,000 versus 15,000) and expanded I/O capacity (201 versus 188) provide design margin for feature expansion or optimization
  • Environmental Alignment: Both devices maintain REACH Unaffected status, ensuring regulatory consistency across supply chains

Frequently Asked Questions (FAQ)

Q: Can the LFXP2-17E-5FTN256C be used as a direct replacement on existing PCBs designed for the LFXP15C-5FN256C?

A: Yes. Both devices share identical 256-BGA footprints with 17x17mm dimensions. PCB layout, solder paste stencil, and reflow profiles remain unchanged. No PCB redesign is required.

Q: What are the key differences in electrical specifications between these devices?

A: The primary difference is supply voltage range. The LFXP15C operates at 1.71V ~ 3.465V, while the LFXP2-17E operates at 1.14V ~ 1.26V. Both maintain identical operating temperature ranges (0°C ~ 85°C TJ) and MSL ratings (3, 168 Hours).

Q: Does the increased I/O count (201 versus 188) require firmware modifications?

A: No. The additional 13 I/O pins are available for use but do not mandate changes to existing designs. Designs utilizing only the original 188 I/O pins function without modification.

Q: Are there differences in RAM capacity that affect design compatibility?

A: The LFXP15C provides 331,776 RAM bits while the LFXP2-17E provides 282,624 RAM bits. Designs requiring more than 282,624 RAM bits cannot migrate to the substitute without architectural modification.

Q: What is the impact of the ROHS3 compliance on the substitute part?

A: ROHS3 compliance indicates adherence to current hazardous substance restrictions. This status supports regulatory requirements for new designs and procurement policies. The original LFXP15C status is not specified.

Q: Are handling and storage procedures identical for both devices?

A: Yes. Both devices carry MSL 3 (168 Hours) ratings, requiring identical moisture control, storage temperature, and shelf-life management protocols.

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