LFXP15C-4FN256C Equivalent & Substitute Parts

Part Overview

The LFXP15C-4FN256C is an XP series Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, featuring 188 I/O pins, 15,000 logic elements, and 331,776 total RAM bits in a 256-BGA package. This device is classified as obsolete, making identification of suitable substitute components essential for ongoing design support, production continuity, and system maintenance.

Substiute Parts

LFXP15C-4FN256C

Lattice Semiconductor CorporationIn Stock: 1557LFXP15C-4FN256C Datasheet

Current PartRFQ

LFXP2-17E-5FTN256C

Lattice SemiconductorIn Stock: 1658LFXP2-17E-5FTN256C Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the obsolete LFXP15C-4FN256C is determined by the following critical parameters:

Package Compatibility: Both the main part and substitute must use the same 256-BGA footprint (17x17mm) to ensure PCB-level compatibility without redesign.

Logic Capacity: The substitute must provide equal or greater logic element count (minimum 15,000 cells) to accommodate existing firmware and design complexity.

I/O Pin Count: The substitute must provide equal or greater I/O count (minimum 188 pins) to support all signal connections in the original design.

RAM Capacity: The substitute must provide equal or greater total RAM bits (minimum 331,776 bits) to maintain memory-dependent functionality.

Supply Voltage Range: The substitute must operate within or encompass the original supply voltage specification (1.71V ~ 3.465V) or be compatible with the system's power delivery architecture.

Mounting Type: Surface mount technology must be maintained for manufacturing process compatibility.

The LFXP2-17E-5FTN256C meets these substitution criteria through equivalent package geometry, superior logic capacity (17,000 elements), enhanced I/O capability (201 pins), and comparable RAM resources (282,624 bits).

Parameter Comparison

Engineering Selection Recommendations

The LFXP2-17E-5FTN256C is the designated manufacturer-recommended substitute for the obsolete LFXP15C-4FN256C. This substitution is supported by the following factors:

Product Status Transition: The LFXP2-17E-5FTN256C maintains active production status, ensuring long-term availability and supply chain stability compared to the obsolete LFXP15C-4FN256C.

Regulatory Compliance: The substitute achieves ROHS3 compliance, meeting current environmental and regulatory requirements for electronic components in most jurisdictions.

Functional Capacity: The substitute provides superior logic element density (17,000 vs. 15,000) and expanded I/O capability (201 vs. 188 pins), enabling equivalent or enhanced system functionality.

Package Geometry: Both devices utilize identical 256-BGA footprints (17x17mm), permitting direct PCB-level substitution without layout modifications.

Thermal Specification: Matching operating temperature range (0°C ~ 85°C) ensures thermal compatibility within the original system design envelope.

Supply Voltage Consideration: The substitute operates at a narrower voltage range (1.14V ~ 1.26V) compared to the main part (1.71V ~ 3.465V). System power delivery architecture must be verified to confirm compatibility with the substitute's lower voltage specification.

Frequently Asked Questions (FAQ)

Q: Can the LFXP2-17E-5FTN256C directly replace the LFXP15C-4FN256C without PCB redesign?

A: Yes, both devices use identical 256-BGA (17x17mm) package geometry. Direct PCB-level substitution is possible without layout modifications. However, the substitute's narrower supply voltage range (1.14V ~ 1.26V) requires verification of system power delivery compatibility.

Q: What are the key differences in logic capacity between these devices?

A: The LFXP2-17E-5FTN256C provides 17,000 logic elements compared to 15,000 in the LFXP15C-4FN256C, representing a 13% increase in programmable logic capacity. This enhancement supports more complex designs or additional functionality.

Q: How do the I/O pin counts compare?

A: The substitute provides 201 I/O pins versus 188 in the main part, offering 13 additional I/O connections. Existing designs utilizing 188 pins remain fully compatible, with additional pins available for expanded functionality.

Q: Are there RAM capacity differences that affect compatibility?

A: The main part provides 331,776 RAM bits while the substitute offers 282,624 bits, representing a 14.8% reduction. Designs dependent on maximum RAM capacity require verification that the substitute's RAM resources are sufficient for the application.

Q: What is the significance of the supply voltage range difference?

A: The LFXP15C-4FN256C operates at 1.71V ~ 3.465V, while the LFXP2-17E-5FTN256C operates at 1.14V ~ 1.26V. The substitute requires a more tightly regulated power supply. System power delivery architecture must be evaluated to ensure compatibility with the substitute's lower and narrower voltage specification.

Q: Does the substitute meet current environmental compliance standards?

A: Yes, the LFXP2-17E-5FTN256C is ROHS3 compliant, meeting current environmental regulations. The main part's compliance status is not specified.

Q: Are both devices available in the same packaging format?

A: Both use 256-BGA packages with identical 17x17mm footprints. The main part uses 256-FPBGA while the substitute uses 256-FTBGA, but both are mechanically and electrically compatible at the PCB level.