LFXP15C-3FN484I Equivalent & Substitute Parts

Part Overview

The LFXP15C-3FN484I is an XP series Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation. This device features 15,000 logic elements, 331,776 total RAM bits, and 300 I/O pins in a 484-BBGA package. The product is currently obsolete, making identification of compatible substitute components essential for ongoing system support, design updates, and procurement planning.

Substiute Parts

LFXP15C-3FN484I

Lattice Semiconductor CorporationIn Stock: 825LFXP15C-3FN484I Datasheet

Current PartRFQ

LFXP2-17E-5FN484I

Lattice Semiconductor CorporationIn Stock: 2086LFXP2-17E-5FN484I Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

The LFXP2-17E-5FN484I qualifies as a substitute for the LFXP15C-3FN484I based on the following substitution criteria:

Package Compatibility: Both devices use the 484-BBGA package format with identical 23x23mm physical dimensions, ensuring mechanical and thermal compatibility in existing PCB layouts.

I/O Pin Count: The substitute provides 358 I/O pins compared to the original 300 I/O pins, offering expanded I/O capacity while maintaining the same package footprint.

Logic Capacity: The LFXP2-17E-5FN484I contains 17,000 logic elements versus the original 15,000, providing increased functional density.

RAM Capacity: The substitute includes 282,624 total RAM bits compared to the original 331,776 bits.

Mounting and Thermal Characteristics: Both devices are surface-mount components with identical operating temperature ranges (-40°C ~ 100°C TJ) and MSL rating of 3 (168 Hours).

Series Progression: The LFXP2-17E-5FN484I represents an advancement within the Lattice FPGA product line, transitioning from the obsolete XP series to the active XP2 series.

Parameter Comparison

Engineering Selection Recommendations

The LFXP2-17E-5FN484I is the designated manufacturer-recommended substitute for the obsolete LFXP15C-3FN484I. Selection of this substitute is supported by the following factors:

Product Status Transition: The original LFXP15C-3FN484I is obsolete, while the LFXP2-17E-5FN484I maintains active product status with confirmed inventory availability (2,000 units in stock).

Regulatory Compliance: The substitute achieves ROHS3 compliance, meeting current environmental and regulatory requirements. Both devices maintain identical REACH Unaffected status and ECCN/HTSUS classifications.

Package and Thermal Compatibility: Identical 484-BBGA package specifications and operating temperature ranges ensure direct compatibility with existing thermal management and PCB assembly processes.

Functional Enhancement: The substitute provides increased logic capacity (17,000 vs. 15,000 elements) and expanded I/O capability (358 vs. 300 pins), enabling design flexibility for system upgrades or enhanced functionality.

Supply Chain Continuity: Active product status and substantial inventory levels ensure long-term availability and procurement reliability.

Frequently Asked Questions (FAQ)

Q: Can the LFXP2-17E-5FN484I be used as a direct replacement for the LFXP15C-3FN484I?

A: Yes. Both devices share identical 484-BBGA package specifications, physical dimensions (23x23mm), mounting type, and operating temperature ranges. The substitute provides enhanced logic capacity and I/O pin count within the same package footprint.

Q: What are the key differences between these two FPGA devices?

A: The primary differences are series designation (XP vs. XP2), logic element count (15,000 vs. 17,000), I/O pin count (300 vs. 358), total RAM bits (331,776 vs. 282,624), voltage supply range (1.71V-3.465V vs. 1.14V-1.26V), and product status (obsolete vs. active). Both maintain identical package, thermal, and MSL specifications.

Q: Are there voltage supply compatibility considerations?

A: The original device operates at 1.71V ~ 3.465V, while the substitute operates at 1.14V ~ 1.26V. Power supply design modifications may be required to accommodate the substitute's narrower voltage specification.

Q: Does the substitute maintain the same moisture sensitivity level?

A: Yes. Both devices are rated MSL 3 (168 Hours), requiring identical handling, storage, and reflow procedures.

Q: What is the significance of the ROHS3 compliance on the substitute?

A: ROHS3 compliance indicates the substitute meets current environmental regulations for hazardous substance restrictions, supporting compliance with modern procurement and environmental standards.

Q: Are the package dimensions identical between the two devices?

A: Yes. Both devices use the 484-FPBGA package with 23x23mm dimensions, ensuring compatibility with existing PCB layouts and assembly equipment.