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LFXP15C-3FN388C Equivalent & Substitute Parts
Part Overview
The LFXP15C-3FN388C is an XP series Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation, featuring 268 I/O pins and 15,000 logic elements in a 388-BBGA package. This device is classified as obsolete, making identification of compatible substitute parts essential for ongoing design support and production continuity. The LFXP15C-3FN388C operates across a supply voltage range of 1.71V to 3.465V and supports industrial temperature ranges from 0°C to 85°C.
Substiute Parts
Key Parameters
| Parameter | LFXP15C-3FN388C |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Series | XP |
| Product Status | Obsolete |
| Number of Logic Elements/Cells | 15,000 |
| Total RAM Bits | 331,776 |
| Number of I/O | 268 |
| Voltage - Supply | 1.71V ~ 3.465V |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 388-BBGA |
| Supplier Device Package | 388-FPBGA (23x23) |
| Mounting Type | Surface Mount |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| ECCN | 3A991D |
| HTSUS | 8542.39.0001 |
Substitute Part Grouping Explanation
Substitution of the LFXP15C-3FN388C is determined by the following critical parameters:
- Logic Element Count: The substitute must provide equal or greater logic capacity (minimum 15,000 logic elements)
- I/O Pin Count: The substitute must provide equal or greater I/O capability (minimum 268 pins)
- RAM Capacity: The substitute must provide equal or greater embedded RAM (minimum 331,776 bits)
- Package Type: The substitute must be compatible with surface mount assembly processes
- Operating Temperature Range: The substitute must support the industrial temperature range of 0°C to 85°C
- Supply Voltage Compatibility: The substitute voltage range must overlap with or encompass the original specification
- Manufacturer Continuity: Lattice Semiconductor Corporation maintains design compatibility within the XP and XP2 series families
The LFXP2-17E-5FN484C qualifies as a direct substitute based on superior specifications across all critical parameters while maintaining compatibility with the original design requirements.
Parameter Comparison
| Parameter | LFXP15C-3FN388C | LFXP2-17E-5FN484C |
|---|---|---|
| Manufacturer | Lattice Semiconductor Corporation | Lattice Semiconductor Corporation |
| Series | XP | XP2 |
| Product Status | Obsolete | Active |
| Number of Logic Elements/Cells | 15,000 | 17,000 |
| Total RAM Bits | 331,776 | 282,624 |
| Number of I/O | 268 | 358 |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
| Package / Case | 388-BBGA | 484-BBGA |
| Supplier Device Package | 388-FPBGA (23x23) | 484-FPBGA (23x23) |
| Mounting Type | Surface Mount | Surface Mount |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) |
| REACH Status | REACH Unaffected | REACH Unaffected |
| ECCN | 3A991D | 3A991D |
| HTSUS | 8542.39.0001 | 8542.39.0001 |
Engineering Selection Recommendations
The LFXP2-17E-5FN484C is the designated manufacturer-recommended substitute for the obsolete LFXP15C-3FN388C. Selection of this substitute is supported by the following factors:
Product Status: The LFXP2-17E-5FN484C maintains active production status, ensuring long-term availability and supply chain continuity compared to the obsolete LFXP15C-3FN388C.
Regulatory Compliance: Both devices maintain identical REACH and ECCN classifications, ensuring no change to export control or environmental compliance requirements.
Functional Capacity: The LFXP2-17E-5FN484C provides 17,000 logic elements and 358 I/O pins, exceeding the original device specifications of 15,000 logic elements and 268 I/O pins. This enhanced capacity accommodates design expansion without architectural modification.
Package Compatibility: Both devices utilize 23x23mm FPGA ball grid array packages with identical moisture sensitivity levels, supporting equivalent PCB assembly and handling procedures.
Temperature and Reliability: Identical operating temperature ranges and MSL ratings ensure equivalent thermal performance and storage requirements.
Frequently Asked Questions (FAQ)
Q: Can the LFXP2-17E-5FN484C directly replace the LFXP15C-3FN388C without PCB redesign?
A: The LFXP2-17E-5FN484C uses a 484-pin package compared to the 388-pin package of the original device. PCB redesign is required to accommodate the increased pin count and modified ball grid array layout. However, the identical 23x23mm package footprint dimensions simplify mechanical integration.
Q: What is the impact of the different supply voltage ranges?
A: The LFXP15C-3FN388C operates at 1.71V to 3.465V, while the LFXP2-17E-5FN484C operates at 1.14V to 1.26V. Power supply circuits must be redesigned to accommodate the lower voltage specification of the substitute device.
Q: Does the reduced RAM capacity of the LFXP2-17E-5FN484C affect substitution suitability?
A: The LFXP2-17E-5FN484C provides 282,624 RAM bits compared to 331,776 bits in the original device. Design verification is required to confirm that embedded memory requirements do not exceed the substitute device capacity.
Q: Are there any differences in programming or configuration between these devices?
A: Both devices are manufactured by Lattice Semiconductor Corporation and belong to compatible FPGA families. Configuration methodology and programming interfaces follow Lattice standards; however, device-specific datasheets must be consulted for detailed programming procedures.
Q: What are the implications of the product status change from Obsolete to Active?
A: The active status of the LFXP2-17E-5FN484C ensures continued manufacturing support, technical documentation updates, and supply availability. This eliminates the supply risk associated with the obsolete LFXP15C-3FN388C.
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