LFXP10C-5FN388C Equivalent & Substitute Parts

Part Overview

The LFXP10C-5FN388C is an XP series Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, featuring 244 I/O pins and 10,000 logic elements in a 388-BBGA package. This device is classified as obsolete, making identification of suitable substitute components essential for ongoing design support, production continuity, and system maintenance. The XP2 series successor provides enhanced logic capacity and improved electrical characteristics while maintaining surface mount compatibility.

Substiute Parts

LFXP10C-5FN388C

Lattice Semiconductor CorporationIn Stock: 1273LFXP10C-5FN388C Datasheet

Current PartRFQ

LFXP2-17E-5FN484C

Lattice Semiconductor CorporationIn Stock: 1505LFXP2-17E-5FN484C Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the LFXP10C-5FN388C is determined by the following critical parameters:

Mounting Type: Both the original and substitute maintain surface mount configuration, ensuring PCB assembly compatibility without redesign.

Operating Temperature Range: The original device operates 0°C ~ 85°C (TJ). The substitute maintains this identical range, ensuring thermal performance equivalence in target applications.

Moisture Sensitivity Level: Both devices are classified as MSL 3 (168 Hours), requiring identical handling and storage protocols.

Supply Voltage Compatibility: The original operates at 1.71V ~ 3.465V. The substitute operates at 1.14V ~ 1.26V, representing a narrower, lower voltage specification suitable for modern low-power applications.

Logic Capacity and I/O Expansion: The substitute provides increased logic elements (17,000 vs. 10,000) and expanded I/O capability (358 vs. 244), enabling designs to scale functionality without architectural changes.

Package Form Factor: The substitute uses a 484-BBGA package (23x23mm), compared to the original 388-BBGA (23x23mm). Both maintain identical footprint dimensions, allowing direct PCB placement compatibility.

Regulatory Compliance: Both devices carry identical REACH and ECCN classifications, ensuring equivalent regulatory standing for export and supply chain purposes.

Parameter Comparison

Engineering Selection Recommendations

Product Status Consideration: The LFXP10C-5FN388C is classified as obsolete, while the LFXP2-17E-5FN484C is active. For new designs, production continuity, and long-term supply assurance, the active substitute is the appropriate selection.

Regulatory and Compliance Alignment: Both devices share identical REACH and ECCN classifications (3A991D), ensuring equivalent regulatory standing. The substitute maintains RoHS3 compliance, meeting current environmental standards.

Thermal and Handling Requirements: Identical operating temperature ranges (0°C ~ 85°C) and MSL ratings (3, 168 Hours) ensure that existing thermal management and moisture control protocols remain valid without modification.

Supply Chain Availability: Current inventory shows 1,445 units of the substitute in stock versus 1,178 units of the obsolete original, indicating superior long-term availability for procurement planning.

Frequently Asked Questions (FAQ)

Q: Can the LFXP2-17E-5FN484C be used as a direct replacement for the LFXP10C-5FN388C?

A: Direct PCB placement is possible due to identical package footprint dimensions (23x23mm). However, the substitute uses a 484-pin BGA versus the original 388-pin BGA, requiring pin mapping verification and potential firmware recompilation to utilize additional I/O resources.

Q: What are the key differences in electrical specifications?

A: The substitute operates at a narrower supply voltage range (1.14V ~ 1.26V) compared to the original (1.71V ~ 3.465V). Power supply design must be adjusted accordingly. The substitute provides 70% more logic elements (17,000 vs. 10,000) and 47% more I/O pins (358 vs. 244).

Q: Are moisture handling and storage requirements identical?

A: Yes. Both devices are MSL 3 rated for 168 hours, requiring identical bake-out procedures, storage conditions, and handling protocols.

Q: Does the substitute maintain the same thermal operating range?

A: Yes. Both devices operate across 0°C ~ 85°C (TJ), allowing existing thermal design and cooling strategies to remain unchanged.

Q: What is the significance of the package pin count difference?

A: The substitute provides 94 additional pins (484 vs. 388), enabling expanded I/O connectivity. PCB layout must accommodate the increased pin density, and design firmware must be updated to map signals to the new pin assignments.

Q: Are regulatory certifications equivalent?

A: Yes. Both devices carry identical REACH, ECCN (3A991D), and HTSUS classifications. The substitute adds RoHS3 compliance, meeting current environmental requirements.