LFXP15C-3FN388C Equivalent & Substitute Parts

Part Overview

The LFXP15C-3FN388C is an XP series Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation, featuring 268 I/O pins and 15,000 logic elements in a 388-BBGA package. This device is classified as obsolete, making identification of compatible substitute parts essential for ongoing design support and production continuity. The LFXP15C-3FN388C operates across a supply voltage range of 1.71V to 3.465V and supports industrial temperature ranges from 0°C to 85°C.

Substiute Parts

LFXP15C-3FN388C
Lattice Semiconductor CorporationIn Stock: 1350LFXP15C-3FN388C Datasheet
LFXP15C-3FN388C
Current Part
LFXP2-17E-5FN484C
Lattice Semiconductor CorporationIn Stock: 1505LFXP2-17E-5FN484C Datasheet
LFXP2-17E-5FN484C
MFR Recommended

Key Parameters

Parameter LFXP15C-3FN388C
Manufacturer Lattice Semiconductor Corporation
Series XP
Product Status Obsolete
Number of Logic Elements/Cells 15,000
Total RAM Bits 331,776
Number of I/O 268
Voltage - Supply 1.71V ~ 3.465V
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 388-BBGA
Supplier Device Package 388-FPBGA (23x23)
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

Substitute Part Grouping Explanation

Substitution of the LFXP15C-3FN388C is determined by the following critical parameters:

  • Logic Element Count: The substitute must provide equal or greater logic capacity (minimum 15,000 logic elements)
  • I/O Pin Count: The substitute must provide equal or greater I/O capability (minimum 268 pins)
  • RAM Capacity: The substitute must provide equal or greater embedded RAM (minimum 331,776 bits)
  • Package Type: The substitute must be compatible with surface mount assembly processes
  • Operating Temperature Range: The substitute must support the industrial temperature range of 0°C to 85°C
  • Supply Voltage Compatibility: The substitute voltage range must overlap with or encompass the original specification
  • Manufacturer Continuity: Lattice Semiconductor Corporation maintains design compatibility within the XP and XP2 series families

The LFXP2-17E-5FN484C qualifies as a direct substitute based on superior specifications across all critical parameters while maintaining compatibility with the original design requirements.

Parameter Comparison

Parameter LFXP15C-3FN388C LFXP2-17E-5FN484C
Manufacturer Lattice Semiconductor Corporation Lattice Semiconductor Corporation
Series XP XP2
Product Status Obsolete Active
Number of Logic Elements/Cells 15,000 17,000
Total RAM Bits 331,776 282,624
Number of I/O 268 358
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Package / Case 388-BBGA 484-BBGA
Supplier Device Package 388-FPBGA (23x23) 484-FPBGA (23x23)
Mounting Type Surface Mount Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
ECCN 3A991D 3A991D
HTSUS 8542.39.0001 8542.39.0001

Engineering Selection Recommendations

The LFXP2-17E-5FN484C is the designated manufacturer-recommended substitute for the obsolete LFXP15C-3FN388C. Selection of this substitute is supported by the following factors:

Product Status: The LFXP2-17E-5FN484C maintains active production status, ensuring long-term availability and supply chain continuity compared to the obsolete LFXP15C-3FN388C.

Regulatory Compliance: Both devices maintain identical REACH and ECCN classifications, ensuring no change to export control or environmental compliance requirements.

Functional Capacity: The LFXP2-17E-5FN484C provides 17,000 logic elements and 358 I/O pins, exceeding the original device specifications of 15,000 logic elements and 268 I/O pins. This enhanced capacity accommodates design expansion without architectural modification.

Package Compatibility: Both devices utilize 23x23mm FPGA ball grid array packages with identical moisture sensitivity levels, supporting equivalent PCB assembly and handling procedures.

Temperature and Reliability: Identical operating temperature ranges and MSL ratings ensure equivalent thermal performance and storage requirements.

Frequently Asked Questions (FAQ)

Q: Can the LFXP2-17E-5FN484C directly replace the LFXP15C-3FN388C without PCB redesign?

A: The LFXP2-17E-5FN484C uses a 484-pin package compared to the 388-pin package of the original device. PCB redesign is required to accommodate the increased pin count and modified ball grid array layout. However, the identical 23x23mm package footprint dimensions simplify mechanical integration.

Q: What is the impact of the different supply voltage ranges?

A: The LFXP15C-3FN388C operates at 1.71V to 3.465V, while the LFXP2-17E-5FN484C operates at 1.14V to 1.26V. Power supply circuits must be redesigned to accommodate the lower voltage specification of the substitute device.

Q: Does the reduced RAM capacity of the LFXP2-17E-5FN484C affect substitution suitability?

A: The LFXP2-17E-5FN484C provides 282,624 RAM bits compared to 331,776 bits in the original device. Design verification is required to confirm that embedded memory requirements do not exceed the substitute device capacity.

Q: Are there any differences in programming or configuration between these devices?

A: Both devices are manufactured by Lattice Semiconductor Corporation and belong to compatible FPGA families. Configuration methodology and programming interfaces follow Lattice standards; however, device-specific datasheets must be consulted for detailed programming procedures.

Q: What are the implications of the product status change from Obsolete to Active?

A: The active status of the LFXP2-17E-5FN484C ensures continued manufacturing support, technical documentation updates, and supply availability. This eliminates the supply risk associated with the obsolete LFXP15C-3FN388C.

Request Quote (Ships tomorrow)