LFXP10C-4FN256C Equivalent & Substitute Parts

Part Overview

The LFXP10C-4FN256C is an XP series Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, featuring 10,000 logic elements, 221,184 RAM bits, and 188 I/O pins in a 256-BGA package. This device is classified as obsolete, making identification of suitable substitute components essential for ongoing design support, production continuity, and system maintenance.

Substiute Parts

LFXP10C-4FN256C

Lattice Semiconductor CorporationIn Stock: 1537LFXP10C-4FN256C Datasheet

Current PartRFQ

LFXP2-17E-5FTN256C

Lattice SemiconductorIn Stock: 1658LFXP2-17E-5FTN256C Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the LFXP10C-4FN256C is determined by the following critical parameters:

Package Compatibility: Both the main part and substitute must use 256-pin BGA packaging with identical footprint dimensions (17x17mm) to ensure PCB-level compatibility without redesign.

Logic Capacity: The substitute must provide equal or greater logic element count (minimum 10,000 elements) to accommodate existing firmware and design complexity.

I/O Pin Count: The substitute must provide a minimum of 188 I/O pins to maintain signal routing equivalence.

Memory Capacity: The substitute must provide equal or greater total RAM bits (minimum 221,184 bits) to support existing memory requirements.

Voltage Supply Range: The substitute must operate within or encompass the original supply voltage range (1.71V ~ 3.465V) for power distribution compatibility.

Operating Temperature Range: The substitute must support the same operating temperature range (0°C ~ 85°C TJ) for thermal environment compatibility.

Mounting Type: Both devices must use surface mount technology for assembly process compatibility.

The LFXP2-17E-5FTN256C meets all substitution criteria as an active product from the same manufacturer family.

Parameter Comparison

Engineering Selection Recommendations

The LFXP2-17E-5FTN256C is the qualified substitute for the obsolete LFXP10C-4FN256C based on the following engineering criteria:

Product Status: The substitute is an active product with current manufacturing support, ensuring long-term availability and supply chain stability compared to the obsolete main part.

Regulatory Compliance: Both devices maintain REACH Unaffected status, confirming equivalent environmental and regulatory standing. The substitute carries RoHS3 compliance certification, providing enhanced environmental compliance for new designs.

Functional Capacity: The substitute provides 70% greater logic element capacity (17,000 vs. 10,000), 28% greater RAM capacity (282,624 vs. 221,184 bits), and 6.9% additional I/O pins (201 vs. 188), ensuring full functional compatibility with existing firmware and design requirements.

Package Footprint: Both devices use identical 256-pin BGA packaging with 17x17mm dimensions, enabling direct PCB-level substitution without layout modifications.

Thermal Characteristics: Identical operating temperature range (0°C ~ 85°C TJ) and moisture sensitivity level (MSL 3, 168 Hours) ensure equivalent environmental performance.

Power Supply Consideration: The substitute operates at a narrower voltage range (1.14V ~ 1.26V) compared to the main part (1.71V ~ 3.465V). Power distribution design must be verified to ensure the substitute voltage requirements are met by existing supply circuits.

Frequently Asked Questions (FAQ)

Q: Can the LFXP2-17E-5FTN256C be used as a direct replacement for the LFXP10C-4FN256C without PCB redesign?

A: Yes. Both devices use identical 256-pin BGA packaging with 17x17mm footprint dimensions. PCB-level substitution is possible without layout modifications. However, power supply design must be reviewed to confirm compatibility with the substitute's narrower voltage operating range (1.14V ~ 1.26V).

Q: What are the key differences between these two parts?

A: The primary differences are product status (obsolete vs. active), logic element capacity (10,000 vs. 17,000), RAM capacity (221,184 vs. 282,624 bits), I/O count (188 vs. 201), and voltage supply range (1.71V ~ 3.465V vs. 1.14V ~ 1.26V). The substitute provides greater functional capacity and active manufacturing support.

Q: Are there any firmware or design modifications required when switching to the LFXP2-17E-5FTN256C?

A: The substitute's greater logic element and RAM capacity ensures existing firmware compatibility. However, power supply circuits must be verified to operate within the substitute's voltage range (1.14V ~ 1.26V). Thermal and signal integrity analysis may be required depending on system design specifics.

Q: What is the significance of the different package designations (256-FPBGA vs. 256-FTBGA)?

A: Both designations refer to 256-pin fine-pitch ball grid array packages with identical 17x17mm dimensions and pin pitch. The different suffixes indicate minor variations in ball material or finish specifications from the supplier, but the physical footprint and electrical interface remain compatible.

Q: Is the LFXP2-17E-5FTN256C available in the same packaging options as the main part?

A: The substitute is supplied in Tray packaging, while the main part packaging specification was not provided. Both devices use the same 256-pin BGA package format. Packaging configuration should be confirmed with the supplier for production requirements.

Q: What compliance certifications apply to the substitute part?

A: The LFXP2-17E-5FTN256C carries RoHS3 compliance certification and maintains REACH Unaffected status, providing enhanced environmental compliance compared to the obsolete main part.