LFXP10E-4FN256C Equivalent & Substitute Parts

Part Overview

The LFXP10E-4FN256C is an XP series Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, featuring 10,000 logic elements, 221,184 total RAM bits, and 188 I/O pins in a 256-BGA package. This device is classified as obsolete, making identification of compatible substitute parts essential for ongoing system support and new design implementations where legacy compatibility is required.

Substiute Parts

LFXP10E-4FN256C

Lattice Semiconductor CorporationIn Stock: 1549LFXP10E-4FN256C Datasheet

Current PartRFQ

LFXP2-17E-5FTN256C

Lattice SemiconductorIn Stock: 1658LFXP2-17E-5FTN256C Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the LFXP10E-4FN256C is determined by the following critical parameters:

• Package Compatibility: Both main and substitute parts must use 256-pin BGA packaging with identical 17x17mm footprint dimensions to ensure PCB-level compatibility
• Supply Voltage: Identical voltage range (1.14V ~ 1.26V) ensures power delivery system compatibility without redesign
• Operating Temperature Range: Matching 0°C ~ 85°C specification maintains thermal performance requirements
• Mounting Type: Surface mount technology consistency across both parts
• Moisture Sensitivity Level: MSL 3 rating ensures equivalent handling and storage requirements

The LFXP2-17E-5FTN256C qualifies as a substitute based on these parameters. While it offers increased logic capacity (17,000 elements vs. 10,000), expanded I/O (201 vs. 188), and greater RAM (282,624 vs. 221,184 bits), these enhancements represent functional superset compatibility. The part maintains identical electrical specifications, package footprint, and environmental ratings.

Parameter Comparison

Engineering Selection Recommendations

The LFXP2-17E-5FTN256C is the qualified substitute for the obsolete LFXP10E-4FN256C based on the following factors:

Product Status: The substitute part maintains active production status, ensuring long-term availability and supply chain stability compared to the obsolete main part.

Regulatory Compliance: Both parts share identical REACH status (REACH Unaffected) and HTSUS classification (8542.39.0001), maintaining regulatory alignment. The substitute achieves ROHS3 compliance, providing enhanced environmental standards.

Electrical and Thermal Specifications: Matching supply voltage range (1.14V ~ 1.26V) and operating temperature (0°C ~ 85°C) eliminate the need for power delivery or thermal management redesign.

Package and Footprint: Both parts use 256-pin BGA packaging with identical 17x17mm footprint dimensions, enabling direct PCB-level substitution without layout modification.

Functional Capacity: The substitute provides increased logic elements, RAM, and I/O count, representing a functional superset that accommodates designs originally constrained by the main part's specifications.

Frequently Asked Questions (FAQ)

Q: Can the LFXP2-17E-5FTN256C be used as a direct replacement for the LFXP10E-4FN256C?

A: Yes, from a package and electrical standpoint. Both parts use 256-pin BGA packaging with identical 17x17mm footprint, matching supply voltage (1.14V ~ 1.26V), and identical operating temperature range (0°C ~ 85°C). PCB-level substitution requires no layout changes. However, design-level integration depends on firmware and HDL compatibility with the XP2 architecture.

Q: What are the key differences between these parts?

A: The LFXP2-17E-5FTN256C offers increased capacity: 17,000 logic elements versus 10,000, 282,624 RAM bits versus 221,184, and 201 I/O pins versus 188. The substitute represents a higher-capacity variant within the same package footprint and electrical specification envelope.

Q: Are the moisture sensitivity requirements identical?

A: Yes. Both parts carry MSL 3 rating with 168-hour floor life, requiring identical handling, storage, and reflow procedures.

Q: Does the substitute part require different power supply design?

A: No. Both parts operate within the identical 1.14V ~ 1.26V supply voltage range, eliminating the need for power delivery system modification.

Q: What is the significance of the package designation difference (256-FPBGA vs. 256-FTBGA)?

A: Both designations refer to 256-pin fine-pitch ball grid arrays with identical 17x17mm footprint dimensions. The letter variation indicates minor manufacturing process differences between XP and XP2 series, but PCB compatibility remains unchanged.

Q: Is the substitute part currently available?

A: Yes. The LFXP2-17E-5FTN256C maintains active product status with documented inventory availability, whereas the main part is obsolete.