LFXP10C-4FN388C Equivalent & Substitute Parts

Part Overview

The LFXP10C-4FN388C is an XP series Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation, featuring 244 I/O pins and 10,000 logic elements in a 388-BBGA package. This device is classified as obsolete, making identification of suitable substitute components essential for ongoing design support, production continuity, and system maintenance.

Substiute Parts

LFXP10C-4FN388C
Lattice Semiconductor CorporationIn Stock: 6534LFXP10C-4FN388C Datasheet
LFXP10C-4FN388C
Current Part
LFXP2-17E-5FN484C
Lattice Semiconductor CorporationIn Stock: 1505LFXP2-17E-5FN484C Datasheet
LFXP2-17E-5FN484C
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number LFXP10C-4FN388C
Manufacturer Lattice Semiconductor Corporation
Series XP
Product Status Obsolete
Number of Logic Elements/Cells 10,000
Total RAM Bits 221,184
Number of I/O 244
Voltage - Supply 1.71V ~ 3.465V
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 388-BBGA
Supplier Device Package 388-FPBGA (23x23)
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

Substitute Part Grouping Explanation

Substitution of the obsolete LFXP10C-4FN388C is determined by the following critical parameters:

Primary Substitution Criteria:

  • Manufacturer: Lattice Semiconductor Corporation (maintained)
  • Device Category: FPGA with programmable logic architecture
  • Mounting Type: Surface Mount (maintained)
  • Operating Temperature Range: 0°C ~ 85°C (TJ) (maintained)
  • Moisture Sensitivity Level: 3 (168 Hours) (maintained)
  • Regulatory Compliance: REACH Unaffected and ECCN 3A991D (maintained)

Functional Capacity Parameters:

  • Logic Elements/Cells: Minimum 10,000 (substitute must meet or exceed)
  • Total RAM Bits: Minimum 221,184 (substitute must meet or exceed)
  • Number of I/O: Minimum 244 (substitute must meet or exceed)

The LFXP2-17E-5FN484C qualifies as a direct substitute based on superior or equivalent performance across all critical parameters while maintaining compatibility with the original design envelope.

Parameter Comparison

Parameter LFXP10C-4FN388C (Main) LFXP2-17E-5FN484C (Substitute)
Manufacturer Lattice Semiconductor Corporation Lattice Semiconductor Corporation
Series XP XP2
Product Status Obsolete Active
Number of Logic Elements/Cells 10,000 17,000
Total RAM Bits 221,184 282,624
Number of I/O 244 358
Voltage - Supply 1.71V ~ 3.465V 1.14V ~ 1.26V
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Package / Case 388-BBGA 484-BBGA
Supplier Device Package 388-FPBGA (23x23) 484-FPBGA (23x23)
Mounting Type Surface Mount Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
ECCN 3A991D 3A991D
RoHS Status Not specified ROHS3 Compliant

Engineering Selection Recommendations

The LFXP2-17E-5FN484C is the designated substitute for the obsolete LFXP10C-4FN388C based on the following factors:

Product Status: The substitute is classified as Active, ensuring long-term availability and manufacturing support compared to the obsolete status of the original part.

Regulatory Compliance: Both devices maintain REACH Unaffected status and identical ECCN classification (3A991D), ensuring consistent regulatory treatment. The substitute achieves ROHS3 compliance, providing enhanced environmental compliance.

Functional Superiority: The substitute exceeds the original device across all functional metrics: 17,000 logic elements (versus 10,000), 282,624 RAM bits (versus 221,184), and 358 I/O pins (versus 244). This increased capacity provides design margin and future scalability.

Thermal and Mechanical Compatibility: Both devices operate within the identical temperature range (0°C ~ 85°C TJ) and maintain equivalent moisture sensitivity levels (MSL 3, 168 Hours). Both employ surface mount technology with 23x23mm footprints.

Package Consideration: The substitute uses a 484-BBGA package versus the original 388-BBGA. PCB layout modification is required to accommodate the increased pin count and package size.

Supply Voltage: The substitute operates at a narrower voltage range (1.14V ~ 1.26V) compared to the original (1.71V ~ 3.465V). Power supply design must be adjusted accordingly.

Frequently Asked Questions (FAQ)

Q: Can the LFXP2-17E-5FN484C be used as a direct pin-for-pin replacement?

A: No. While both devices are 23x23mm FPGA packages, the LFXP2-17E-5FN484C uses a 484-BBGA package with 484 pins compared to the 388-BBGA package with 388 pins in the original device. PCB redesign is required.

Q: What are the key differences in electrical specifications?

A: The primary difference is supply voltage. The LFXP10C-4FN388C operates at 1.71V ~ 3.465V, while the LFXP2-17E-5FN484C operates at 1.14V ~ 1.26V. Power delivery and voltage regulation circuits must be redesigned accordingly.

Q: Does the substitute provide sufficient logic capacity?

A: Yes. The LFXP2-17E-5FN484C provides 17,000 logic elements and 282,624 RAM bits, exceeding the original device's 10,000 logic elements and 221,184 RAM bits. This provides design margin for existing implementations.

Q: Are there any compliance or regulatory concerns with substitution?

A: No. Both devices maintain REACH Unaffected status and identical ECCN classification. The substitute achieves ROHS3 compliance, which is an improvement over the original specification.

Q: What is the impact of the increased I/O count?

A: The substitute provides 358 I/O pins versus 244 in the original device. This increased I/O capacity allows for expanded system connectivity but requires PCB layout modification to accommodate the larger package.

Q: Are both devices manufactured by the same company?

A: Yes. Both the LFXP10C-4FN388C and LFXP2-17E-5FN484C are manufactured by Lattice Semiconductor Corporation, ensuring consistent design methodology and support infrastructure.

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